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公开(公告)号：US20150237717A1
公开(公告)日：2015-08-20
申请号：US14453977
申请日：2014-08-07
Applicant: Siliconware Precision Industries Co., Ltd.
Inventor： Chang-fu Lin Chang , Chin-Tsai Yao , Ming-Chin Chuang , Ko-Cheng Liu , Fu-Tang Huang
CPC classification number: H05K3/4644 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2924/181 , H05K1/02 , H05K1/0296 , H05K1/0298 , H05K1/181 , H05K3/284 , H05K2201/0191 , H05K2201/09736 , H05K2201/20 , H05K2203/0353 , H05K2203/0369 , H01L2924/00012 , H01L2924/00
Abstract: A package substrate is provided, which includes a plurality of dielectric layers and a plurality of circuit layers alternately stacked with the dielectric layers. At least two of the circuit layers have a difference in thickness so as to prevent warpage of the substrate.
Abstract translation: 提供一种封装基板，其包括多个电介质层和与电介质层交替堆叠的多个电路层。 至少两个电路层的厚度不同，以防止基板翘曲。
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公开(公告)号：US09900996B2
公开(公告)日：2018-02-20
申请号：US14453977
申请日：2014-08-07
Applicant: Siliconware Precision Industries Co., Ltd.
Inventor： Chang-Fu Lin , Chin-Tsai Yao , Ming-Chin Chuang , Ko-Cheng Liu , Fu-Tang Huang
CPC classification number: H05K3/4644 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2924/181 , H05K1/02 , H05K1/0296 , H05K1/0298 , H05K1/181 , H05K3/284 , H05K2201/0191 , H05K2201/09736 , H05K2201/20 , H05K2203/0353 , H05K2203/0369 , H01L2924/00012 , H01L2924/00
Abstract: A package substrate is provided, which includes a plurality of dielectric layers and a plurality of circuit layers alternately stacked with the dielectric layers. At least two of the circuit layers have a difference in thickness so as to prevent warpage of the substrate.
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公开(公告)号：US09520351B2
公开(公告)日：2016-12-13
申请号：US14564145
申请日：2014-12-09
Applicant: Siliconware Precision Industries Co., Ltd.
Inventor： Chang-Fu Lin , Chin-Tsai Yao , Ming-Chin Chuang , Ko-Cheng Liu , Fu-Tang Huang
IPC: H01L23/00 , H01L23/498 , H05K1/02 , H01L23/31
CPC classification number: H01L23/49822 , H01L23/3121 , H01L23/49838 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2924/15174 , H01L2924/181 , H05K1/0298 , H05K2201/0191 , H05K2201/0195 , H01L2924/00012 , H01L2924/00
Abstract: A packaging substrate and a package structure are provided. The packaging substrate includes a plurality of dielectric layers, two of which have a difference in thickness; and a plurality of circuit layers alternately stacked with the dielectric layers. Therefore, the package warpage encountered in the prior art is avoided.
Abstract translation: 提供了一种封装基板和封装结构。 包装衬底包括多个电介质层，其中两个具有不同的厚度; 以及与电介质层交替层叠的多个电路层。 因此，避免了现有技术中遇到的包装翘曲。
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公开(公告)号：US20150332998A1
公开(公告)日：2015-11-19
申请号：US14564145
申请日：2014-12-09
Applicant: Siliconware Precision Industries Co., Ltd.
Inventor： Chang-Fu Lin , Chin-Tsai Yao , Ming-Chin Chuang , Ko-Cheng Liu , Fu-Tang Huang
IPC: H01L23/498 , H05K1/02
CPC classification number: H01L23/49822 , H01L23/3121 , H01L23/49838 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2924/15174 , H01L2924/181 , H05K1/0298 , H05K2201/0191 , H05K2201/0195 , H01L2924/00012 , H01L2924/00
Abstract: A packaging substrate and a package structure are provided. The packaging substrate includes a plurality of dielectric layers, two of which have a difference in thickness; and a plurality of circuit layers alternately stacked with the dielectric layers. Therefore, the package warpage encountered in the prior art is avoided.
Abstract translation: 提供了一种封装基板和封装结构。 包装衬底包括多个电介质层，其中两个具有不同的厚度; 以及与电介质层交替层叠的多个电路层。 因此，避免了现有技术中遇到的包装翘曲。
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