公开(公告)号：US20230147757A1

公开(公告)日：2023-05-11

申请号：US17920631

申请日：2021-04-22

Applicant: DENKA COMPANY LIMITED

Inventor： Takuto OKABE ,  Motoharu FUKAZAWA ,  Toru ARAI

IPC: C01B33/18 ,  C08K3/36

CPC classification number: C01B33/18 ,  C08K3/36 ,  C01P2004/32 ,  C01P2002/74

Abstract: A spherical silica powder which, when heated from 25° C. up to 1000° C. at a rate of 30° C./min, desorbs water molecules in an amount of 0.01 mmol/g or less at 500° C. to 1000° C., and which has a specific surface area of 1 to 30 m2/g.

公开(公告)号：US20240417545A1

公开(公告)日：2024-12-19

申请号：US18701790

申请日：2022-10-07

Applicant: DENKA COMPANY LIMITED

Inventor： Takuto OKABE ,  Motoharu FUKAZAWA ,  Kei KUBOBUCHI ,  Takako EBISUZAKI

IPC: C08K9/06 ,  C09C1/30

Abstract: Provided are spherical silica particles that can achieve a lower dielectric dissipation factor when used to fill a resin, and a resin composition using the same.
Spherical silica particles (X) are those having a surface fractal dimension of 1.0-2.3. The resin composition contains the spherical silica particles (X) and at least one resin selected from a thermoplastic resin and a thermosetting resin. The specific surface area of the spherical silica particles (X) is preferably 0.1-2.0 m2/g. The average particle diameter of the spherical silica particles (X) is preferably 1-30 μm.

公开(公告)号：US20240317597A1

公开(公告)日：2024-09-26

申请号：US18578989

申请日：2022-06-24

Applicant: Denka Company Limited

Inventor： Toshihiko TSUNEYOSHI ,  Motoharu FUKAZAWA ,  Takuto OKABE

IPC: C01F7/02 ,  C01B33/18 ,  C08K3/22 ,  C08K3/36

CPC classification number: C01F7/02 ,  C01B33/18 ,  C08K3/22 ,  C08K3/36 ,  C01P2002/85 ,  C01P2004/61 ,  C01P2004/84 ,  C08K2003/2227 ,  C08K2201/003

Abstract: Provided are oxide composite particles closer to a sphere that are mixed with a resin to obtain a resin composition having low dielectric constant and low dielectric loss tangent. The oxide composite particles containing silica and an oxide of aluminum (a single oxide or a composite oxide, or both), in which the oxide composite particles contain 10 to 90% by mass of an α-cristobalite crystal phase, 50% by mass or less of an α-alumina crystal phase, and more than 10% by mass of a mullite crystal phase, and an elemental ratio of aluminum to silicon (aluminum/silicon) as determined by X-ray photoelectron spectroscopy is 0.1 or more.

公开(公告)号：US20230295442A1

公开(公告)日：2023-09-21

申请号：US18020182

申请日：2021-08-13

Applicant: DENKA COMPANY LIMITED

Inventor： Takuji KOBAYASHI ,  Motoharu FUKAZAWA ,  Takuto OKABE

IPC: C09C1/36

CPC classification number: C09C1/36 ,  C01P2006/63 ,  C01P2006/64 ,  C01P2006/80 ,  C01P2002/72

Abstract: A method for producing a particle, containing a step of heating a mixture containing TiH2 and TiO2 at 700 to 900° C., wherein a molar ratio of the TiH2 to the TiO2 contained in the mixture is 3.1 to 4.6. A particle having a crystal composition composed of Ti2O3 and γ-Ti3O5, wherein a molar ratio of the Ti2O3 to the γ-Ti3O5 is 0.1 or more.

公开(公告)号：US20240308867A1

公开(公告)日：2024-09-19

申请号：US18273831

申请日：2022-01-21

Applicant: DENKA COMPANY LIMITED

Inventor： Takuto OKABE ,  Motoharu FUKAZAWA

IPC: C01F7/021 ,  C08K3/22 ,  C08L71/12

CPC classification number: C01F7/021 ,  C08K3/22 ,  C08L71/12 ,  C01P2002/72 ,  C01P2004/32 ,  C01P2004/61 ,  C01P2004/62 ,  C01P2006/40 ,  C01P2006/80 ,  C08K2003/2227

Abstract: Provided are spherical alumina particles to be mixed with a resin to obtain a resin composition having low dielectric loss tangent. The spherical alumina particles containing 90% by mass or more of an α-alumina crystal phase, in which the spherical alumina particles have a half-width of an α-alumina (113) peak of 0.124° or less as observed by X-ray diffraction and an average particle diameter of 0.5 to 40 μm.

公开(公告)号：US20240239682A1

公开(公告)日：2024-07-18

申请号：US18563782

申请日：2022-05-18

Applicant: DENKA COMPANY LIMITED

Inventor： Takuto OKABE ,  Motoharu FUKAZAWA

IPC: C01G23/04 ,  C01F7/021 ,  C08K7/18

CPC classification number: C01G23/04 ,  C01F7/021 ,  C08K7/18 ,  C01P2004/32 ,  C01P2004/61 ,  C01P2004/62 ,  C01P2006/12 ,  C08K2201/003 ,  C08K2201/006

Abstract: To provide: an inorganic oxide powder which, when filled in a resin material, can simultaneously achieve a high dielectric constant and a low dielectric dissipation factor; a method for producing the same; and a resin composition comprising the inorganic oxide powder.
Provided is an inorganic oxide powder comprising a spherical titanium oxide powder and an aluminum oxide powder, wherein the aluminum content in the inorganic oxide powder is 20-50,000 mass ppm. Further provided is a resin composition comprising the inorganic oxide powder and at least one resin material selected from a thermoplastic resin and a thermosetting resin.

公开(公告)号：US20240228743A1

公开(公告)日：2024-07-11

申请号：US18563799

申请日：2022-05-18

Applicant: DENKA COMPANY LIMITED

Inventor： Takuto OKABE ,  Motoharu FUKAZAWA

IPC: C08K3/22 ,  C01G23/04 ,  C08K7/18 ,  C08K9/06 ,  C21D1/32

CPC classification number: C08K3/22 ,  C01G23/04 ,  C08K7/18 ,  C08K9/06 ,  C21D1/32 ,  C01P2004/32 ,  C01P2004/61 ,  C01P2006/12 ,  C01P2006/40 ,  C08K2003/2227 ,  C08K2003/2237 ,  C08K2201/001 ,  C08K2201/005 ,  C08K2201/006

Abstract: To provide: an inorganic oxide powder which, when filled in a resin material, can simultaneously achieve a high dielectric constant and a low dielectric dissipation factor; a method for producing the same; and a resin composition comprising the inorganic oxide powder.
Provided is an inorganic oxide powder comprising a spherical titanium oxide powder having a rutile phase, wherein the ratio of the rutile phase in the inorganic oxide powder is 90 mass % or more. Further provided is a resin composition comprising the inorganic oxide powder and at least one resin selected from a thermoplastic resin and a thermosetting resin.

公开(公告)号：US20230227658A1

公开(公告)日：2023-07-20

申请号：US17928900

申请日：2021-05-10

Applicant: DENKA COMPANY LIMITED

Inventor： Naotsugu NOGAMI ,  Motoharu FUKAZAWA ,  Takuto OKABE

IPC: C09C3/06 ,  C09C1/00 ,  C03C14/00 ,  C08K9/02

CPC classification number: C09C3/063 ,  C09C1/0081 ,  C03C14/004 ,  C08K9/02 ,  C01P2004/84 ,  C01P2002/72 ,  C01P2004/03 ,  C03C2214/05

Abstract: A method for producing a composite particle, the method containing: (a) mixing a raw material particle and at least one type of fine particles selected from SiO2 fine particles and Al2O3 fine particles, the fine paricles having a diameter smaller than that of the raw material particle; and (b) heating the mixture of the raw material particles and the fine particles, wherein the raw material particle contains three components of ZnO, Al2O3, and SiO2, and a content of the ZnO is 17 to 43% by mole, a content of the Al2O3 is 9 to 20% by mole, and a content of the SiO2 is 48 to 63% by mole, based on the total content of the three components.

公开(公告)号：US20240425377A1

公开(公告)日：2024-12-26

申请号：US18701772

申请日：2022-10-07

Applicant: DENKA COMPANY LIMITED

Inventor： Takuto OKABE ,  Motoharu FUKAZAWA

IPC: C01B33/18

Abstract: The present invention provides a method for producing spherical silica particles that can achieve lower dielectric dissipation factors when used to fill a resin. The present invention is a method for producing spherical silica particles (X), including a step of classifying amorphous spherical silica particles (A), followed by a step of performing a heat treatment at 800-1200° C. The classifying step preferably includes wet classification. Additionally, the classifying step preferably includes removing foreign substances from surfaces of the spherical silica particles (A). The spherical silica particles (A) are preferably amorphous spherical silica particles obtained by a powder melting method.

公开(公告)号：US20240417544A1

公开(公告)日：2024-12-19

申请号：US18701748

申请日：2022-10-07

Applicant: DENKA COMPANY LIMITED

Inventor： Takuto OKABE ,  Motoharu FUKAZAWA ,  Tsuyoshi KANEKO ,  Takako EBISUZAKI

IPC: C08K9/06 ,  C09C1/30

Abstract: Provided are spherical silica particles that can achieve a lower dielectric dissipation factor when used to fill a resin, and a resin composition using the same. The spherical silica particles (X) are those in which the number of water molecules desorbed from the spherical silica particles (X) when the spherical silica particles (X) are heated from 50° C. to 1000° C. at a rate of temperature increase of 25° C./min. is 0.001-0.010 mmoL/g and in which the specific surface area is 0.1-2.0 m2/g. The resin composition contains the silica particles (X) and at least one resin selected from a thermoplastic resin and a thermosetting resin.