公开(公告)号：WO2022106296A2

公开(公告)日：2022-05-27

申请号：PCT/EP2021/081405

申请日：2021-11-11

Applicant: AT&S AUSTRIA TECHNOLOGIE & SYSTEMTECHNIK AKTIENGESELLSCHAFT

Inventor： TRISCHLER, Heinrich ,  SCHLAFFER, Erich ,  LEITGEB, Markus ,  SATTLER, Sebastian ,  PRESSLER, Simon

IPC: H05K1/02 ,  H05K3/00 ,  H05K3/46 ,  H05K1/0237 ,  H05K2201/037 ,  H05K2201/09036 ,  H05K2201/09981 ,  H05K2201/09985 ,  H05K2201/10098 ,  H05K2203/107 ,  H05K2203/308 ,  H05K3/0026 ,  H05K3/4697

Abstract: Component carrier (100) which comprises a stack (102) comprising at least one electrically conductive layer structure (41) and at least one electrically insulating layer structure (40), and a recess (43), in particular a cavity, being at least partially formed in the stack (102), optionally having an electrically conductive coating (44), and being configured as waveguide, wherein a plurality of edges (67) delimiting the recess (43) are formed by electrically conductive material of the at least one electrically conductive layer structure (41) and/or of the optional electrically conductive coating (44).

公开(公告)号：WO2021194665A1

公开(公告)日：2021-09-30

申请号：PCT/US2021/018704

申请日：2021-02-19

Applicant: BATTELLE MEMORIAL INSTITUTE

Inventor： SCHIMMOELLER, Andrew, M. ,  FRIEND, Jeffrey, A.

IPC: H05K3/36 ,  H05K1/11 ,  H05K1/18 ,  H01R12/52 ,  H01R12/62 ,  H05K1/111 ,  H05K1/117 ,  H05K1/118 ,  H05K1/185 ,  H05K2201/09036 ,  H05K2201/09063 ,  H05K2201/09445 ,  H05K2201/09472 ,  H05K2201/2027 ,  H05K2203/041 ,  H05K2203/167 ,  H05K3/363 ,  H05K3/366

Abstract: A printed circuit board connector for orthogonal mating of two or more printed circuit boards. The connector utilizes interior perimeter trace connections of a main printed circuit board and internal trace connections of a mating printed circuit board in conjunction with external trace connections. The main board may utilize surface connections, where both external trace connections and internal trace connections are exposed on a surface of the main board to couple to the mating board. The main board may include a slot or pocket, allowing for the partial insertion of the mating board into the main board, with internal trace connections disposed within the slot or pocket. The slot or pocket may extend through the main board, such that the internal trace connections are disposed along a side of the pocket to couple with corresponding internal trace connections of the mating board.

公开(公告)号：WO2022122470A2

公开(公告)日：2022-06-16

申请号：PCT/EP2021/083542

申请日：2021-11-30

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION ,  IBM UNITED KINGDOM LIMITED

Inventor： ZHANG, Hongqing ,  HIGBY, Arthur ,  LEWISON, David ,  BUCHLING, Philipp ,  BUNT, Jay ,  BUSBY, James ,  CAMPBELL, Levi

IPC: G06F21/75 ,  G06F21/86 ,  H05K1/02 ,  H01L23/00 ,  F28F13/003 ,  G06F2221/2143 ,  G08B21/18 ,  H01L23/367 ,  H01L23/3733 ,  H01L23/433 ,  H01L23/57 ,  H05K1/0275 ,  H05K2201/0338 ,  H05K2201/0341 ,  H05K2201/09036 ,  H05K2201/09263 ,  H05K2201/09672 ,  H05K2201/10151 ,  H05K2201/10371 ,  H05K3/4647 ,  H05K7/20409 ,  H05K7/20445

Abstract: Tamper-respondent assemblies are provided which include a circuit board, an enclosure assembly mounted to the circuit board, and a pressure sensor. The circuit board includes an electronic component, and the enclosure assembly is mounted to the circuit board to enclose the electronic component within a secure volume. The enclosure assembly includes a thermally conductive enclosure with a sealed inner compartment, and a porous heat transfer element within the sealed inner compartment. The porous heat transfer element is sized and located to facilitate conducting heat from the electronic component across the sealed inner compartment of the thermally conductive enclosure. The pressure sensor senses pressure within the sealed inner compartment of the thermally conductive enclosure to facilitate identifying a pressure change indicative of a tamper event.