公开(公告)号：US20180110121A1

公开(公告)日：2018-04-19

申请号：US15723375

申请日：2017-10-03

Applicant: IRISO ELECTRONICS CO., LTD.

Inventor： Yujiro Sugaya ,  Yuki Asanuma

IPC: H05K1/09 ,  H05K1/11 ,  H05K1/14 ,  H05K3/40 ,  H05K3/36

CPC classification number: H05K1/09 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/49866 ,  H05K1/112 ,  H05K1/144 ,  H05K3/366 ,  H05K3/4038 ,  H05K2201/0338 ,  H05K2201/041 ,  H05K2201/09727 ,  H05K2201/098 ,  H05K2201/09827 ,  H05K2201/10265

Abstract: To provide a circuit board that is capable of establishing electrical connection, that is thinner, and that has a higher maintainability. A circuit board 100 includes a substrate 101 including a hole portion 110 that penetrates the substrate 101 in a plate thickness direction, and a connector region including a first conductor layer 202 that closes one side of the hole portion 110, liquid metal 210 disposed in a recess 201 formed by the hole portion 110 and the first conductor layer 202, and a sealing layer 212 that is the liquid metal 210 cured on a liquid surface side. The liquid metal 210 may be in contact with a second conductor layer 204 formed in the recess 201.