公开(公告)号：US20090195125A1

公开(公告)日：2009-08-06

申请号：US12361031

申请日：2009-01-28

Applicant: Kiyotaka MATSUGI

Inventor： Kiyotaka MATSUGI

IPC: H01L41/053

CPC classification number: H03H9/1021 ,  B81B7/0041 ,  B81B2201/0271 ,  B81C2203/0145 ,  H01L23/10 ,  H01L2924/0002 ,  H01L2924/01079 ,  Y10T29/42 ,  H01L2924/00

Abstract: A piezoelectric device includes: a piezoelectric resonator element; a package storing the piezoelectric resonator element therein in a manner to mount the piezoelectric resonator element on a base portion thereof composed of at least three layers that are layered; and a through hole penetrating through the base portion. In the device, the through hole includes a first hole formed on a first layer which is positioned to face the piezoelectric resonator element among the three layers; a second hole formed on a second layer contacting with the first layer; a third hole formed larger than the second hole on a third layer contacting with the second layer; and a metal coat formed on an inner wall surface of the second hole, and a sealing part for sealing the package is formed with a sealant in at least the second hole.

Abstract translation: 压电装置包括：压电谐振元件; 以压电谐振元件的方式将压电谐振元件安装在由层叠的至少三层构成的基底部分上的封装; 以及穿过基部的通孔。 在该装置中，通孔包括形成在第一层上的第一孔，该第一层定位成面对三层之间的压电谐振元件; 形成在与第一层接触的第二层上的第二孔; 在与第二层接触的第三层上比第二孔大的第三孔; 以及形成在第二孔的内壁表面上的金属涂层和用于密封包装的密封部分至少在第二孔中形成有密封剂。

公开(公告)号：US20090184783A1

公开(公告)日：2009-07-23

申请号：US12357681

申请日：2009-01-22

Applicant: Yun-kwon Park ,  Sung-Woo Hwang ,  Jea-Shik Shin ,  Byeoung-Ju Ha ,  Jae-Sung Rieh ,  In-Sang Song ,  Yong-Kyu Kim ,  Byeong-Kwon Ju ,  Hee-Tae Kim

Inventor： Yun-kwon Park ,  Sung-Woo Hwang ,  Jea-Shik Shin ,  Byeoung-Ju Ha ,  Jae-Sung Rieh ,  In-Sang Song ,  Yong-Kyu Kim ,  Byeong-Kwon Ju ,  Hee-Tae Kim

IPC: H01P7/00 ,  H01L21/30

CPC classification number: H01L29/0665 ,  B81B2201/0271 ,  B81C1/00142 ,  B82Y10/00 ,  H01L29/0673 ,  H01L29/068 ,  H01L29/49 ,  H01L29/78 ,  Y10S977/936 ,  Y10S977/937 ,  Y10S977/938

Abstract: A resonant structure is provided, including a first terminal, a second terminal which faces the first terminal, a wire unit which connects the first terminal and the second terminal, a third terminal which is spaced apart at a certain distance from the wire unit and which resonates the wire unit, and a potential barrier unit which is formed on the wire unit and which provides a negative resistance component. Accordingly, transduction efficiency can be enhanced.

Abstract translation: 提供了一种谐振结构，包括第一端子，面向第一端子的第二端子，连接第一端子和第二端子的导线单元，与导线单元隔开一定距离的第三端子，以及 使导线单元谐振，以及形成在导线单元上并提供负电阻分量的势垒单元。 因此，可以提高转导效率。

公开(公告)号：US07544531B1

公开(公告)日：2009-06-09

申请号：US11770509

申请日：2007-06-28

Applicant: Charles Grosjean

Inventor： Charles Grosjean

IPC: H01L21/00 ,  H01L21/461 ,  H01L21/302

CPC classification number: B81C1/00952 ,  B81B2201/0271 ,  B81B2207/07 ,  H03H3/0072 ,  H03H9/02259 ,  H03H9/02433 ,  H03H9/2405 ,  H03H9/2431 ,  H03H2009/02472

Abstract: To suppress stiction of a MEMS resonator during fabrication, conductive structures of the MEMS resonator are electrically coupled via a ground strap during the step of forming isolation trenches around their contact structures. After the isolation trenches have been formed, the ground strap is transformed into a non-conductive material to complete the electrical isolation of the conductive structures. An etch mask formed on top of the ground strap prevents etching of the ground strap during the formation of the trenches. Depending on the etching process, the ground strap may be formed as a bridge that suspends above the isolation trench or as a column that extends down to the bottom of the isolation trench.

Abstract translation: 为了在制造期间抑制MEMS谐振器的静电，在谐振槽周围形成接触结构的步骤期间，MEMS谐振器的导电结构经由接地带电耦合。 在形成隔离沟槽之后，将接地带转变成非导电材料以完成导电结构的电隔离。 形成在接地带顶部上的蚀刻掩模防止了在形成沟槽期间对接地带的蚀刻。 取决于蚀刻工艺，接地带可以形成为悬挂在隔离沟槽之上的桥，或者形成为向下延伸到隔离沟槽的底部的柱。

公开(公告)号：US20080233349A1

公开(公告)日：2008-09-25

申请号：US11924924

申请日：2007-10-26

Applicant: Shohei Hata ,  Eiji Sakamoto ,  Naoki Matsushima

Inventor： Shohei Hata ,  Eiji Sakamoto ,  Naoki Matsushima

IPC: B32B3/24

CPC classification number: G01P15/0802 ,  B81B2201/0271 ,  B81C1/00269 ,  G01P1/023 ,  G01P15/0897 ,  H03H9/105 ,  H03H9/1057 ,  H03H9/173 ,  Y10T428/24273 ,  Y10T428/24322 ,  Y10T428/2462 ,  Y10T428/24826 ,  Y10T428/265

Abstract: The present invention provides a low-cost MEMS functional device by improving air tightness of a jointed section by anode junction in wafer level packaging for MEMS based functional devices. The MEMS functional device comprises a function element section formed by processing a substrate mainly made of Si, a metallized film for sealing formed around the functional element, and a glass substrate jointed to the metallized film for sealing by anode junction. Formed on a surface of the metallized film for sealing is a metallized film containing at least one of Sn and Ti as a main component.

Abstract translation: 本发明通过在基于MEMS的功能器件的晶片级封装中改善阳极结的接合部分的气密性来提供低成本MEMS功能器件。 MEMS功能器件包括通过处理主要由Si制成的衬底，形成在功能元件周围形成的用于密封的金属化膜形成的功能元件部分，以及连接到金属化膜的用于通过阳极接合进行密封的玻璃衬底。 形成在用于密封的金属化膜的表面上是以Sn和Ti中的至少一种为主要成分的金属化膜。

公开(公告)号：US20080093685A1

公开(公告)日：2008-04-24

申请号：US11876107

申请日：2007-10-22

Applicant: Toru Watanabe ,  Akira Sato ,  Shogo Inaba ,  Takeshi Mori

Inventor： Toru Watanabe ,  Akira Sato ,  Shogo Inaba ,  Takeshi Mori

IPC: H01L29/84

CPC classification number: B81B3/0086 ,  B81B2201/0271

Abstract: A microelectromechanical system (MEMS) device includes a semiconductor substrate, a MEMS including a fixed electrode and a movable electrode formed on the semiconductor substrate through an insulating layer, and a well formed in the semiconductor substrate below the fixed electrode. The well is one of an n-type well and a p-type well. The p-type well applies a positive voltage to the fixed electrode while the n-type well applies a negative voltage to the fixed electrode.

Abstract translation: 微机电系统（MEMS）器件包括半导体衬底，包括固定电极的MEMS和通过绝缘层形成在半导体衬底上的可移动电极，以及形成在固定电极下方的半导体衬底中的阱。 井是n型井和p型井之一。 p型阱对固定电极施加正电压，而n型阱对固定电极施加负电压。

公开(公告)号：US20080076211A1

公开(公告)日：2008-03-27

申请号：US11904859

申请日：2007-09-27

Applicant: Fabrice Casset ,  Cedric Durand ,  Pascal Ancey

Inventor： Fabrice Casset ,  Cedric Durand ,  Pascal Ancey

IPC: H01L21/56

CPC classification number: B81C1/0065 ,  B81B2201/0271 ,  B81B2207/015 ,  H03H3/0073 ,  H03H9/1057 ,  H03H9/2405 ,  H03H2009/02496

Abstract: Method for making an electromechanical component on a plane substrate and comprising at least one structure vibrating in the plane of the substrate and actuation electrodes. The method comprises at least the following steps in sequence: formation of the substrate comprising one silicon area partly covered by two insulating areas, formation of a sacrificial silicon and germanium alloy layer by selective epitaxy starting from the uncovered part of the silicon area, formation of a strongly doped silicon layer by epitaxy, comprising a monocrystalline area arranged on said sacrificial layer and two polycrystalline areas arranged on insulating areas, simultaneous formation of the vibrating structure and actuation electrodes, by etching of a predetermined pattern in the monocrystalline area designed to form spaces between the electrodes and the vibrating structure, elimination of said sacrificial silicon and germanium alloy layer by selective etching.

Abstract translation: 一种用于在平面基板上制造机电部件并且包括在所述基板和致动电极的平面中振动的至少一个结构的方法。 该方法至少包括以下步骤：基底的形成，其包括由两个绝缘区域部分覆盖的一个硅区域，通过从硅区域的未覆盖部分开始的选择性外延形成牺牲硅和锗合金层，形成 通过外延的强掺杂硅层，包括布置在所述牺牲层上的单晶区域和布置在绝缘区域上的两个多晶区域，同时形成振动结构和致动电极，通过在设计成形成空间的单晶区域中蚀刻预定图案 在电极和振动结构之间，通过选择性蚀刻消除所述牺牲硅和锗合金层。

公开(公告)号：US20070290364A1

公开(公告)日：2007-12-20

申请号：US11763801

申请日：2007-06-15

Applicant: Pavan GUPTA ,  Eric Razda

Inventor： Pavan GUPTA ,  Eric Razda

IPC: H01L23/52

CPC classification number: B81B7/0083 ,  B81B7/007 ,  B81B7/0077 ,  B81B2201/0271 ,  B81B2207/07 ,  B81B2207/094 ,  B81C1/0023 ,  B81C1/00301 ,  B81C1/00333 ,  B81C1/00341 ,  B81C2201/016 ,  B81C2203/0118 ,  B81C2203/0154 ,  H01L23/3107 ,  H01L23/34 ,  H01L23/498 ,  H01L2224/48091 ,  H01L2224/48245 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/01019 ,  H01L2924/10253 ,  H01L2924/1461 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/00012

Abstract: A stacked die package for an electromechanical resonator system includes a chip that contains an electromechanical resonator bonded onto the control chip for the electromechanical resonator by a thermally and/or electrically conductive epoxy. In various embodiments, the electromechanical resonator can be a micro-electromechanical system (MEMS) resonator or a nano-electromechanical system (NEMS) resonator. Packaging configurations that may include the chip that contains the electromechanical resonator and the control chip include chip-on-lead (COL), chip-on-paddle (COP), and chip-on-tape (COT) packages. The stacked die package provides small package footprint and/or low package thickness, as well as low thermal resistance and a robust conductive path between the chip that contains the electromechanical resonator and the control chip.

Abstract translation: 用于机电谐振器系统的堆叠管芯封装包括芯片，其包含通过热和/或导电环氧树脂粘合到用于机电谐振器的控制芯片上的机电谐振器。 在各种实施例中，机电谐振器可以是微机电系统（MEMS）谐振器或纳米机电系统（NEMS）谐振器。 可以包括包含机电谐振器和控制芯片的芯片的封装结构包括芯片引线（COL），片上芯片（COP）和片上芯片（COT）封装。 堆叠管芯封装提供小的封装封装和/或低封装厚度，以及低热阻和在包含机电谐振器的芯片和控制芯片之间的坚固的导电路径。

公开(公告)号：US20070170528A1

公开(公告)日：2007-07-26

申请号：US11336521

申请日：2006-01-20

Applicant: Aaron Partridge ,  Markus Lutz ,  Pavan Gupta

Inventor： Aaron Partridge ,  Markus Lutz ,  Pavan Gupta

IPC: H01L29/84

CPC classification number: B81C1/00277 ,  B81B7/0035 ,  B81B7/0058 ,  B81B7/007 ,  B81B2201/0271 ,  B81B2203/0315 ,  B81B2203/04 ,  B81B2207/07 ,  B81C1/00269 ,  B81C1/00301 ,  B81C2201/0171 ,  B81C2203/031 ,  B81C2203/036 ,  B81C2203/037 ,  B81C2203/038 ,  H01L23/051 ,  H01L41/1136 ,  H01L2924/0002 ,  H01L2924/00

Abstract: There are many inventions described and illustrated herein. In one aspect, the present inventions relate to devices, systems and/or methods of encapsulating and fabricating electromechanical structures or elements, for example, accelerometer, gyroscope or other transducer (for example, pressure sensor, strain sensor, tactile sensor, magnetic sensor and/or temperature sensor), filter or resonator. The fabricating or manufacturing microelectromechanical systems of the present invention, and the systems manufactured thereby, employ wafer bonding encapsulation techniques.

公开(公告)号：US20070170439A1

公开(公告)日：2007-07-26

申请号：US11600460

申请日：2006-11-16

Applicant: Aaron Partridge ,  Markus Lutz ,  Pavan Gupta

Inventor： Aaron Partridge ,  Markus Lutz ,  Pavan Gupta

IPC: H01L31/0312

CPC classification number: B81C1/00277 ,  B81B7/0035 ,  B81B7/0058 ,  B81B7/007 ,  B81B2201/0271 ,  B81B2203/0315 ,  B81B2203/04 ,  B81B2207/07 ,  B81C1/00269 ,  B81C1/00301 ,  B81C2201/0171 ,  B81C2203/031 ,  B81C2203/036 ,  B81C2203/037 ,  B81C2203/038 ,  H01L23/051 ,  H01L41/1136 ,  H01L2924/0002 ,  H01L2924/00

Abstract: There are many inventions described and illustrated herein. In one aspect, the present inventions relate to devices, systems and/or methods of encapsulating and fabricating electromechanical structures or elements, for example, accelerometer, gyroscope or other transducer (for example, pressure sensor, strain sensor, tactile sensor, magnetic sensor and/or temperature sensor), filter or resonator. The fabricating or manufacturing microelectromechanical systems of the present invention, and the systems manufactured thereby, employ wafer bonding encapsulation techniques.

Abstract translation: 这里描述和说明了许多发明。 一方面，本发明涉及包封和制造机电结构或元件的装置，系统和/或方法，例如加速度计，陀螺仪或其他换能器（例如，压力传感器，应变传感器，触觉传感器，磁传感器和 /或温度传感器），滤波器或谐振器。 本发明的制造或制造微机电系统及其制造的系统采用晶片接合封装技术。

公开(公告)号：US20070170438A1

公开(公告)日：2007-07-26

申请号：US11593500

申请日：2006-11-06

Applicant: Aaron Partridge ,  Markus Lutz ,  Pavan Gupta

Inventor： Aaron Partridge ,  Markus Lutz ,  Pavan Gupta

IPC: H01L31/0312

CPC classification number: B81C1/00277 ,  B81B7/0035 ,  B81B7/0058 ,  B81B7/007 ,  B81B2201/0271 ,  B81B2203/0315 ,  B81B2203/04 ,  B81B2207/07 ,  B81C1/00269 ,  B81C1/00301 ,  B81C2201/0171 ,  B81C2203/031 ,  B81C2203/036 ,  B81C2203/037 ,  B81C2203/038 ,  H01L23/051 ,  H01L41/1136 ,  H01L2924/0002 ,  H01L2924/00

Abstract: There are many inventions described and illustrated herein. In one aspect, the present inventions relate to devices, systems and/or methods of encapsulating and fabricating electromechanical structures or elements, for example, accelerometer, gyroscope or other transducer (for example, pressure sensor, strain sensor, tactile sensor, magnetic sensor and/or temperature sensor), filter or resonator. The fabricating or manufacturing microelectromechanical systems of the present invention, and the systems manufactured thereby, employ wafer bonding encapsulation techniques.