公开(公告)号：US20240379480A1

公开(公告)日：2024-11-14

申请号：US18315964

申请日：2023-05-11

Applicant: STATS ChipPAC Pte. Ltd.

Inventor： YongMoo Shin ,  SeongKuk Kim ,  SinJae Kim ,  SeokBeom Heo

IPC: H01L23/31 ,  H01L21/48 ,  H01L21/56 ,  H01L21/60 ,  H01L23/00 ,  H01L23/552

Abstract: A semiconductor device has a substrate. An electrical component is disposed over a first surface of the substrate. A solder paste is disposed over the first surface of the substrate. A conductive pillar is disposed on the solder paste. An encapsulant is deposited over the first surface of the substrate, the electrical component, and the conductive pillar. A solder bump is formed over the conductive pillar.

公开(公告)号：US20240355773A1

公开(公告)日：2024-10-24

申请号：US18638733

申请日：2024-04-18

Applicant: STATS ChipPAC Pte. Ltd.

Inventor： KyungEun KIM ,  HaengCheol CHOI ,  YoungJin WOO ,  HyunKyum KIM

IPC: H01L23/00 ,  H01L25/065

CPC classification number: H01L24/40 ,  H01L24/08 ,  H01L24/32 ,  H01L24/35 ,  H01L24/37 ,  H01L24/73 ,  H01L25/0657 ,  H01L24/16 ,  H01L24/48 ,  H01L2224/08225 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/35985 ,  H01L2224/37 ,  H01L2224/40225 ,  H01L2224/48227 ,  H01L2224/73253 ,  H01L2224/73255 ,  H01L2224/73257 ,  H01L2224/73263 ,  H01L2224/73265 ,  H01L2924/151

Abstract: A semiconductor device comprises: a substrate having a set of conductive patterns; a semiconductor die mounted on the substrate, wherein the semiconductor die has on its top surface a set of bonding pads; and a conductive bar assembly for electrically connecting the set of conductive patterns of the substrate with the set of bonding pads of the semiconductor die, wherein the conductive bar assembly comprises: an insulating body; and a set of conductive bars extending within the insulating body, wherein the set of conductive bars have a set of first ends exposed from a first surface of the insulating body to be electrically connected to the set of conductive patterns of the substrate and a set of second ends exposed from a second surface of the insulating body to be electrically connected to the set of bonding pads of the semiconductor die.

公开(公告)号：US20240355760A1

公开(公告)日：2024-10-24

申请号：US18302503

申请日：2023-04-18

Applicant: STATS ChipPAC Pte. Ltd.

Inventor： Peik Eng Ooi ,  Gai Leong Lai

IPC: H01L23/00

CPC classification number: H01L23/562 ,  H01L24/19 ,  H01L24/20 ,  H01L2224/19 ,  H01L2224/2105 ,  H01L2224/214 ,  H01L2224/215 ,  H01L2924/01013 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01079

Abstract: A semiconductor device has a substrate and a first RDL formed over the substrate. A second RDL is formed over the first RDL with a first conductive via electrically connecting the first RDL and second RDL and a first opening formed in the second RDL around the first conductive via for stress relief. The first opening formed in the second RDL can have a semi-circle shape or a plurality of semi-circles or segments. A third RDL is formed over the second RDL with a second conductive via electrically connecting the second RDL and third RDL and a second opening formed in the third RDL around the second conductive via for stress relief. The first opening is offset from the second opening. A plurality of first openings can be formed around the first conductive via for stress relief, each offset from one another.

公开(公告)号：US20240347477A1

公开(公告)日：2024-10-17

申请号：US18633538

申请日：2024-04-12

Applicant: STATS ChipPAC Pte. Ltd.

Inventor： ChangOh KIM ,  JinHee JUNG

IPC: H01L23/552 ,  H01L21/56

CPC classification number: H01L23/552 ,  H01L21/56

Abstract: A method for forming a shielding layer over a semiconductor package is provided. The method comprises: providing a jig having a metal frame and a carrier tape attached onto the metal frame via an adhesive layer; forming an opening through the adhesive layer and the carrier tape; disposing a semiconductor package on the jig over the opening such that the semiconductor package is supported on and attached to the carrier tape via the adhesive layer; forming a groove in the adhesive layer and around the opening by isotropic etching; forming a shielding layer over the semiconductor package and the jig; and removing the semiconductor package with the shielding layer from the jig.

公开(公告)号：US20240332051A1

公开(公告)日：2024-10-03

申请号：US18193820

申请日：2023-03-31

Applicant: STATS ChipPAC Pte. Ltd.

Inventor： Yaojian Lin ,  DanFeng Yang ,  SongHua Xu

IPC: H01L21/673

CPC classification number: H01L21/67383 ,  H01L21/67294

Abstract: A front opening unified pod has a housing and a plurality of horizontal support members disposed within the housing and adapted to accommodate a plurality of semiconductor wafers or panels. The plurality of semiconductor wafers or panels have a different size or shape, such as circular and rectangular. A first one of the plurality of horizontal support members has a wing to support the plurality of different size or shape semiconductor wafers or panels. The plurality of horizontal support members has a first side horizontal support member, a second side horizontal support member, and a center horizontal support member disposed between the first side horizontal support member and the second side horizontal support member. The plurality of horizontal support members is insertable into the housing. One or more of the plurality of horizontal support members has an opening for laser identification.

公开(公告)号：US12074135B2

公开(公告)日：2024-08-27

申请号：US18315991

申请日：2023-05-11

Applicant: STATS ChipPAC Pte. Ltd.

Inventor： Wagno Alves Braganca, Jr. ,  KyungOe Kim

IPC: H01L21/78 ,  H01L21/683 ,  H01L23/00

CPC classification number: H01L24/97 ,  H01L21/6835 ,  H01L21/78 ,  H01L24/16 ,  H01L24/81 ,  H01L2221/68327 ,  H01L2221/68372 ,  H01L2224/16235 ,  H01L2224/81005 ,  H01L2224/81224 ,  H01L2224/95001 ,  H01L2924/3511

Abstract: A semiconductor device has a semiconductor die and a support tape disposed over a back surface of the semiconductor die opposite an active surface of the semiconductor die. A portion of the back surface of the semiconductor wafer is removed to reduce its thickness. The semiconductor die is part of a semiconductor wafer, and the wafer is singulated to provide the semiconductor die with the support tape disposed on the back surface of the semiconductor die. The support tape can be a polyimide tape. A dicing tape is disposed over the support tape. The semiconductor die is disposed over a substrate. A laser emission is projected onto the semiconductor die to bond the semiconductor die to the substrate. The support tape provides stress relief to avoid warpage of the semiconductor die during the laser emission. The support tape is removed from the back surface of the semiconductor die.

公开(公告)号：US20240234292A1

公开(公告)日：2024-07-11

申请号：US18150634

申请日：2023-01-05

Applicant: STATS ChipPAC Pte. Ltd.

Inventor： YongMoo Shin ,  HeeSoo Lee ,  EunHee Myung

IPC: H01L23/498 ,  H01L21/48 ,  H01L21/56 ,  H01L23/31 ,  H01L25/10 ,  H01L25/16

CPC classification number: H01L23/49877 ,  H01L21/4853 ,  H01L21/4867 ,  H01L21/565 ,  H01L23/3107 ,  H01L23/49816 ,  H01L23/49833 ,  H01L23/49838 ,  H01L25/105 ,  H01L25/162 ,  H01L25/165 ,  H01L24/16

Abstract: A semiconductor device includes a first substrate and a second substrate. A graphene-coated interconnect is disposed between the first substrate and second substrate. A semiconductor die is disposed between the first substrate and second substrate. The first substrate is electrically coupled to the second substrate through the graphene-coated interconnect. An encapsulant is deposited between the first substrate and second substrate.

公开(公告)号：US20240194629A1

公开(公告)日：2024-06-13

申请号：US18351369

申请日：2023-07-12

Applicant: STATS ChipPAC Pte. Ltd.

Inventor： YongMoo Shin ,  HeeSoo Lee ,  SuJeong Kwon

IPC: H01L23/00 ,  H01L25/065 ,  H01L25/16 ,  H01L33/62 ,  H01L33/64

CPC classification number: H01L24/29 ,  H01L24/27 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L24/83 ,  H01L24/85 ,  H01L24/92 ,  H01L25/0652 ,  H01L25/16 ,  H01L33/62 ,  H01L33/641 ,  H01L33/644 ,  H01L24/05 ,  H01L24/33 ,  H01L24/97 ,  H01L2224/05573 ,  H01L2224/05611 ,  H01L2224/05624 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/2731 ,  H01L2224/29082 ,  H01L2224/29139 ,  H01L2224/29147 ,  H01L2224/29166 ,  H01L2224/29209 ,  H01L2224/29211 ,  H01L2224/29216 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/29324 ,  H01L2224/29338 ,  H01L2224/29347 ,  H01L2224/29355 ,  H01L2224/29386 ,  H01L2224/29493 ,  H01L2224/32145 ,  H01L2224/32245 ,  H01L2224/33181 ,  H01L2224/48091 ,  H01L2224/48105 ,  H01L2224/48137 ,  H01L2224/48245 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2224/83192 ,  H01L2224/83224 ,  H01L2224/8384 ,  H01L2224/858 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2924/01006 ,  H01L2924/01014 ,  H01L2924/014 ,  H01L2924/05432 ,  H01L2924/0549 ,  H01L2924/0635 ,  H01L2924/0665 ,  H01L2924/0675 ,  H01L2924/12041

Abstract: A semiconductor device has a substrate with a die pad. A conductive material is disposed on the die pad. The conductive material includes a plurality of graphene-coated metal balls in a matrix. A semiconductor die is disposed on the conductive material. The conductive material is sintered using an infrared laser. A bond wire is formed between the semiconductor die and substrate. An encapsulant is deposited over the semiconductor die and bond wire.

公开(公告)号：US20240170422A1

公开(公告)日：2024-05-23

申请号：US18429418

申请日：2024-01-31

Applicant: STATS ChipPAC Pte. Ltd.

Inventor： Wagno Alves Braganca, JR. ,  KyungOe Kim ,  TaeKeun Lee

IPC: H01L23/00 ,  B23K1/005 ,  H05K3/34

CPC classification number: H01L24/06 ,  B23K1/0056 ,  H01L24/03 ,  H05K3/34 ,  H01L2224/0363 ,  H05K2203/107

Abstract: A method of making a semiconductor device involves the steps of disposing a first semiconductor die over a substrate and disposing a beam homogenizer over the first semiconductor die. A beam from the beam homogenizer impacts the first semiconductor die. The method further includes the steps of determining a positional offset of the beam relative to the first semiconductor die in a number of pixels, using a first calibration equation to convert the number of pixels into a distance in millimeters, and moving the beam homogenizer the distance in millimeters to align the beam and first semiconductor die.

公开(公告)号：US20240128200A1

公开(公告)日：2024-04-18

申请号：US18046028

申请日：2022-10-12

Applicant: STATS ChipPAC Pte. Ltd.

Inventor： YongMoo Shin ,  SuJeong Kwon

IPC: H01L23/552 ,  H01L21/56 ,  H01L23/31

CPC classification number: H01L23/552 ,  H01L21/56 ,  H01L23/3128 ,  H01L23/5383

Abstract: A semiconductor device has a substrate and an electrical component disposed over the substrate. An encapsulant is deposited over the electrical component and substrate. A shielding layer has a graphene core shell formed on a surface of the encapsulant. The shielding layer can be printed on the encapsulant. The graphene core shell includes a copper core. The shielding layer has a plurality of cores covered by graphene and the graphene is interconnected within the shielding layer to form an electrical path. The shielding layer also has thermoset material or polymer or composite epoxy type matrix and the graphene core shell is embedded within the matrix. A shielding material can be disposed around the electrical component. The electrical path dissipates any charge incident on shielding layer, such as an ESD event, to reduce or inhibit the effects of EMI, RFI, and other inter-device interference.