公开(公告)号：WO2021140310A1

公开(公告)日：2021-07-15

申请号：PCT/GB2020/053172

申请日：2020-12-11

Applicant: CANTOR TECHNOLOGIES LTD.

Inventor： YIP, Jimmy Gin Men

IPC: H05K1/11 ,  H05K3/00 ,  H05K3/40 ,  H05K3/06 ,  H05K3/42 ,  H05K1/115 ,  H05K2201/09063 ,  H05K2201/0959 ,  H05K2201/09645 ,  H05K2203/0769 ,  H05K2203/1461 ,  H05K2203/1476 ,  H05K2203/175 ,  H05K2203/308 ,  H05K3/0047 ,  H05K3/403 ,  H05K3/429

Abstract: A substrate is provided comprising: a through-hole via, the through-hole via comprising a primary hole defined by an inner surface and having an axis, the through-hole via extending through at least a portion of the substrate; wherein the inner surface is provided with at least two separate conductive tracks such that the through-hole via is divided to form at least two separate signal paths for transmission of signals from one part of the substrate to another; and wherein each conductive track is electrically isolated from the other conductive track(s).