公开(公告)号：US07390377B1

公开(公告)日：2008-06-24

申请号：US11234607

申请日：2005-09-22

Applicant: Thomas I. Wallow ,  Marion C. Hunter ,  Karen Lee Krafcik ,  Alfredo M. Morales ,  Blake A. Simmons ,  Linda A. Domeier

Inventor： Thomas I. Wallow ,  Marion C. Hunter ,  Karen Lee Krafcik ,  Alfredo M. Morales ,  Blake A. Simmons ,  Linda A. Domeier

IPC: C09J5/02 ,  B31F1/12

CPC classification number: C09J5/02 ,  B29C65/02 ,  B29C65/4815 ,  B29C65/482 ,  B29C65/4825 ,  B29C65/4835 ,  B29C65/4845 ,  B29C65/5042 ,  B29C65/523 ,  B29C66/1122 ,  B29C66/324 ,  B29C66/53461 ,  B29C66/71 ,  B29C66/73921 ,  B29C66/83221 ,  B29C66/954 ,  B29C66/9592 ,  B29L2031/756 ,  B81B2201/058 ,  B81C3/001 ,  C08J5/121 ,  C08J5/122 ,  C09J2400/226 ,  B29K2023/38

Abstract: We demonstrate a new method for joining patterned thermoplastic parts into layered structures. The method takes advantage of case-II permeant diffusion to generate dimensionally controlled, activated bonding layers at the surfaces being joined. It is capable of producing bonds characterized by cohesive failure while preserving the fidelity of patterned features in the bonding surfaces. This approach is uniquely suited to production of microfluidic multilayer structures, as it allows the bond-forming interface between plastic parts to be precisely manipulated at micrometer length scales. The bond enhancing procedure is easily integrated in standard process flows and requires no specialized equipment.

Abstract translation: 我们展示了一种将图案化热塑性部件接合到分层结构中的新方法。 该方法利用壳II透过物扩散在连接的表面上产生尺寸受控的激活的结合层。 它能够产生以粘结破坏为特征的粘结，同时保持粘合表面中的图案特征的保真度。 该方法独特地适用于微流体多层结构的生产，因为它允许塑料部件之间的结合形成界面以微米的长度尺度被精确地操纵。 粘结增强程序很容易集成到标准工艺流程中，不需要专门的设备。

公开(公告)号：US20080095977A1

公开(公告)日：2008-04-24

申请号：US11773534

申请日：2007-07-05

Applicant: Joanna Aizenberg ,  Thomas Krupenkin ,  Oleksandr Sydorenko ,  Joseph Taylor

Inventor： Joanna Aizenberg ,  Thomas Krupenkin ,  Oleksandr Sydorenko ,  Joseph Taylor

IPC: B32B7/00 ,  B32B37/12 ,  B29C53/02

CPC classification number: B81B3/0032 ,  B01L3/502761 ,  B01L2300/0896 ,  B81B2201/047 ,  B81B2201/058 ,  B81B2201/06 ,  B81B2203/0361 ,  B81B2203/058 ,  B82Y30/00 ,  G02B5/1828 ,  Y10S310/80 ,  Y10T156/10 ,  Y10T428/24182 ,  Y10T428/24479

Abstract: Provided is an apparatus. In one embodiment, this apparatus includes a substrate having a surface, and a plurality of nanostructures each having a first end and a second end, wherein the first end of each of the plurality of nanostructures is attached to the surface. At least a portion of the second ends of the plurality of nanostructures, in this embodiment, are bent toward one another to form two or more similarly configured clumps each including two or more nanostructures.

Abstract translation: 提供了一种装置。 在一个实施例中，该装置包括具有表面的基板和多个纳米结构，每个纳米结构具有第一端和第二端，其中多个纳米结构中的每一个的第一端附接到该表面。 在该实施例中，多个纳米结构的第二端的至少一部分彼此弯曲以形成两个或更多个类似配置的团块，每个组合包括两个或多个纳米结构。

公开(公告)号：US20080073019A1

公开(公告)日：2008-03-27

申请号：US11945393

申请日：2007-11-27

Applicant: Victor Samper ,  Lin Cong ,  Hongmiao Ji

Inventor： Victor Samper ,  Lin Cong ,  Hongmiao Ji

IPC: B29C65/00

CPC classification number: B81C3/001 ,  B01L3/502707 ,  B01L2200/0689 ,  B01L2200/12 ,  B01L2200/141 ,  B01L2300/0887 ,  B01L2300/1827 ,  B81B2201/058 ,  Y10T137/2196 ,  Y10T156/10

Abstract: Microfluidics chips and methods of use are described, comprising a pair of wafers, at least one having a patterned surface, and two polymeric barrier films between the wafers conforming to the patterned surface. The polymeric barrier films allow the wafers of the inventive microfluidics chips to be reused without cleaning.

Abstract translation: 描述了微流体芯片和使用方法，包括一对晶片，至少一个具有图案化表面的晶片，以及在与图案化表面一致的晶片之间的两个聚合物阻挡膜。 聚合物阻挡膜允许本发明的微流体芯片的晶片在不进行清洁的情况下重复使用。

公开(公告)号：US20070217956A1

公开(公告)日：2007-09-20

申请号：US11753318

申请日：2007-05-24

Applicant: Vamsee Pamula ,  Michael Pollack ,  Richard Fair

Inventor： Vamsee Pamula ,  Michael Pollack ,  Richard Fair

IPC: B01L3/02 ,  B32B27/04 ,  B32B27/12 ,  B32B5/02

CPC classification number: G01N27/44769 ,  B01F13/0071 ,  B01F13/0076 ,  B01L3/502707 ,  B01L3/502792 ,  B01L7/52 ,  B01L2200/0673 ,  B01L2200/10 ,  B01L2200/12 ,  B01L2300/0645 ,  B01L2300/0663 ,  B01L2300/0819 ,  B01L2300/0864 ,  B01L2300/0867 ,  B01L2300/0887 ,  B01L2300/089 ,  B01L2300/12 ,  B01L2300/1827 ,  B01L2400/0415 ,  B01L2400/0424 ,  B81B3/0021 ,  B81B2201/058 ,  B81C1/00119 ,  C12Q1/6846 ,  G01N27/447 ,  G01N27/44791 ,  G05D7/0694 ,  H01L21/6715 ,  Y10T436/2575

Abstract: Methods for amplifying nucleic acid, such as DNA or RNA, on a printed circuit board (PCB) substrate are disclosed. The amplification can be achieved through a variety of methods such as thermocycling or isothermally. The printed circuit board substrate can comprise an array of electrodes for transporting droplets and can be part of a sandwich structure including a top plate parallel to the printed circuit board substrate.

Abstract translation: 公开了在印刷电路板（PCB）衬底上放大核酸如DNA或RNA的方法。 扩增可以通过各种方法如热循环或等温进行。 印刷电路板基板可以包括用于输送液滴的电极阵列，并且可以是包括平行于印刷电路板基板的顶板的夹层结构的一部分。

公开(公告)号：US07233000B2

公开(公告)日：2007-06-19

申请号：US10502465

申请日：2003-01-16

Applicant: Androula G. Nassiopoulou ,  Grigoris Kaltsas ,  Dimitrios N. Pagonis

Inventor： Androula G. Nassiopoulou ,  Grigoris Kaltsas ,  Dimitrios N. Pagonis

IPC: G01J5/20 ,  H01L27/14 ,  H01L31/0248 ,  H01L21/02

CPC classification number: B81C1/00071 ,  B81B2201/058 ,  B81B2203/0127 ,  B81B2203/0315 ,  B81C2201/0114 ,  B81C2201/0115 ,  G01F1/6845 ,  G01K7/028

Abstract: This invention provides a miniaturized silicon thermal flow sensor with improved characteristics, based on the use of two series of integrated thermocouples (6, 7) on each side of a heater (4), all integrated on a porous silicon membrane (2) on top of a cavity (3). Porous silicon (2) with the cavity (3) underneath provides very good thermal isolation for the sensor elements, so as the power needed to maintain the heater (4) at a given temperature is very low. The formation process of the porous silicon membrane (2) with the cavity (3) underneath is a two-step single electrochemical process. It is based on the fact that when the anodic current is relatively low, we are in a regime of porous silicon formation, while if this current exceeds a certain value we turn into a regime of electropolishing. The process starts at low current to form porous silicon (2) and it is then turned into electropolishing conditions to form the cavity (3) underneath. Various types of thermal sensor devices, such as flow sensors, gas sensors, IR detectors, humidity sensors and thermoelectric power generators are described using the proposed methodology. Furthermore the present invention provides a method for the formation of microfluidic channels (16) using the same technique of porous silicon (17) and cavity (16) formation.

Abstract translation: 本发明提供了一种基于在加热器（4）的每一侧上使用两个集成的热电偶（6,7）的系列，具有改进的特性的小型化硅热流量传感器，它们全部集成在顶部的多孔硅膜（2）上 的腔（3）。 具有下面的空腔（3）的多孔硅（2）为传感器元件提供了非常好的热隔离，因此将加热器（4）保持在给定温度所需的功率非常低。 多孔硅膜（2）与下面的腔（3）的形成过程是两步单电化学过程。 这是基于以下事实：当阳极电流相对较低时，我们处于多孔硅形成的状态，而如果该电流超过一定值，则我们变成电解抛光的方式。 该工艺以低电流开始形成多孔硅（2），然后转化为电解抛光条件以形成下面的空腔（3）。 使用所提出的方法描述了各种类型的热传感器装置，例如流量传感器，气体传感器，红外探测器，湿度传感器和热电发电机。 此外，本发明提供了使用与多孔硅（17）和空腔（16）相同的技术形成微流体通道（16）的方法。

公开(公告)号：US07229692B2

公开(公告)日：2007-06-12

申请号：US10774699

申请日：2004-02-09

Applicant: Anatoli V. Melechko ,  Timothy E. McKnight ,  Michael A. Guillorn ,  Bojan Ilic ,  Vladimir I. Merkulov ,  Mitchel J. Doktycz ,  Douglas H. Lowndes ,  Michael L. Simpson

Inventor： Anatoli V. Melechko ,  Timothy E. McKnight ,  Michael A. Guillorn ,  Bojan Ilic ,  Vladimir I. Merkulov ,  Mitchel J. Doktycz ,  Douglas H. Lowndes ,  Michael L. Simpson

IPC: B32B9/04

CPC classification number: B01D67/0062 ,  B01D67/0069 ,  B01D67/0072 ,  B01D71/02 ,  B01D71/027 ,  B01D2323/24 ,  B01D2325/08 ,  B01J23/755 ,  B01J35/0013 ,  B01J35/006 ,  B01J37/0238 ,  B01J37/342 ,  B01L3/5027 ,  B01L2300/0663 ,  B01L2300/0896 ,  B81B2201/058 ,  B81B2203/0361 ,  B81C1/00119 ,  B82Y30/00 ,  Y10S977/70 ,  Y10S977/781 ,  Y10S977/784 ,  Y10T428/13 ,  Y10T428/1303 ,  Y10T428/1352 ,  Y10T428/1359 ,  Y10T428/139 ,  Y10T428/24174 ,  Y10T428/24273 ,  Y10T428/24322 ,  Y10T428/2902 ,  Y10T428/2991 ,  Y10T428/31504 ,  Y10T428/31678

Abstract: Methods, manufactures, machines and compositions are described for nanotransfer and nanoreplication using deterministically grown sacrificial nanotemplates. An apparatus includes a substrate and a nanoconduit material coupled to a surface of the substrate, where the substrate defines an aperture and the nanoconduit material defines a nanoconduit that is i) contiguous with the aperture and ii) aligned substantially non-parallel to a plane defined by the surface of the substrate. An apparatus includes a substrate and a nanoreplicant structure coupled to a surface of the substrate.

Abstract translation: 使用确定性生长的牺牲纳米模板描述了用于纳米转移和纳米应用的方法，制造商，机器和组合物。 一种装置包括底物和耦合到衬底的表面的纳米管材料，其中衬底限定孔，并且纳米管材料限定纳米管，其是i）与孔邻接且ii）基本上不平行于所定义的平面排列 通过基板的表面。 一种装置包括与衬底的表面耦合的衬底和纳米复合结构。

公开(公告)号：US20070105339A1

公开(公告)日：2007-05-10

申请号：US11406848

申请日：2006-04-19

Applicant: Sadeg Faris

Inventor： Sadeg Faris

IPC: H01L21/30

CPC classification number: B81C1/00119 ,  B81B2201/058 ,  B81C1/00238 ,  B81C1/0038 ,  B81C2201/019 ,  G01R31/01 ,  H01L22/20 ,  H01L2224/13 ,  H01L2224/16 ,  H01L2924/014 ,  H01L2924/1305 ,  H01L2924/13091 ,  H01L2924/00

Abstract: A method for fabricating multi layer microelectromechanical and microfluidic devices is disclosed. Multi layer microelectromechanical and microfluidic devices are fabricated on a substrate with layers of predetermined weak and strong bond regions where deconstucted layers of devices at or on the weak bond regions. The layers are then peeled and subsequently bonded to produce a multi layer microelectromechanical and microfluidic devices. An arbitrary number of layers can be bonded and stacked to create either microelectromechanical or microfluidic device or a hyrbid type of device. Also disclosed are methods of creating edge interconnects and vias through the substrate to form interconnections between layers and devices thereon.

Abstract translation: 公开了一种用于制造多层微机电和微流体装置的方法。 多层微机电和微流体装置制造在具有预定的弱和强结合区域的层的衬底上，其中在弱结合区域处或弱结合区上的器件的解构层。 然后将这些层剥离并随后键合以产生多层微机电和微流体装置。 任意数量的层可以被结合和层叠以产生微机电或微流体装置或者高密度类型的装置。 还公开了通过衬底产生边缘互连和通孔以在其上的层和器件之间形成互连的方法。

公开(公告)号：US07169251B2

公开(公告)日：2007-01-30

申请号：US10436657

申请日：2003-05-13

Applicant: Lingjie J Guo ,  Xing Cheng

Inventor： Lingjie J Guo ,  Xing Cheng

IPC: B82B3/00 ,  B82B1/00 ,  B37B37/02

CPC classification number: B81C1/00119 ,  B01L3/502707 ,  B01L3/502715 ,  B01L2200/12 ,  B01L2300/0681 ,  B01L2300/0896 ,  B01L2400/0418 ,  B01L2400/0421 ,  B01L2400/086 ,  B81B2201/058 ,  B81B2203/0338 ,  B81C2201/0153 ,  B82Y30/00 ,  G01N2021/058 ,  Y10S977/78 ,  Y10S977/84 ,  Y10S977/882

Abstract: A method of forming nanofluidic enclosed channels includes providing a first substrate having a layer of a first material disposed thereon. A plurality of nanoscale slots is formed along a second substrate using nanolithography, etching, or other disclosed techniques. The first substrate is then bonded to the second substrate such that the layer of the first material on the first substrate is adjacent the plurality of slots on the second substrate to define a plurality of enclosed nanofluidic channels therethrough.

Abstract translation: 形成纳流体封闭通道的方法包括提供具有设置在其上的第一材料层的第一基底。 使用纳米光刻，蚀刻或其它公开的技术沿着第二基板形成多个纳米级槽。 然后将第一衬底接合到第二衬底，使得第一衬底上的第一材料层与第二衬底上的多个槽相邻以限定穿过其中的多个封闭的纳米流体通道。

公开(公告)号：US20070020772A1

公开(公告)日：2007-01-25

申请号：US11536178

申请日：2006-09-28

Applicant: Han Cao ,  Jonas Tegenfeldt ,  Stephen Chou ,  Robert Austin

Inventor： Han Cao ,  Jonas Tegenfeldt ,  Stephen Chou ,  Robert Austin

IPC: H01L21/00

CPC classification number: G01N21/6486 ,  B01L3/502707 ,  B01L3/502715 ,  B01L3/502746 ,  B01L3/502761 ,  B01L2200/027 ,  B01L2200/0663 ,  B01L2200/12 ,  B01L2300/0654 ,  B01L2300/0896 ,  B01L2400/0415 ,  B01L2400/086 ,  B81B2201/058 ,  B81C1/00119 ,  B81C2201/0157 ,  B81C2201/0159 ,  B82Y30/00 ,  G01N33/48721 ,  G03F7/2008 ,  Y10T436/143333

Abstract: The present invention relates to a device for interfacing nanofluidic and microfluidic components suitable for use in performing high throughput macromolecular analysis. Diffraction gradient lithography (DGL) is used to form a gradient interface between a microfluidic area and a nanofluidic area. The gradient interface area reduces the local entropic barrier to nanochannels formed in the nanofluidic area. In one embodiment, the gradient interface area is formed of lateral spatial gradient structures for narrowing the cross section of a value from the micron to the nanometer length scale. In another embodiment, the gradient interface area is formed of a vertical sloped gradient structure. Additionally, the gradient structure can provide both a lateral and vertical gradient.

Abstract translation: 本发明涉及适用于进行高通量大分子分析的纳米流体和微流体组分的界面装置。 衍射梯度光刻（DGL）用于在微流体区域和纳流体区域之间形成梯度界面。 梯度界面面积减小了在纳米流体区域形成的纳米通道的局部熵阻挡。 在一个实施例中，梯度界面区域由横向空间梯度结构形成，用于使从微米到纳米长度尺度的值的横截面变窄。 在另一个实施例中，梯度界面区域由垂直倾斜梯度结构形成。 此外，梯度结构可以提供横向和垂直梯度。

公开(公告)号：US07158159B2

公开(公告)日：2007-01-02

申请号：US11003067

申请日：2004-12-02

Applicant: Timothy Beerling ,  Marco Aimi

Inventor： Timothy Beerling ,  Marco Aimi

IPC: B41J2/14

CPC classification number: B01L3/0262 ,  B01L2200/12 ,  B01L2300/0819 ,  B01L2400/0487 ,  B81B1/004 ,  B81B2201/057 ,  B81B2201/058 ,  B81B2203/0353 ,  H01H11/02 ,  H01H2029/008 ,  Y10T428/24273 ,  Y10T428/2902

Abstract: A micro-machined nozzle includes a substrate having a hole formed on a first side that extends partially through a thickness dimension of the substrate and a nozzle orifice formed on a second opposite side that communicates with the hole. The nozzle orifice has at least a portion of its interior wall serrated. A method of fabricating a micro-machined nozzle includes the steps of etching a first side of a silicon substrate to form a hole that extends partially through a thickness dimension of the substrate and etching a second opposite side of the silicon substrate to form a serrated nozzle orifice that communicates with the hole.

Abstract translation: 微加工喷嘴包括：基板，其具有形成在第一侧上的部分地延伸穿过基板的厚度尺寸的孔;以及形成在与孔连通的第二相对侧上的喷嘴孔。 喷嘴孔具有其内壁的至少一部分锯齿状。 一种制造微加工喷嘴的方法包括以下步骤：蚀刻硅衬底的第一面以形成部分延伸穿过衬底的厚度尺寸并蚀刻硅衬底的第二相对侧以形成锯齿形喷嘴的孔 孔与孔连通。