公开(公告)号：WO2021122127A1

公开(公告)日：2021-06-24

申请号：PCT/EP2020/084979

申请日：2020-12-08

Applicant: KNOWLEDGE DEVELOPMENT FOR POF, S.L.

Inventor： ORTIZ ROJO, David ,  JESÚS PINZÓN, Plinio ,  PÉREZ ARANDA, Rubén ,  PARDO VIDAL, Carlos ,  DITTMANN, Markus

IPC: G02B6/42 ,  H05K1/02 ,  G02B6/38 ,  G02B6/3897 ,  G02B6/4232 ,  G02B6/4246 ,  G02B6/426 ,  H05K1/0219 ,  H05K1/0274 ,  H05K2201/0707 ,  H05K2201/09354 ,  H05K2201/09618 ,  H05K2201/09809 ,  H05K2201/10121 ,  H05K2201/2054

Abstract: 22 Abstract Fiber optic connector The invention relates to a casing (100) for housing a fiber optic transceiver for use in a fiber optic connector, the casing comprising a top surface (101), a bottom surface (105) and one or more lateral surfaces (102a, 102b, 102c, 102d), wherein the top surface (101) and at least one or more lateral surfaces (102a, 102b, 102c, 102d) are at least in parts electrically conductive, and wherein the bottom surface (105) of the casing (100) comprises one or more solder pads (207, 208, 209, 210). (Fig.1a)

公开(公告)号：WO2021148987A1

公开(公告)日：2021-07-29

申请号：PCT/IB2021/050473

申请日：2021-01-21

Applicant: TELEFONAKTIEBOLAGET LM ERICSSON (PUBL)

Inventor： DA SILVEIRA, Martin ,  MCGOWAN, Neil ,  MARION, Francis

IPC: H05K3/34 ,  H05K1/11 ,  H01R4/02 ,  H01R4/60 ,  H01R12/58 ,  H01R12/53 ,  H05K1/02 ,  H01R9/0515 ,  H05K1/0215 ,  H05K1/0219 ,  H05K1/0228 ,  H05K1/0251 ,  H05K1/0298 ,  H05K1/116 ,  H05K2201/0715 ,  H05K2201/092 ,  H05K2201/09563 ,  H05K2201/09618 ,  H05K2201/10356 ,  H05K3/3447

Abstract: A low passive intermodulation (PIM) coaxial-to-printed circuit board (PCB) interface and method of constructing the same. According to one aspect, a coaxial-to-PCB interface couples signals between an electrical conductor trace in the PCB and an inner conductor of a coaxial structure having an insulator surrounded by an outer conductor. A metallic cylinder is inserted over the outer conductor of the coaxial structure and positioning the coaxial structure with respect to the PCB so that the outer conductor and insulator of the coaxial structure lie below a lower surface of the PCB. The inner conductor of the coaxial structure is inserted into a via extending from the lower surface of the PCB to an upper surface of the PCB. Solder is deposited in the via to provide an electrically conductive path between the electrical conductor trace of the PCB and the inner conductor of the coaxial structure.

公开(公告)号：WO2022128353A2

公开(公告)日：2022-06-23

申请号：PCT/EP2021/082513

申请日：2021-11-22

Applicant: SEW-EURODRIVE GMBH & CO. KG

Inventor： PODBIELSKI, Leobald ,  BRAUN, Steffen

IPC: H05K1/16 ,  H05K1/02 ,  H05K1/0228 ,  H05K1/0239 ,  H05K1/0265 ,  H05K1/112 ,  H05K1/117 ,  H05K1/165 ,  H05K2201/09236 ,  H05K2201/09245 ,  H05K2201/09481 ,  H05K2201/09618 ,  H05K2201/09627 ,  H05K2201/09672 ,  H05K2201/09709

Abstract: Leiterplatte, insbesondere als Primärleiter verwendbare Leiterplatte, die zwei oder mehr Lagen aufweist, in denen jeweils Leiterbahnen angeordnet sind, dadurch gekennzeichnet, dass die Leiterplatte an zwei einander gegenüberliegenden Bereichen, insbesondere Endbereichen, Anschlussfelder aufweist, die jeweils Anschlüsse aufweisen, insbesondere linienhaft hintereinander angeordnete Anschlüsse aufweisen, wobei die beiden Anschlussfelder mittels eines Bündels von elektrischen Leitungen miteinander verbunden sind, insbesondere wobei ein jeweiliger Anschluss des ersten Anschlussfelds mit einem jeweiligen Anschluss des zweiten Anschlussfelds mittels einer jeweiligen elektrischen Leitung verbunden ist, wobei jede der elektrischen Leitungen jeweils Leiterbahnen und Durchkontaktierungen derart umfasst, dass das Bündel verdrillt ist.

公开(公告)号：WO2021262369A1

公开(公告)日：2021-12-30

申请号：PCT/US2021/033923

申请日：2021-05-24

Applicant: QUALCOMM INCORPORATED

Inventor： HAN, Jeahyeong ,  HWANG, Suhyung ,  ISKANDER, Mina ,  KUMAR, Rajneesh ,  JESSIE, Darryl, Sheldon

IPC: H05K1/02 ,  H05K1/14 ,  H05K3/46 ,  H05K1/0225 ,  H05K1/0237 ,  H05K1/148 ,  H05K2201/0154 ,  H05K2201/09336 ,  H05K2201/09618 ,  H05K2201/09681 ,  H05K2201/10098 ,  H05K3/4691

Abstract: Systems for shielding bent signal lines provide ways to couple different antenna arrays for radio frequency (RF) integrated circuits (ICs) (RFICs) associated therewith where the antenna arrays are oriented in different directions. Because the antenna arrays are oriented in different directions, the antenna structures containing the antennas may be arranged in different planes, and signal lines extending therebetween may include a bend. To prevent electromagnetic interference (EMI) or electromagnetic crosstalk (EMC) from negatively impacting signals on the signal lines (322), the signal lines may be shielded. The shields may further include vias (314) connecting the mesh ground planes (114) and positioned exteriorly of the signal lines (322). The density of the vias (314) may be varied to provide a desired rigidity in planes containing the antenna arrays while providing a desired flexibility at a desired bending location in the signal lines (322) to help bending process accuracy.