公开(公告)号：US11787180B2

公开(公告)日：2023-10-17

申请号：US17414140

申请日：2019-04-29

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Stanley J. Wang ,  Anthony M. Fuller

IPC: B41J2/14 ,  B01L3/00 ,  B81B7/00

CPC classification number: B41J2/1433 ,  B01L3/502715 ,  B81B7/0025 ,  B01L2200/12 ,  B81B2201/052

Abstract: A microfluidic device including a fluid ejection channel defined by a fluid barrier and an orifice, or nozzle, for containing and/or passing fluids, and further including micro-electromechanical systems (MEMS) and/or electronic circuitry may be fabricated on a silicon substrate and included in a fluid ejection system. Various microfabrication techniques used for fabricating semiconductor devices may be used to manufacture such microfluidic devices.

公开(公告)号：US11642884B2

公开(公告)日：2023-05-09

申请号：US16766525

申请日：2019-02-06

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Michael W. Cumbie ,  Scott A. Linn ,  Anthony M. Fuller ,  James Michael Gardner

IPC: B41J2/14

CPC classification number: B41J2/14072 ,  B41J2/14056 ,  B41J2002/14491 ,  B41J2202/13

Abstract: A die for a printhead is described herein. The die includes a number of fluid feed holes disposed in a line parallel to a longitudinal axis of the die, wherein the fluid feed holes are formed through a substrate of the die. The die includes a number of fluidic actuators, proximate to the fluid feed holes, to eject fluid received from the fluid feed holes. Circuitry on the die operates the fluidic actuators, wherein traces are provided in layers between adjacent fluid feed holes, connecting circuitry on each side of the fluid feed holes.

公开(公告)号：US20220176708A1

公开(公告)日：2022-06-09

申请号：US17417789

申请日：2019-08-28

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Boon Bing Ng ,  Anthony M. Fuller ,  Michael W. Cumbie

IPC: B41J2/19 ,  B41J2/14

Abstract: In some examples, a fluid dispensing device includes an inner chamber to contain a fluid. The fluid dispensing device further includes an orifice layer comprising a bubbler orifice to draw air through a bubbler chamber to the inner chamber responsive to a pressure satisfying a criterion, the bubbler chamber being adjacent the bubbler orifice. A circulation path circulates fluid drawn through a feed hole through the bubbler chamber.

公开(公告)号：US20190106802A1

公开(公告)日：2019-04-11

申请号：US16212435

申请日：2018-12-06

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Peter Mardilovich ,  Anthony M. Fuller ,  Qingqiao Wei

IPC: C25D11/04 ,  C25D11/26 ,  C25D11/02 ,  C25D11/08 ,  C25D11/12 ,  C25D11/24 ,  B81C1/00 ,  C25D11/16 ,  C25D11/10

Abstract: A method of forming a micro-structure involves forming a multi-layered structure including i) an oxidizable material layer on a substrate and ii) another oxidizable material layer on the oxidizable material layer. The oxidizable material layer is formed of an oxidizable material having an expansion coefficient, during oxidation, that is more than 1. The method further involves forming a template, including a plurality of pores, from the other oxidizable material layer, and growing a nano-pillar inside each pore. The nano-pillar has a predefined length that terminates at an end. A portion of the template is selectively removed to form a substantially even plane that is oriented in a position opposed to the substrate. A material is deposited on at least a portion of the plane to form a film layer thereon, and the remaining portion of the template is selectively removed to expose the nano-pillars.

公开(公告)号：US20170361613A1

公开(公告)日：2017-12-21

申请号：US15697790

申请日：2017-09-07

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： Rio Rivas ,  Anthony M. Fuller ,  Ed Friesen

IPC: B41J2/14

CPC classification number: B41J2/1433 ,  B41J2/14145

Abstract: In an embodiment, a fluid ejection device includes a substrate with a fluid slot formed therein, a chamber layer formed on the substrate defining fluid chambers on both sides of the fluid slot, a thin-film layer between the substrate and chamber layer that defines an ink feedhole (IFH) between the fluid slot and the chamber layer, and a chamber layer extension that forms a bridge across the IFH between two chambers.

公开(公告)号：US09776402B2

公开(公告)日：2017-10-03

申请号：US15111269

申请日：2014-01-29

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： Lawrence H. White ,  Anthony M. Fuller ,  Huyen Pham

IPC: B41J2/14 ,  B41J2/335 ,  B41J2/16

CPC classification number: B41J2/14112 ,  B41J2/14129 ,  B41J2/1601 ,  B41J2/1626 ,  B41J2/1628 ,  B41J2/1629 ,  B41J2/3351 ,  B41J2/33515 ,  B41J2/3353 ,  B41J2/3354 ,  B41J2/3357

Abstract: The present disclosure includes a method of fabricating a thermal ink jet printhead including depositing a first metal layer having a thickness to form a power bus, deposing a first dielectric layer, forming a via in the first dielectric layer to connect the first metal layer to a second metal layer, depositing the second metal layer, depositing a resistive layer, forming a thermal resistor in the resistive layer, depositing a second dielectric layer, and removing a portion of the second dielectric layer.

公开(公告)号：US11827021B2

公开(公告)日：2023-11-28

申请号：US17297612

申请日：2019-02-06

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Chien-Hua Chen ,  Christopher A. Leonard ,  Anthony M. Fuller

IPC: B41J2/16 ,  B41J2/045 ,  B29C45/14 ,  B29C45/00 ,  B29L31/00 ,  B41J2/14

CPC classification number: B41J2/1637 ,  B29C45/0046 ,  B29C45/14639 ,  B41J2/04501 ,  B29L2031/7678 ,  B41J2002/14362 ,  B41J2202/01

Abstract: A method includes applying a mold chase to a fluid ejection die to at least partially define at least one cavity. The mold chase includes a feature to contact a fluid ejection portion of the fluid ejection die, and at least one structure separate from the feature to contact a first end portion adjacent a first end of the fluid ejection die. The method includes filling the at least one cavity with a mold compound to produce a molded carrier for the fluid ejection die.

公开(公告)号：US11745507B2

公开(公告)日：2023-09-05

申请号：US17311593

申请日：2019-04-29

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Michael W. Cumbie ,  Anthony M. Fuller ,  Chien-Hua Chen

IPC: B41J2/14 ,  B41J2/16

CPC classification number: B41J2/1433 ,  B41J2/162 ,  B41J2/1637

Abstract: In various examples, a fluid ejection device may include a fluid ejection die formed with a first material and that includes a bondpad and a plurality of fluid ejectors, and a cover layer adjacent the fluid ejection die. The cover may be formed with a second material that is different than the first material and may include a first region that overlays the bondpad and a second region that overlays the plurality of fluid ejectors. In various examples, the first and second regions are separated by a break in the cover layer. The break may be filled with a third material that is different than one or both of the first and second material.

公开(公告)号：US11721636B2

公开(公告)日：2023-08-08

申请号：US16603821

申请日：2018-04-15

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： Anthony M. Fuller ,  Michael W. Cumbie ,  Chien-Hua Chen

IPC: H01L23/544 ,  B41J2/175 ,  H01L21/68

CPC classification number: H01L23/544 ,  B41J2/17546 ,  H01L21/68 ,  H01L2223/54426

Abstract: A circuit die may include an outermost circuit layer having electrical transmission routing and an alignment target overlying the outermost circuit layer.

公开(公告)号：US20220348013A1

公开(公告)日：2022-11-03

申请号：US17859432

申请日：2022-07-07

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： James Michael Gardner ,  Scott A. Linn ,  Michael W. Cumbie ,  Anthony M. Fuller

IPC: B41J2/14 ,  B41J2/045

Abstract: A device includes a first column of contact pads. The device also includes a column of fluid actuation devices disposed longitudinally to the first column of contact pads.