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公开(公告)号：US09950512B2
公开(公告)日：2018-04-24
申请号：US15346390
申请日：2016-11-08
Applicant: CANON KABUSHIKI KAISHA
Inventor： Tomohiro Takahashi
CPC classification number: B41J2/01 , B41J2/1433 , B41J2/1753 , B41J2/17553 , B41J2002/14491 , H05K1/111 , H05K3/10 , H05K2201/20
Abstract: A liquid discharge head includes an element substrate to which an electric signal is supplied, an electrical wiring board that is connected to the element substrate and that is capable of supplying the electric signal to the element substrate, and a printed circuit board that includes a wiring line and an insulating layer covering the wiring line and that is capable of supplying the electric signal to the element substrate via the wiring line. A protruding structure that has a thickness approximately equal to a thickness of the wiring line and that is covered with the insulating layer is disposed along the wiring line on the printed circuit board, and a portion of the electrical wiring board is bonded to a portion of the insulating layer located on the wiring line disposed on the printed circuit board.
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公开(公告)号：US20170142826A1
公开(公告)日：2017-05-18
申请号：US15346390
申请日：2016-11-08
Applicant: CANON KABUSHIKI KAISHA
Inventor： Tomohiro Takahashi
CPC classification number: B41J2/01 , B41J2/1433 , B41J2/1753 , B41J2/17553 , B41J2002/14491 , H05K1/111 , H05K3/10 , H05K2201/20
Abstract: A liquid discharge head includes an element substrate to which an electric signal is supplied, an electrical wiring board that is connected to the element substrate and that is capable of supplying the electric signal to the element substrate, and a printed circuit board that includes a wiring line and an insulating layer covering the wiring line and that is capable of supplying the electric signal to the element substrate via the wiring line. A protruding structure that has a thickness approximately equal to a thickness of the wiring line and that is covered with the insulating layer is disposed along the wiring line on the printed circuit board, and a portion of the electrical wiring board is bonded to a portion of the insulating layer located on the wiring line disposed on the printed circuit board.
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公开(公告)号：US20170111994A1
公开(公告)日：2017-04-20
申请号：US15293859
申请日：2016-10-14
Inventor： Messaoud Bedjaoui , Raphael Salot
CPC classification number: H05K1/18 , H01L23/04 , H01L23/10 , H01L31/0203 , H01L51/5253 , H01M2/0207 , H01M2/06 , H05K1/115 , H05K3/284 , H05K3/4038 , H05K5/0021 , H05K5/03 , H05K2201/20
Abstract: This invention relates to a method for producing an electrical system comprising a support (1) bearing on a first face at least one device: with the device comprising at least one electronic component (2) provided with at least one electrical connector (21, 22), with the method comprising: a step of setting in place of a cover (6) positioned above the component; said cover (6) comprising at least one passage (61, 62) according to a dimension in thickness of the cover (6) in such a way as to form an access space to the at least one electrical connector (21, 22), a step of forming a sealing seam (71) in such a way that the component is encapsulated in a sealed cavity (9) delimited by the first face of the support (1), the first face of the cover (6) and the sealing seam (7), The method comprises a step of filling with a conductive material of is at least one passage (61, 62) of the cover (6) in such a way as to establish an electrical continuity between the conductive material and the at least one electrical connector (21, 22), formant a tapping (81, 82) and in that the sealing seam (7) comprises a dielectric material.
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公开(公告)号：US20240155777A1
公开(公告)日：2024-05-09
申请号：US18474355
申请日：2023-09-26
Applicant: InnoLux Corporation
Inventor： Yuan-Lin WU , Hsiu-Tung LIN , Chung-Wen YEN
CPC classification number: H05K3/4688 , H05K1/0306 , H05K3/386 , H05K3/42 , H05K2201/09045 , H05K2201/20
Abstract: An electronic device is provided. The electronic device includes a first insulating layer, a second insulating layer, an adhesive layer, and a functional layer. The first insulating layer has a side surface and at least one recess adjacent to the side surface. The second insulating layer is disposed on the first insulating layer and filled in the at least one recess. The adhesive layer is disposed on the second insulating layer. The functional layer is disposed on the adhesive layer. In addition, in a cross-sectional view of the electronic device, the second insulating layer has a thickness at a first position, and a thickness of the adhesive layer corresponding to the first position is greater than the thickness of the second insulating layer.
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5.发明申请ROOM-TEMPERATURE-CURABLE POLYORGANOSILOXANE COMPOSITION AND ELECTRIC/ELECTRONIC APPARATUS 审中-公开室温可固化聚硅氧烷组合物和电子/电子设备公开(公告)号：US20150140346A1
公开(公告)日：2015-05-21
申请号：US14605184
申请日：2015-01-26
Applicant: Momentive Performance Materials Japan LLC
Inventor： Isao IIDA , Yasuhito MORITA
IPC: C09D183/06 , H05K1/18
CPC classification number: C09D183/06 , C08K5/0091 , C08K5/5419 , C08L83/04 , C08L83/14 , C09D7/63 , C09D183/04 , C09D183/14 , H05K1/181 , H05K2201/10015 , H05K2201/20 , Y10T428/31663 , C08L83/00
Abstract: This room-temperature-curable polyorganosiloxane composition contains: (A) 100 parts by mass of polyorganosiloxane consisting of: (A1) 10 to 80 parts by mass of a both ends alkoxysilyl group-terminated polyorganosiloxane and (A2) 90 to 20 parts by mass of a partial hydrolysis condensate (the number of Si atoms is 10 to 200) of a silane compound expressed by a general formula: R4bSi(OR)4-b; (B) 0.1 to 15 parts by mass of a silane compound or a partial hydrolysis condensate thereof (the number of Si atoms is 1 or more and less than 10) as a cross-linking agent; and (C) 0.1 to 15 parts by mass of an organic titanium compound as a curing catalyst. It has low viscosity and good coatability without a solvent, and forms a cured coating film excellent in scratch resistance.
Abstract translation: 该室温固化性聚有机硅氧烷组合物含有：（A）100质量份由以下组成的聚有机硅氧烷：（A1）10〜80质量份的末端为末端的烷氧基甲硅烷基封端的聚有机硅氧烷和（A2）90〜20质量份 的由下列通式表示的硅烷化合物的部分水解缩合物（Si原子数为10〜200）：R4bSi（OR）4-b; （B）0.1〜15质量份作为交联剂的硅烷化合物或其部分水解缩合物（Si原子数为1以上且小于10）; 和（C）0.1〜15质量份作为固化催化剂的有机钛化合物。 没有溶剂，粘度低，涂布性好，形成耐刮擦性优异的固化涂膜。
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Patent Agency Ranking
公开(公告)号：US20150062846A1
公开(公告)日：2015-03-05
申请号：US14383365
申请日：2013-02-25
Applicant: LG INNOTEK CO., LTD.
Inventor： Ji Su Kim , Ki Do Chun , Kyu Won Lee , Sang Myung Lee
CPC classification number: H05K3/4602 , H05K1/0306 , H05K1/115 , H05K1/181 , H05K1/185 , H05K3/107 , H05K3/465 , H05K3/4697 , H05K2201/017 , H05K2201/0195 , H05K2201/20
Abstract: Provided is a printed circuit board, including: a core substrate including an internal circuit pattern on an upper surface or a lower surface; electronic devices which are formed to pass through the core substrate; an external insulating layer which covers the internal circuit pattern and the electronic devices; and an external circuit pattern which is formed on an upper surface of the external insulating layer, wherein a lower surface of the electronic devices protrudes from the lower surface of the core substrate to a lower part. Accordingly, in the embedded printed circuit board in which the electronic devices are embedded, when the electronic devices are mounted, because the insulating layer is formed regardless of a thickness of the electronic devices, the printed circuit board having a desired thickness regardless of the thickness of the electronic devices can be formed.
Abstract translation: 提供一种印刷电路板，包括：在上表面或下表面上包括内部电路图案的芯基板; 形成为通过芯基板的电子器件; 覆盖内部电路图案和电子设备的外部绝缘层; 以及外部电路图案，其形成在所述外部绝缘层的上表面上，其中所述电子设备的下表面从所述芯基板的下表面突出到下部。 因此，在嵌入电子器件的嵌入式印刷电路板中，当安装电子器件时，由于形成绝缘层而与电子器件的厚度无关地形成印刷电路板，而与厚度无关，印刷电路板 的电子设备可以形成。
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公开(公告)号：US10057983B1
公开(公告)日：2018-08-21
申请号：US14304650
申请日：2014-06-13
Applicant: Verily Life Sciences LLC
Inventor： James Etzkorn , Harvey Ho
CPC classification number: H05K1/0298 , A61B5/00 , A61B5/14532 , A61B5/1486 , A61B5/6821 , G02B3/00 , H05K3/007 , H05K3/284 , H05K3/303 , H05K3/4682 , H05K2201/09872 , H05K2201/10098 , H05K2201/10151 , H05K2201/20 , H05K2203/0384 , H05K2203/0756 , H05K2203/1322 , H05K2203/1377
Abstract: A method may involve: forming a first bio-compatible layer; forming an etch stop over a portion of the first bio-compatible layer; forming a conductive pattern over the etch stop and the first bio-compatible layer, wherein the conductive pattern defines an antenna, sensor electrodes, electrical contacts, and one or more electrical interconnects; mounting an electronic component to the electrical contacts; forming a second bio-compatible layer over the electronic component, the antenna, the sensor electrodes, the electrical contacts, the one or more electrical interconnects, and the etch stop; and etching, using an etchant, a portion of the second bio-compatible layer to form an opening in the second bio-compatible layer and thereby expose the sensor electrodes, wherein the etch stop inhibits etching of the portion of the first bio-compatible layer by the etchant.
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公开(公告)号：US20170359900A1
公开(公告)日：2017-12-14
申请号：US15610843
申请日：2017-06-01
Applicant: Murata Manufacturing Co., Ltd.
Inventor： HIROKI SAKAMOTO
IPC: H05K1/18 , H05K1/11 , H05K3/34 , H05K3/36 , H01G4/30 , H05K1/02 , H05K3/12 , H05K1/14 , H05K1/03 , H05K3/40 , H05K3/00
CPC classification number: H05K1/189 , H01G4/30 , H05K1/02 , H05K1/028 , H05K1/0293 , H05K1/0298 , H05K1/0393 , H05K1/11 , H05K1/115 , H05K1/118 , H05K1/144 , H05K1/147 , H05K1/148 , H05K1/181 , H05K3/0052 , H05K3/12 , H05K3/3442 , H05K3/3494 , H05K3/363 , H05K3/4038 , H05K3/4691 , H05K2201/049 , H05K2201/05 , H05K2201/10015 , H05K2201/10181 , H05K2201/10515 , H05K2201/1053 , H05K2201/20
Abstract: An intermediate connection layer interposed between a wiring substrate and an electronic part includes a rigid substrate and a flexible substrate. A plurality of conductor portions are formed on opposed principal surfaces of the respective flexible and rigid substrates. The rigid substrate is provided with an opening, and a fuse portion on the flexible substrate faces the opening. The flexible substrate and the rigid substrate are bonded together with solders. The respective rigid and flexible substrates are separately made, solder pastes are applied to the rigid substrate, both substrates are overlaid on each other, and the solder pastes are heated and solidified to make the intermediate connection layer.
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公开(公告)号：US09781833B2
公开(公告)日：2017-10-03
申请号：US15293859
申请日：2016-10-14
Inventor： Messaoud Bedjaoui , Raphael Salot
IPC: H01L21/00 , H05K1/18 , H01L51/52 , H01L31/0203 , H05K3/28 , H05K1/11 , H05K5/03 , H05K5/00 , H05K3/40
CPC classification number: H05K1/18 , H01L23/04 , H01L23/10 , H01L31/0203 , H01L51/5253 , H01M2/0207 , H01M2/06 , H05K1/115 , H05K3/284 , H05K3/4038 , H05K5/0021 , H05K5/03 , H05K2201/20
Abstract: This invention relates to a method for producing an electrical system comprising a support (1) bearing on a first face at least one device; with the device comprising at least one electronic component (2) provided with at least one electrical connector (21, 22), with the method comprising: a step of setting in place of a cover (6) positioned above the component; said cover (6) comprising at least one passage (61, 62) according to a dimension in thickness of the cover (6) in such a way as to form an access space to the at least one electrical connector (21, 22), a step of forming a sealing seam (71) in such a way that the component is encapsulated in a sealed cavity (9) delimited by the first face of the support (1), the first face of the cover (6) and the sealing seam (7). The method comprises a step of filling with a conductive material of is at least one passage (61, 62) of the cover (6) in such a way as to establish an electrical continuity between the conductive material and the at least one electrical connector (21, 22), formant a tapping (81, 82) and in that the sealing seam (7) comprises a dielectric material.
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公开(公告)号：US09990575B2
公开(公告)日：2018-06-05
申请号：US14386293
申请日：2013-03-22
Applicant: Dai Nippon Printing Co., Ltd.
Inventor： Kazuya Tsuruta , Tatsunosuke Ogawa
IPC: H05K1/00 , G06K19/077 , H05K1/18 , H05K7/02 , H05K13/04
CPC classification number: G06K19/07722 , H05K1/181 , H05K7/02 , H05K13/04 , H05K2201/20 , Y10T29/4913 , Y10T156/10 , Y10T428/24331 , Y10T428/24752
Abstract: To provide a card capable of improving external appearance, and a card production method. A card (1) is provided with: a module substrate (30); a lower layer (10) and an upper layer (50) arranged above and below the module substrate (30), the layers having an outline larger than the outline of the module substrate (30); and thickness adjustment layers (11, 51) for adjusting the thickness in a substrate outward region (S1), the thickness adjustment layers being provided between the lower layer (10) and the upper layer (50) and to the substrate outward region (S1) further outward than the outline of the module substrate (30), and being provided by printing to at least one layer among the layers that form the card (1).
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