公开(公告)号：WO2022220688A2

公开(公告)日：2022-10-20

申请号：PCT/NL2022/050492

申请日：2022-08-29

Applicant: NEDERLANDSE ORGANISATIE VOOR TOEGEPAST-NATUURWETENSCHAPPELIJK ONDERZOEK TNO

Inventor： HARKEMA, Stephan ,  TEUNISSEN, Jean-Pierre ,  RENTROP, Cornelis Hermanus Arnoldus ,  DE KOK, Margaretha Maria

IPC: H05K3/22 ,  H05K3/28 ,  H05K1/0284 ,  H05K1/0393 ,  H05K1/119 ,  H05K2201/0108 ,  H05K2201/0112 ,  H05K2201/09063 ,  H05K2201/09936 ,  H05K2201/10106 ,  H05K2201/10113 ,  H05K2201/10128 ,  H05K2201/2072 ,  H05K2203/074 ,  H05K2203/0746 ,  H05K2203/0763 ,  H05K2203/0783 ,  H05K2203/1316 ,  H05K2203/1322 ,  H05K2203/1327 ,  H05K2203/176 ,  H05K2203/178 ,  H05K3/0014 ,  H05K3/284

Abstract: An electronic device (100) is designed to be more easily recycled at its end of life while maintaining usability during its lifetime. The electronic device comprises a first substrate (11), an encapsulation layer (19), and a set of electronics (15) disposed there between. One or more delamination layers (12,18) cover at least one side, preferably both sides, of the set of electronics (15) to separate the set of electronics (15) from at least one, preferably both, of the first substrate (11) and the encapsulation layer (19). The set of electronics (15), covered by the one or more delamination layers (12,18), is encapsulated between the encapsulation layer (19) and the first substrate (11). At least one of the delamination layers (12,18) comprises a set of passages (12p,18p) filled with material of the encapsulation layer (19) forming a set of interconnections (19p) between the encapsulation layer (19) and the first substrate (11).