公开(公告)号：US12254656B2

公开(公告)日：2025-03-18

申请号：US17388635

申请日：2021-07-29

Applicant: CANON KABUSHIKI KAISHA

Inventor： Akira Shibasaki

IPC: G06V10/141 ,  G01J1/02 ,  G01J1/06 ,  G01N21/47 ,  G01N21/55 ,  G01N21/57 ,  G06V10/60

Abstract: An apparatus includes a control unit configured to control an illumination unit such that two or more light sources from among the plurality of light sources of the illumination unit are turned on when an image of an object is captured, and a derivation unit configured to derive a reflection characteristic of the object based on image data obtained by capturing the image of the object, wherein the control unit turns on the two or more light sources such that a distance between the two or more light sources is greater than a predetermined threshold value.

公开(公告)号：US20240377246A1

公开(公告)日：2024-11-14

申请号：US18554594

申请日：2022-01-26

Applicant: UNM RAINFOREST INNOVATIONS

Inventor： Steven R. J. BRUECK ,  Alexander NEUMANN ,  Payman ZARKESH-HA

IPC: G01J1/06 ,  G01J1/44 ,  G01J3/02 ,  G01J3/18 ,  G01J3/28 ,  G02B6/12 ,  G02B6/122 ,  G02B6/124 ,  H01L27/144 ,  H01L31/02 ,  H01L31/0216 ,  H01L31/0232 ,  H01L31/103

Abstract: An occupancy sensor covering a wide field in an integrated chip is disclosed. The occupancy sensor includes an array of grating coupled waveguide sensors wherein continuous wave (cw) signals monitor an ambient light field for dynamic changes on times scales of seconds, and high frequency signals map in three-dimensions of the space using time-of-flight (TOF) measurements, pixel level electronics that perform signal processing; array level electronics that perform additional signal processing; and communications and site level electronics that interface with actuators to respond to occupancy sensing.

公开(公告)号：US11449102B2

公开(公告)日：2022-09-20

申请号：US16231266

申请日：2018-12-21

Applicant: GUANGDONG OPPO MOBILE TELECOMMUNICATIONS CORP., LTD.

Inventor： Anping Wu

IPC: G06F1/16 ,  H05K5/02 ,  G01S17/04 ,  H04M1/02 ,  H05K1/18 ,  H04N5/225 ,  H01L23/552 ,  H01L31/101 ,  G01J1/02 ,  G01J5/02 ,  G01J1/06 ,  G01J5/0806 ,  G01S7/481 ,  G01J1/42 ,  G01J5/04 ,  G01J1/04 ,  H04M1/72448 ,  H01L25/16

Abstract: An electronic device is provided, which includes an enclosure, an output component, a display screen and an optical sensor. The output component and the display screen are mounted on the enclosure. The output component includes a packaging shell, an infrared supplementary lighting lamp and a proximity infrared lamp; the packaging shell includes a packaging substrate; the infrared supplementary lighting lamp and the proximity infrared lamp are packaged in the packaging shell and born on the packaging substrate. The display screen is provided with a non-opaque entity region and includes a front surface capable of displaying a picture and a back surface back on to the front surface. The optical sensor is arranged on a side, where the back surface is positioned, of the display screen and corresponds to the non-opaque entity region.

公开(公告)号：US11175371B2

公开(公告)日：2021-11-16

申请号：US16600928

申请日：2019-10-14

Applicant: Imam Abdulrahman Bin Faisal University

Inventor： Khalid Asker Alshaibani

IPC: G01S3/786 ,  G01W1/10 ,  G01J1/06 ,  G01J1/42

Abstract: A rotating shadowband for shading a pyranometer includes a cylindrical ring and a semicircular shadowband held within the cylindrical ring, a motor configured for rotating the shadowband, at least one solar panel, a rechargeable battery, and a controller having circuitry configured to power the first motor to rotate the semicircular shadowband. The semicircular shadowband may include a window opening, wherein the window opening substantially extends from a center of the band to a first end. The controller rotates the shadowband 0 to 360 degrees about the central axis of the cylindrical ring to alternately shade the pyranometer for making diffuse radiation measurements and expose the pyranometer to direct solar radiation for making global radiation measurements. Alternatively, the shadowband may be solid and rotate pivotally 0 to 180 degrees or 0 to 360 degrees within the cylindrical ring to alternately shade and expose a pyranometer head to and from direct sunlight respectively.

公开(公告)号：US20210262854A1

公开(公告)日：2021-08-26

申请号：US17238444

申请日：2021-04-23

Applicant: UNM RAINFOREST INNOVATIONS

Inventor： Steven R.J. BRUECK ,  Alexander NEUMANN ,  Payman ZARKESH-HA

IPC: G01J1/06 ,  G01J3/02 ,  G01J3/18 ,  G01J1/44 ,  G01J3/28 ,  G02B6/122 ,  G02B6/124 ,  H01L27/144 ,  H01L31/02 ,  H01L31/0216 ,  H01L31/0232 ,  H01L31/103

Abstract: An occupancy sensor covering a wide field in an integrated chip is disclosed. The occupancy sensor includes an array of grating coupled waveguide sensors wherein continuous wave (cw) signals monitor an ambient light field for dynamic changes on times scales of seconds, and high frequency signals map in three-dimensions of the space using time-of-flight (TOF) measurements, pixel level electronics that perform signal processing; array level electronics that perform additional signal processing; and communications and site level electronics that interface with actuators to respond to occupancy sensing.

公开(公告)号：US11092481B2

公开(公告)日：2021-08-17

申请号：US16847422

申请日：2020-04-13

Applicant: Dongguan Ouyue Electronic Technology Co., Ltd

Inventor： Jinfang Ou

IPC: G01G1/42 ,  G01J1/42 ,  G01J1/02 ,  G01J1/06 ,  G06F3/0354 ,  G02B5/04

Abstract: An IC integrated structure for an optical mouse of the invention comprises a bracket configured for being connected with a PCB, an LED wafer for emitting light, a main control IC wafer and an optical lens; wherein the LED wafer and the main control IC wafer are respectively mounted at two ends of a terminal surface inside a bracket frame, the LED wafer and the main control IC wafer are connected with the PCB by the bracket, and the optical lens is mounted above the LED wafer and the main control IC wafer; a light shield configured for shielding an external light source is arranged between the optical lens and the main control IC wafer, and a through hole configured for transmitting light is formed in the light shield.

公开(公告)号：US11005001B2

公开(公告)日：2021-05-11

申请号：US15939636

申请日：2018-03-29

Applicant: AMS SENSORS SINGAPORE PTE. LTD.

Inventor： Hartmut Rudmann ,  Markus Rossi

IPC: H01L31/16 ,  H01L27/146 ,  G02B13/00 ,  H01L25/16 ,  H01L31/0232 ,  H01L31/167 ,  G02B3/00 ,  G01J1/02 ,  G01J5/04 ,  G01J1/04 ,  G01J1/06 ,  G01J1/42 ,  G01J5/00 ,  G01J5/02 ,  G01J5/20 ,  G01J5/08 ,  B29D11/00

Abstract: Manufacturing opto-electronic modules (1) includes providing a substrate wafer (PW) on which detecting members (D) are arranged; providing a spacer wafer (SW); providing an optics wafer (OW), the optics wafer comprising transparent portions (t) transparent for light generally detectable by the detecting members and at least one blocking portion (b) for substantially attenuating or blocking incident light generally detectable by the detecting members; and preparing a wafer stack (2) in which the spacer wafer (SW) is arranged between the substrate wafer (PW) and the optics wafer (OW) such that the detecting members (D) are arranged between the substrate wafer and the optics wafer. Emission members (E) for emitting light generally detectable by the detecting members (D) can be arranged on the substrate wafer (PW). Single modules (1) can be obtained by separating the wafer stack (2) into separate modules.

公开(公告)号：US20210033454A1

公开(公告)日：2021-02-04

申请号：US16847422

申请日：2020-04-13

Applicant: Dongguan Ouyue Electronic Technology Co., Ltd

Inventor： Jinfang Ou

IPC: G01J1/42 ,  G01J1/02 ,  G01J1/06 ,  G06F3/0354

Abstract: An IC integrated structure for an optical mouse of the invention comprises a bracket configured for being connected with a PCB, an LED wafer for emitting light, a main control IC wafer and an optical lens; wherein the LED wafer and the main control IC wafer are respectively mounted at two ends of a terminal surface inside a bracket frame, the LED wafer and the main control IC wafer are connected with the PCB by the bracket, and the optical lens is mounted above the LED wafer and the main control IC wafer; a light shield configured for shielding an external light source is arranged between the optical lens and the main control IC wafer, and a through hole configured for transmitting light is formed in the light shield.

公开(公告)号：US10656008B2

公开(公告)日：2020-05-19

申请号：US16168757

申请日：2018-10-23

Applicant: Sway sp. z o.o.

Inventor： Robert Mieczyslaw Lubas ,  Szymon Slupik ,  Maciej Witalinski

IPC: G01J1/02 ,  H05B39/04 ,  G01J1/06 ,  H05B47/11

Abstract: A method for discovering the topology of a connected lighting system. The method comprises: receiving a first measurement of a first light source in relation to a first sensor; receiving a second measurement of the first light source in relation to a second sensor; generating a first estimate of the position of the first light source, based on a first angle at the first sensor between (i) a first direction toward a current light source position and (ii) a second direction defined by the first measurement; generating a second estimate of the position of the first light source, based on a second angle at the second sensor between (i) a third direction toward the current light source position and (ii) a fourth direction defined by the second measurement; and generating an updated light source position of the first light source based on the first and second estimates.

公开(公告)号：US10066984B2

公开(公告)日：2018-09-04

申请号：US15808051

申请日：2017-11-09

Applicant: ROHM CO., LTD.

Inventor： Toshikazu Mukai ,  Jae-young Kim ,  Kazuisao Tsuruda

IPC: G01J5/02 ,  G01J1/02 ,  G01J1/06 ,  H01L31/02 ,  H01L31/167 ,  H01L31/0232 ,  H01L31/0304 ,  H01L31/109 ,  H01L31/0203

Abstract: The THz device module includes: a substrate; a THz device disposed on a front side surface of the substrate, and configured to oscillate or detect THz waves; a cap covering the THz device being separated from the THz device, and comprising an opening formed at a position opposite to the THz device in a vertical direction of the front side surface of the substrate; and a sealing member covering the opening of the cap so as to seal the THz device in conjunction with the substrate and the cap. A distance from the THz device to the sealing member is within a near-field pattern to which an electric field of the THz waves can be reached without interruption from a surface of the THz device to the sealing member. The THz device module efficiently emits or detects THz waves from the opening, thereby suppressing upsizing of the cap.