Abstract:
A system (120) for reflecting or redirecting incident light, microwave or sound energy includes a first substrate (144) configured to support an array of reflective elements (130) that can be angularly displaced through a range of substantially (90) degrees in response to a reflector angle control signal and a controller programmed to generate the reflector angle control signal to achieve desired incident energy, beam or wavefront redirection. The reflective elements (130) preferably comprise MEMS micro-reflector elements hingedly or movably attached to the first substrate (130) and define a reflective surface that is aimed at the source of incident light, microwave or sound energy.
Abstract:
A first oscillating portion is provided with a first piezoelectric element having a first drive electrode. A second oscillating portion has a central axis different from that of the first oscillating portion and is provided with a second piezoelectric element having a second drive electrode. The first drive electrode and the second drive electrode are connected together.
Abstract:
A microstructural body includes a substrate such as an electrode substrate, a support portion, one post that fixes the support portion to the substrate, a frame-shaped movable portion provided around outer periphery of the support portion, and an elastic support portion that elastically connects the movable portion and the support portion. The elastic support portion supports the frame-shaped movable portion such that the movable portion is movable relative to the support portion. The elastic support portion includes torsion springs and an elastically deformable connecting portion.
Abstract:
This disclosure provides systems, methods and apparatus for controlling a mechanical layer. In one aspect, an electromechanical systems device includes a substrate and a mechanical layer positioned over the substrate to define a gap. The mechanical layer is movable in the gap between an actuated position and a relaxed position, and includes a mirror layer, a cap layer, and a dielectric layer disposed between the mirror layer and the cap layer. The mechanical layer is configured to have a curvature in a direction away from the substrate when the mechanical layer is in the relaxed position. In some implementations, the mechanical layer can be formed to have a positive stress gradient directed toward the substrate that can direct the curvature of the mechanical layer upward when the sacrificial layer is removed.
Abstract:
An etchant for dielectrics, such as silicon dioxide, that leaves monocrystalline silicon surface exposed by the etchant free of etch damage, such as etch pits, when the etch is done in the presence of transition metals, such as copper, tungsten, titanium, gold, etc. The etchant comprises hydrofluoric acid and a source of halide anion, such as hydrochloric acid or a metal-halide. The etchant is useful in microelectromechanical system device fabrication and in deprocessing integrated circuits or the like.
Abstract:
MEMS and fabrication techniques for positioning the center of mass of released structures in MEMS are provided. In an embodiment, a minor substrate is affixed to a member partially released from a first substrate and a through hole formed in the second substrate is accessed to complete release of the member.
Abstract:
An apparatus for use with a digital micromirror device includes a hinge layer that is disposed outwardly from a substrate. The hinge layer including a hinge that is capable of at least partially supporting a micromirror that is disposed outwardly from the hinge. In one particular embodiment, the hinge and the substrate are separated by a first air gap. The device also including a first hinge support that is disposed outwardly from the substrate and inwardly from at least a portion of the hinge layer. The first hinge support being capable of transmitting a voltage to the hinge. At least a portion of the hinge support coupled to at least the portion of the hinge layer. In one particular embodiment, the first hinge support is formed in a process step that is different than a process step that forms the hinge layer.
Abstract:
One embodiment is a method of forming a circuit structure. The method comprises forming a first amorphous layer over a substrate; forming a first glue layer over and adjoining the first amorphous layer; forming a second amorphous layer over and adjoining the first glue layer; and forming a plurality of posts separated from each other by removing a first portion of the first amorphous layer and a first portion of the second amorphous layer. At least some of the plurality of posts each comprises a second portion of the first amorphous layer, a first portion of the first glue layer, and a second portion of the second amorphous layer.
Abstract:
A work hardening treatment which decreases the Young's modulus, and an age hardening treatment which recovers or increases the Young's modulus decreased by the work hardening treatment are performed to form a vibrating portion, thereby attaining a vibrating element (30) advantageous in downsizing while ensuring desired fatigue characteristics and vibration characteristics. This downsizes, for example, an actuator device (1), an optical scanning device, a video projection apparatus, and an image forming apparatus.
Abstract:
Methods and systems for electrical sensing, measurement and characterization of display elements are described. An embodiment includes integrating the electrical sensing, measurement and characterization with the display drive scheme. This embodiment allows for measurement of DC or operational hysteresis voltages and/or response times of interferometric modulator MEMS devices, for example, to be fully integrated with the display driver IC and/or the display drive scheme. Another embodiment allows these measurements to be performed and used without resulting in display artifacts visible to a human user. Another embodiment allows the measurement circuitry to be integrated with the display driver IC and/or the display drive scheme re-using several existing circuitry components and features, thus allowing for integration of the measurement method and its use relatively easily.