公开(公告)号：WO2021148781A1

公开(公告)日：2021-07-29

申请号：PCT/GB2021/050114

申请日：2021-01-19

Applicant: PREVAYL LIMITED

Inventor： LYNCH, Michael John

IPC: H05K1/16 ,  H05K1/14 ,  A41D1/00 ,  A41D13/12 ,  G06K19/077 ,  H05K1/03 ,  H05K3/40 ,  G06K19/07758 ,  G06K19/07767 ,  H05K1/038 ,  H05K1/144 ,  H05K1/165 ,  H05K2201/09027 ,  H05K2201/09063 ,  H05K2201/0999 ,  H05K2201/10098 ,  H05K2201/10106 ,  H05K2201/10151 ,  H05K3/4092

Abstract: An electronics module (200) for a wearable article (300). The electronics module (200) comprises a controller configured to process signals received from a sensing component of the wearable article (300). The electronics module (200) comprises a power source, coupled to the controller, and arranged to supply power to the controller. The electronics module (200) comprises a printed circuit board structure (100). The printed circuit board structure (100) comprises a printed circuit board (101) and an antenna unit provided on the printed circuit board (101). The antenna unit comprising a first antenna (107) and a second antenna (109). The electronics module comprises a housing arranged to house the controller, power source, and printed circuit board structure. The first antenna (107) is arranged to wirelessly receive signals from the sensing component of the wearable article (300) and provide the same to the controller.

公开(公告)号：WO2021194665A1

公开(公告)日：2021-09-30

申请号：PCT/US2021/018704

申请日：2021-02-19

Applicant: BATTELLE MEMORIAL INSTITUTE

Inventor： SCHIMMOELLER, Andrew, M. ,  FRIEND, Jeffrey, A.

IPC: H05K3/36 ,  H05K1/11 ,  H05K1/18 ,  H01R12/52 ,  H01R12/62 ,  H05K1/111 ,  H05K1/117 ,  H05K1/118 ,  H05K1/185 ,  H05K2201/09036 ,  H05K2201/09063 ,  H05K2201/09445 ,  H05K2201/09472 ,  H05K2201/2027 ,  H05K2203/041 ,  H05K2203/167 ,  H05K3/363 ,  H05K3/366

Abstract: A printed circuit board connector for orthogonal mating of two or more printed circuit boards. The connector utilizes interior perimeter trace connections of a main printed circuit board and internal trace connections of a mating printed circuit board in conjunction with external trace connections. The main board may utilize surface connections, where both external trace connections and internal trace connections are exposed on a surface of the main board to couple to the mating board. The main board may include a slot or pocket, allowing for the partial insertion of the mating board into the main board, with internal trace connections disposed within the slot or pocket. The slot or pocket may extend through the main board, such that the internal trace connections are disposed along a side of the pocket to couple with corresponding internal trace connections of the mating board.

公开(公告)号：WO2021197921A1

公开(公告)日：2021-10-07

申请号：PCT/EP2021/057404

申请日：2021-03-23

Applicant: SMA SOLAR TECHNOLOGY AG

Inventor： MUEHLHAUSEN, Felix ,  BUTTERWECK, Simon

IPC: G01K1/143 ,  G01R1/20 ,  G01R19/32 ,  H05K1/02 ,  G01R1/44 ,  G01R1/203 ,  H05K1/0204 ,  H05K1/0278 ,  H05K1/119 ,  H05K1/181 ,  H05K2201/09045 ,  H05K2201/09063 ,  H05K2201/09081 ,  H05K2201/09136 ,  H05K2201/10022 ,  H05K2201/10151

Abstract: Es wird eine Vorrichtung zur Temperaturmessung mit einer Leiterplatte (2) und einem Temperaturfühler (3) beschrieben, wobei die Leiterplatte (2) eine Ausfräsung (4) aufweist, die im Wesentlichen spiralförmig um den Temperaturfühler (3) verläuft, sodass der Temperaturfühler (3) parallel zum Normalenvektor der Ebene der Leiterplatte (2) verschiebbar ist und bei einer Verschiebung des Temperaturfühlers (3) gegenüber der Ebene der Leiterplatte (2) eine Rückstellkraft zwischen der Leiterplatte (2) und dem Temperaturfühler (3) wirkt. Die Vorrichtung kann insbesondere Teil einer Stromermittlungsvorrichtung über einen Shunt sein und dessen Temperatur bestimmen. Weiterhin beschrieben ist ein Leistungswandler mit einer solchen Vorrichtung.

公开(公告)号：WO2022006401A1

公开(公告)日：2022-01-06

申请号：PCT/US2021/040096

申请日：2021-07-01

Applicant: BOSE CORPORATION

Inventor： PARKER, Robert, Preston ,  NILSEN, Thomas, Aquinas

IPC: H04R1/10 ,  G06F3/0354 ,  H03K17/96 ,  H03K17/962 ,  H03K2017/9602 ,  H03K2217/960755 ,  H04R1/1041 ,  H05K1/028 ,  H05K2201/09063 ,  H05K2201/0999 ,  H05K3/0058

Abstract: Various aspects include audio devices with a capacitive sensing interface along a compound curved wall. Some aspects of the disclosure relate to wearable audio devices with a capacitive sensing interface and a flexible printed circuit board (PCB) for detecting a touch command at the interface. In certain cases, the flexible PCB has at least one slit for conforming to the compound curve of the wall. In additional implementations, the inner surface of the wall is faceted and the flexible PCB conforms to the facets in the wall.

公开(公告)号：WO2021249852A1

公开(公告)日：2021-12-16

申请号：PCT/EP2021/064878

申请日：2021-06-02

Applicant: GKN SINTER METALS ENGINEERING GMBH

Inventor： TILLER, Stefan ,  ANDREE, Maurice ,  TO, Hong Giang

IPC: H02K21/24 ,  H05K1/02 ,  H02K3/52 ,  H02K2201/03 ,  H02K2203/03 ,  H02K2211/03 ,  H02K3/522 ,  H05K1/0298 ,  H05K1/165 ,  H05K1/18 ,  H05K2201/09027 ,  H05K2201/09063 ,  H05K2201/1009

Abstract: Elektrischer Motor (1), zumindest aufweisend einen Stator (2) und einen ringförmigen Rotor (3), die entlang einer axialen Richtung (4) nebeneinander angeordnet sind; wobei der Stator (2) eine Mehrzahl von, entlang einer Umfangsrichtung (5) nebeneinander angeordneten und sich jeweils entlang der axialen Richtung (4) erstreckenden, Statorzähnen (6) aufweist; wobei an jedem Statorzahn (6) zumindest eine Spule (7) mit mindestens einer Windung (8) angeordnet ist; wobei die mindestens eine Windung (8) elektrisch leitend mit einer Leiterplatte (9) verbunden ist, wobei die Leiterplatte (9) an einer Stirnseite (10) des Stators (2) und entlang der axialen Richtung (4) neben dem Stator (2) angeordnet ist, wobei die Leiterplatte (9) eine Mehrzahl von elektrischen Verbindungsleitungen (11) umfasst, über die die mindestens eine Windung (8) jeder Spule (7) zumindest mit anderen Windungen (8) oder mit einem elektrischen Anschluss (12, 13) des Motors (1) verbunden ist.

公开(公告)号：WO2021224559A2

公开(公告)日：2021-11-11

申请号：PCT/FR2021/050709

申请日：2021-04-23

Applicant: MBDA FRANCE

Inventor： GAZZANO, Charlotte ,  RAFRAY, Guilhem

IPC: H01F27/28 ,  H05K1/14 ,  H01F2027/2809 ,  H01F2027/2819 ,  H01F27/2804 ,  H05K1/141 ,  H05K1/144 ,  H05K1/165 ,  H05K2201/041 ,  H05K2201/086 ,  H05K2201/09063 ,  H05K2201/09072 ,  H05K2201/09181 ,  H05K3/3405

Abstract: Carte mère comportant un circuit imprimé (8) dit de carte mère et au moins un transformateur planaire (1 ) qui est monté sur ce circuit imprimé (8) de carte mère, ainsi qu'une pluralité de composants électroniques (10) qui sont également montés sur le circuit imprimé (8) de carte mère, le transformateur planaire (1) comportant au moins un circuit imprimé (3) pourvu de spires et d´une interface de connexion (4), ainsi qu´un noyau magnétique (5) agencé sur le circuit Imprimé (3) de manière à coopérer avec les spires, le transformateur planaire (1) comportant, de plus, au moins un composant électronique (6) monté sur le circuit imprimé (3).

公开(公告)号：WO2022220688A2

公开(公告)日：2022-10-20

申请号：PCT/NL2022/050492

申请日：2022-08-29

Applicant: NEDERLANDSE ORGANISATIE VOOR TOEGEPAST-NATUURWETENSCHAPPELIJK ONDERZOEK TNO

Inventor： HARKEMA, Stephan ,  TEUNISSEN, Jean-Pierre ,  RENTROP, Cornelis Hermanus Arnoldus ,  DE KOK, Margaretha Maria

IPC: H05K3/22 ,  H05K3/28 ,  H05K1/0284 ,  H05K1/0393 ,  H05K1/119 ,  H05K2201/0108 ,  H05K2201/0112 ,  H05K2201/09063 ,  H05K2201/09936 ,  H05K2201/10106 ,  H05K2201/10113 ,  H05K2201/10128 ,  H05K2201/2072 ,  H05K2203/074 ,  H05K2203/0746 ,  H05K2203/0763 ,  H05K2203/0783 ,  H05K2203/1316 ,  H05K2203/1322 ,  H05K2203/1327 ,  H05K2203/176 ,  H05K2203/178 ,  H05K3/0014 ,  H05K3/284

Abstract: An electronic device (100) is designed to be more easily recycled at its end of life while maintaining usability during its lifetime. The electronic device comprises a first substrate (11), an encapsulation layer (19), and a set of electronics (15) disposed there between. One or more delamination layers (12,18) cover at least one side, preferably both sides, of the set of electronics (15) to separate the set of electronics (15) from at least one, preferably both, of the first substrate (11) and the encapsulation layer (19). The set of electronics (15), covered by the one or more delamination layers (12,18), is encapsulated between the encapsulation layer (19) and the first substrate (11). At least one of the delamination layers (12,18) comprises a set of passages (12p,18p) filled with material of the encapsulation layer (19) forming a set of interconnections (19p) between the encapsulation layer (19) and the first substrate (11).

公开(公告)号：WO2022112148A2

公开(公告)日：2022-06-02

申请号：PCT/EP2021/082431

申请日：2021-11-22

Applicant: VALEO VISION

Inventor： ROBICHON, Mathieu

IPC: H05K3/32 ,  H05K1/11 ,  F21S41/19 ,  H05K1/18 ,  H01R12/70 ,  H01R12/72 ,  H01R12/75 ,  F21S41/192 ,  H01R12/7017 ,  H01R12/721 ,  H01R2201/26 ,  H05K1/117 ,  H05K2201/09063 ,  H05K2201/09145 ,  H05K2201/10106 ,  H05K2201/10189 ,  H05K2201/10446 ,  H05K2201/1059 ,  H05K3/326

Abstract: The invention provides an electrical connection module for an automotive vehicle (100), comprising a printed circuit board (1) with a retainer portion (2) and an edge connector configured to be connected to the printed circuit board. The retainer portion (2) comprises an electric connection (5) located in a recess (4) of the printed circuit board (1), and the edge connector (3) comprises jaws (6, 7) intended to be coupled with the electric connection when entering the recess (4). The edge connector (3) further comprises a back portion (8), where the electric arm (6) and the support arm (7) protrude from; and the retainer portion (2) comprises two retaining arms (9), each retaining arm (9) protruding from the printed circuit board (1) towards the electric connection (5) in a protruding direction which forms between 5 and 40 degrees with respect to the connection direction (d), and leaving a space between them which is smaller than the width of the back portion (8) of the edge connector (3).

公开(公告)号：WO2021243225A8

公开(公告)日：2021-12-02

申请号：PCT/US2021/034882

申请日：2021-05-28

Applicant: FORMFACTOR, INC.

Inventor： HENSON, Roy J. ,  POWELL, Shawn O.

IPC: H01L21/04 ,  H01L21/48 ,  H01L23/488 ,  H01L23/495 ,  H01L23/498 ,  H01L29/66 ,  H01L23/13 ,  H01L23/49805 ,  H01L23/5384 ,  H01L23/5385 ,  H01L25/0652 ,  H01R12/523 ,  H05K1/141 ,  H05K1/181 ,  H05K2201/09063 ,  H05K2201/10303 ,  H05K2201/1034 ,  H05K2201/10378 ,  H05K2201/10454 ,  H05K2201/10522 ,  H05K2201/1053 ,  H05K2201/1059 ,  H05K2201/10606 ,  H05K2201/10734 ,  H05K2201/2036 ,  H05K2203/041 ,  H05K3/325 ,  H05K3/3405 ,  H05K3/366 ,  H05K3/368

Abstract: 3D electrical integration is provided by connecting several component carriers to a single substrate using contacts at the edges of the component carriers making contact to a 2D contact array (e.g., a ball grid array or the like) on the substrate. The resulting integration of components on the component carriers is 3D, thereby providing much higher integration density than in 2D approaches.

公开(公告)号：WO2021140310A1

公开(公告)日：2021-07-15

申请号：PCT/GB2020/053172

申请日：2020-12-11

Applicant: CANTOR TECHNOLOGIES LTD.

Inventor： YIP, Jimmy Gin Men

IPC: H05K1/11 ,  H05K3/00 ,  H05K3/40 ,  H05K3/06 ,  H05K3/42 ,  H05K1/115 ,  H05K2201/09063 ,  H05K2201/0959 ,  H05K2201/09645 ,  H05K2203/0769 ,  H05K2203/1461 ,  H05K2203/1476 ,  H05K2203/175 ,  H05K2203/308 ,  H05K3/0047 ,  H05K3/403 ,  H05K3/429

Abstract: A substrate is provided comprising: a through-hole via, the through-hole via comprising a primary hole defined by an inner surface and having an axis, the through-hole via extending through at least a portion of the substrate; wherein the inner surface is provided with at least two separate conductive tracks such that the through-hole via is divided to form at least two separate signal paths for transmission of signals from one part of the substrate to another; and wherein each conductive track is electrically isolated from the other conductive track(s).