公开(公告)号：WO2022207908A1

公开(公告)日：2022-10-06

申请号：PCT/EP2022/058758

申请日：2022-04-01

Applicant: OSRAM OPTO SEMICONDUCTORS GMBH

Inventor： PFEUFFER, Alexander

IPC: H01L33/00 ,  H05K3/30 ,  H01L25/075 ,  H01L33/62 ,  H01L21/67 ,  H05K13/04 ,  H05K3/34 ,  H01L21/67144 ,  H01L25/0753 ,  H01L2933/0066 ,  H01L33/0095 ,  H05K2201/10106 ,  H05K2203/0278 ,  H05K3/303 ,  H05K3/3494

Abstract: Die Erfindung betrifft ein Verfahren zum Transferieren mindestens eines optoelektronischen Halbleiterbauelementes von einem ersten Träger auf einen zweiten Träger umfassend die Schritte: Aufbringen einer strukturierbaren Materialschicht auf mindestens ein auf einem ersten Träger angeordnetes optoelektronisches Halbleiterbauelement; Strukturieren der zumindest einen strukturierbaren Materialschicht derart, dass dem optoelektronischen Halbleiterbauelement ein Teilbereich der strukturierten Materialschicht auf einer Oberseite des optoelektronischen Halbleiterbauelements zugeordnet ist; Aufnehmen des optoelektronischen Halbleiterbauelements mittels einer Transfereinheit umfassend ein Aufsetzen der Transfereinheit auf eine dem optoelektronischen Halbleiterbauelement gegenüberliegende Oberseite des Teilbereichs der strukturierten Materialschicht; Abheben des optoelektronischen Halbleiterbauelements von dem ersten Träger; Anordnen des optoelektronischen Halbleiterbauelements auf einem ersten Bereich eines zweiten Trägers, wobei zumindest ein zum ersten Bereich benachbarter zweiter Bereich die Oberseite des optoelektronischen Halbleiterbauelements überragt; und Fixieren des optoelektronischen Halbleiterbauelements auf dem zweiten Träger.

公开(公告)号：WO2021249883A1

公开(公告)日：2021-12-16

申请号：PCT/EP2021/064984

申请日：2021-06-04

Applicant: SIGNIFY HOLDING B.V.

Inventor： ACKERMANN, Bernd ,  VAN ASSELT, Robert ,  BENOY, Daniël, Anton ,  WOUTERS, Huibert ,  ANSEMS, Wilhelmus, Johannes, Hendricus

IPC: F21V19/00 ,  H05K1/14 ,  F21V19/0025 ,  F21V19/004 ,  F21Y2115/10 ,  H05K1/181 ,  H05K2201/10106

Abstract: The invention provides a light generating system (1000) comprising a LED module (100), a module support (200), and a connector element (300), wherein: the module support (200) comprises a first module support opening (230) for hosting at least part of a first connector element part (310); the LED module (100) comprises a LED support (120) and a plurality of LEDs (10) functionally coupled to the LED support (120), wherein the LED support (120) comprises a LED support opening (130) for hosting at least part of the first connector element part (310); and wherein the plurality of LEDs (10) are configured to generate light source light (11); the connector element (300) comprises the first connector element part (310), and wherein the first connector element part (310) comprises a first spring part (315); at least part of the first connector element part (310) penetrates through the first module support opening (230); and the LED support opening (130), the first connector element part (310), and the module support (200) are chosen such that in a functional coupling of the LED module (100) and the module support (200), at least part of the first connector element part (310) penetrates through the LED support opening (130), and the first spring part (315) exerts a force on the LED module (100) against the module support (200).

公开(公告)号：WO2021148781A1

公开(公告)日：2021-07-29

申请号：PCT/GB2021/050114

申请日：2021-01-19

Applicant: PREVAYL LIMITED

Inventor： LYNCH, Michael John

IPC: H05K1/16 ,  H05K1/14 ,  A41D1/00 ,  A41D13/12 ,  G06K19/077 ,  H05K1/03 ,  H05K3/40 ,  G06K19/07758 ,  G06K19/07767 ,  H05K1/038 ,  H05K1/144 ,  H05K1/165 ,  H05K2201/09027 ,  H05K2201/09063 ,  H05K2201/0999 ,  H05K2201/10098 ,  H05K2201/10106 ,  H05K2201/10151 ,  H05K3/4092

Abstract: An electronics module (200) for a wearable article (300). The electronics module (200) comprises a controller configured to process signals received from a sensing component of the wearable article (300). The electronics module (200) comprises a power source, coupled to the controller, and arranged to supply power to the controller. The electronics module (200) comprises a printed circuit board structure (100). The printed circuit board structure (100) comprises a printed circuit board (101) and an antenna unit provided on the printed circuit board (101). The antenna unit comprising a first antenna (107) and a second antenna (109). The electronics module comprises a housing arranged to house the controller, power source, and printed circuit board structure. The first antenna (107) is arranged to wirelessly receive signals from the sensing component of the wearable article (300) and provide the same to the controller.

公开(公告)号：WO2021121943A1

公开(公告)日：2021-06-24

申请号：PCT/EP2020/084017

申请日：2020-12-01

Applicant: OSRAM OPTO SEMICONDUCTORS GMBH

Inventor： BRANDL, Martin ,  HOFMANN, Clemens ,  RICHTER, Daniel

IPC: F21S41/148 ,  F21S41/19 ,  F21S45/47 ,  F21K9/232 ,  H05K1/03 ,  F21S41/192 ,  F21V29/70 ,  F21Y2107/90 ,  F21Y2115/10 ,  H05K1/053 ,  H05K2201/10106

Abstract: Die Erfindung betrifft einen Halogenlampenersatz, insbesondere für AutomobilScheinwerfer, aufweisend eine Trägerplatte (100), die an deren beiden Hauptoberflächen jeweils mit einer strukturierten elektrisch leitenden Schicht (20) bedeckt ist, an die jeweils mindestens ein Licht emittierendes Bauteil (30), insbesondere mindestens ein Leuchtdiodenchip (30a), angeschlossen ist, wobei die Trägerplatte (100) ausgestaltet ist, von den Licht emittierenden Bauteilen (30) erzeugte Wärme an eine mittels einer KoppelStruktur (40) ausgebildeten Wärmesenke wegzuleiten.

公开(公告)号：WO2023285770A1

公开(公告)日：2023-01-19

申请号：PCT/FR2022/051422

申请日：2022-07-15

Applicant: FONTAINE-PICOUREIX, Valère

Inventor： FONTAINE-PICOUREIX, Valère

IPC: G02B6/42 ,  G02B6/43 ,  H05K1/02 ,  H04Q11/00 ,  G02B6/293 ,  G02B6/2808 ,  G02B6/29361 ,  G02B6/29395 ,  G02B6/4206 ,  G02B6/421 ,  G02B6/4214 ,  G02B6/4215 ,  G02B6/4246 ,  G02B6/428 ,  H04Q11/0005 ,  H04Q2011/0009 ,  H04Q2011/0026 ,  H05K1/0274 ,  H05K2201/09072 ,  H05K2201/10106 ,  H05K2201/10121 ,  H05K2201/10151 ,  H05K2201/2054

Abstract: L'invention présente un Cluster de modules optroniques comprenant : • Un circuit optronique comprenant un circuit imprimé formé par une plaque isolante présentant des pistes conductrices • Des modules optroniques comportant • des broches métalliques comprenant au moins une broche d'entrée-sortie d'un signal numérique, une broche de masse et une broche d'alimentation électrique, • au moins un connecteur optique pour l'entrée-sortie d'un signal lumineux bidirectionnel

公开(公告)号：WO2022220688A2

公开(公告)日：2022-10-20

申请号：PCT/NL2022/050492

申请日：2022-08-29

Applicant: NEDERLANDSE ORGANISATIE VOOR TOEGEPAST-NATUURWETENSCHAPPELIJK ONDERZOEK TNO

Inventor： HARKEMA, Stephan ,  TEUNISSEN, Jean-Pierre ,  RENTROP, Cornelis Hermanus Arnoldus ,  DE KOK, Margaretha Maria

IPC: H05K3/22 ,  H05K3/28 ,  H05K1/0284 ,  H05K1/0393 ,  H05K1/119 ,  H05K2201/0108 ,  H05K2201/0112 ,  H05K2201/09063 ,  H05K2201/09936 ,  H05K2201/10106 ,  H05K2201/10113 ,  H05K2201/10128 ,  H05K2201/2072 ,  H05K2203/074 ,  H05K2203/0746 ,  H05K2203/0763 ,  H05K2203/0783 ,  H05K2203/1316 ,  H05K2203/1322 ,  H05K2203/1327 ,  H05K2203/176 ,  H05K2203/178 ,  H05K3/0014 ,  H05K3/284

Abstract: An electronic device (100) is designed to be more easily recycled at its end of life while maintaining usability during its lifetime. The electronic device comprises a first substrate (11), an encapsulation layer (19), and a set of electronics (15) disposed there between. One or more delamination layers (12,18) cover at least one side, preferably both sides, of the set of electronics (15) to separate the set of electronics (15) from at least one, preferably both, of the first substrate (11) and the encapsulation layer (19). The set of electronics (15), covered by the one or more delamination layers (12,18), is encapsulated between the encapsulation layer (19) and the first substrate (11). At least one of the delamination layers (12,18) comprises a set of passages (12p,18p) filled with material of the encapsulation layer (19) forming a set of interconnections (19p) between the encapsulation layer (19) and the first substrate (11).

公开(公告)号：WO2022112148A2

公开(公告)日：2022-06-02

申请号：PCT/EP2021/082431

申请日：2021-11-22

Applicant: VALEO VISION

Inventor： ROBICHON, Mathieu

IPC: H05K3/32 ,  H05K1/11 ,  F21S41/19 ,  H05K1/18 ,  H01R12/70 ,  H01R12/72 ,  H01R12/75 ,  F21S41/192 ,  H01R12/7017 ,  H01R12/721 ,  H01R2201/26 ,  H05K1/117 ,  H05K2201/09063 ,  H05K2201/09145 ,  H05K2201/10106 ,  H05K2201/10189 ,  H05K2201/10446 ,  H05K2201/1059 ,  H05K3/326

Abstract: The invention provides an electrical connection module for an automotive vehicle (100), comprising a printed circuit board (1) with a retainer portion (2) and an edge connector configured to be connected to the printed circuit board. The retainer portion (2) comprises an electric connection (5) located in a recess (4) of the printed circuit board (1), and the edge connector (3) comprises jaws (6, 7) intended to be coupled with the electric connection when entering the recess (4). The edge connector (3) further comprises a back portion (8), where the electric arm (6) and the support arm (7) protrude from; and the retainer portion (2) comprises two retaining arms (9), each retaining arm (9) protruding from the printed circuit board (1) towards the electric connection (5) in a protruding direction which forms between 5 and 40 degrees with respect to the connection direction (d), and leaving a space between them which is smaller than the width of the back portion (8) of the edge connector (3).

公开(公告)号：WO2021122781A1

公开(公告)日：2021-06-24

申请号：PCT/EP2020/086471

申请日：2020-12-16

Applicant: VALEO VISION

Inventor： ZOJCESKI, Zdravko ,  VAL, Alexandre ,  DAROUSSIN, Samuel

IPC: H01L25/075 ,  H01L33/56 ,  H01L33/62 ,  H05K1/18 ,  H05K3/28 ,  H01L25/0753 ,  H05K1/0274 ,  H05K1/095 ,  H05K1/184 ,  H05K2201/0108 ,  H05K2201/10106 ,  H05K3/284

Abstract: L'invention concerne un ensemble lumineux (100) pour un dispositif d'éclairage et/ou de signalisation d'un véhicule automobile, comprenant une 5 pluralité de sources lumineuses élémentaires (1a, … 1i, … 1n) agencées sur un support (200). Dans l'ensemble lumineux (100) selon l'invention, chaque source lumineuse élémentaire (1a, … 1i, … 1n) est une diode électroluminescente reliée électriquement, d'une part, à une première couche conductrice (30) du support (200) et, d'autre part, à une deuxième couche 10 conductrice (31) du support (200), la première couche conductrice (30) et la deuxième couche conductrice (31) étant agencées de part et d'autre d'une épaisseur (20) du support (200). Dans l'ensemble lumineux (100) selon l'invention, chaque diode électroluminescente (1a, … 1i, … 1n) est placée dans un orifice d'accueil (5a, … 5i, … 5n) agencé dans le support (200), l'orifice 15 d'accueil (5a, … 5i, … 5n) s'étendant, respectivement, à travers la première couche conductrice (30) et à travers une épaisseur (20) du support (200) jusqu'à la deuxième couche conductrice (31), chaque diode électroluminescente (1a, … 1i, … 1n) étant partiellement encapsulée dans un matériau de recouvrement (80, 80') optiquement transparent et électriquement conducteur.

公开(公告)号：WO2023275228A1

公开(公告)日：2023-01-05

申请号：PCT/EP2022/068036

申请日：2022-06-30

Applicant: BARCO N.V.

Inventor： WILLEM, Patrick ,  VAN DEN BOSSCHE, Bart ,  GERETS, Peter ,  VAN EESSEN, Wim

IPC: H01L25/075 ,  H01L25/16 ,  G09G3/32 ,  H05K1/02 ,  H05K1/14 ,  H05K3/00 ,  H01L33/60 ,  H01L33/62 ,  H05K3/42 ,  G09G2300/026 ,  G09G2300/0426 ,  G09G2340/145 ,  H01L25/0753 ,  H01L25/167 ,  H05K1/0274 ,  H05K1/144 ,  H05K1/147 ,  H05K2201/10106 ,  H05K2201/10128 ,  H05K2201/2054 ,  H05K3/0058 ,  H05K3/429

Abstract: The present invention relates to a light emitting module for a light emitting display, comprising a first backplane (900) and a third backplane (800) arranged in a stackup, wherein the first backplane (900) comprises a thin film transistor (TFT) layer deposited on a first substrate, the TFT layer further comprising a plurality of light emitting elements (901), associated contact pads and conducting tracks. The third backplane (800) is provided on top of the light emitting elements (901), comprises cavities (840) at the locations of the light emitting elements (901) and comprises at least a ground layer (810) and a power layer (830), wherein upper and lower layers of the third backplane (800) are provided by alternatively the ground layer (810) and the power layer (830) for contacting the light emitting elements (901).

公开(公告)号：WO2023274858A1

公开(公告)日：2023-01-05

申请号：PCT/EP2022/067294

申请日：2022-06-24

Applicant: SIGNIFY HOLDING B.V.

Inventor： VAN DE SLUIS, Bartel, Marinus ,  ROZENDAAL, Leendert, Teunis ,  KRIJN, Marcellinus, Petrus, Carolus, Michael ,  VISSENBERG, Michel, Cornelis, Josephus, Marie

IPC: F21S4/24 ,  H04N5/64 ,  H05K1/02 ,  F21Y103/10 ,  F21Y103/20 ,  F21Y107/30 ,  F21Y107/70 ,  F21Y2103/10 ,  F21Y2103/20 ,  F21Y2107/30 ,  F21Y2107/70 ,  H05K1/028 ,  H05K2201/055 ,  H05K2201/0909 ,  H05K2201/10106

Abstract: :The present invention relates to a customizable light strip (10) mountable on a mounting surface (36), comprising: an elongated substrate (12); a linear LED array (18) with a plurality of LED nodes (20) mounted on a surface (14a) of the elongated substrate; and an interconnection structure (22) electrically interconnecting the plurality of LED nodes, wherein the elongated substrate comprises partial separation lines (24) between at least some of the plurality of LED nodes of the linear LED array, which partial separation lines extend from one longitudinal edge (16a) of the elongated substrate and partly across the elongated substrate and do not intersect the interconnection structure, and wherein the customizable light strip after partial separation at one or more of the partial separation lines is bendable in a plane of said mounting surface.