公开(公告)号：US07255800B1

公开(公告)日：2007-08-14

申请号：US10710984

申请日：2004-08-16

Applicant: Shekhar Bhansali ,  Abdu Rub Abdur ,  Sunny Kedia

Inventor： Shekhar Bhansali ,  Abdu Rub Abdur ,  Sunny Kedia

IPC: B44C1/22

CPC classification number: B81C1/005 ,  B81B2203/0353 ,  B81C1/00619 ,  B81C2201/0115 ,  B81C2201/0133 ,  B81C2201/0136 ,  H01L21/02052 ,  H01L21/3063

Abstract: The present invention illustrates a bulk silicon etching technique that yields straight sidewalls, through wafer structures in very short times using standard silicon wet etching techniques. The method of the present invention employs selective porous silicon formation and dissolution to create high aspect ratio structures with straight sidewalls for through wafer MEMS processing.

Abstract translation: 本发明示出了使用标准硅湿式蚀刻技术在非常短的时间内通过晶片结构产生直的侧壁的体硅蚀刻技术。 本发明的方法采用选择性多孔硅形成和溶解以产生具有用于晶片MEMS加工的直侧壁的高纵横比结构。

公开(公告)号：US20070134829A1

公开(公告)日：2007-06-14

申请号：US11637020

申请日：2006-12-12

Applicant: Nicolle Wilke ,  Anthony Morrissey

Inventor： Nicolle Wilke ,  Anthony Morrissey

IPC: H01L21/00

CPC classification number: A61M37/0015 ,  A61M2037/003 ,  A61M2037/0046 ,  A61M2037/0053 ,  B81B2201/055 ,  B81C1/00626 ,  B81C99/0065 ,  B81C2201/0133 ,  B81C2201/0138

Abstract: A method of wet etching produces high-precision microneedle arrays for use in medical applications. The method achieves precise process control over microneedle fabrication, at single wafer or batch-level, using wet etching of silicon with potassium hydroxide (KOH) solution by accurately identifying the etch time endpoint. Hence, microneedles of an exactly required height, shape, sharpness and surface quality are achieved. The outcome is a reliable, reproducible, robust and relatively inexpensive microneedle fabrication process. Microneedles formed by KOH wet etching have extremely smooth surfaces and exhibit superior mechanical and structural robustness to their dry etched counterparts. These properties afford extra reliability to such silicon microneedles, making them ideal for medical applications. The needles can also be hollowed. Wet etched silicon microneedles can then be employed as masters to replicate the improved surface and structural properties in other materials (such as polymers) by moulding.

Abstract translation: 湿蚀刻的方法产生用于医疗应用的高精度微针阵列。 该方法通过精确地识别蚀刻时间终点，通过使用氢氧化钾（KOH）溶液对硅进行湿蚀刻，在单晶片或批次水平上实现了微针制造的精确过程控制。 因此，实现了精确要求的高度，形状，锐度和表面质量的微针。 结果是可靠，可重现，稳健且相对便宜的微针制作工艺。 通过KOH湿蚀刻形成的微针具有非常光滑的表面，并且对其干蚀刻的对应物表现出优异的机械和结构坚固性。 这些性能为这种硅微针提供了额外的可靠性，使其成为医疗应用的理想选择。 针也可以是中空的。 湿法蚀刻的硅微针可用作主机，通过模制复制其他材料（如聚合物）中改进的表面和结构性能。

公开(公告)号：US20070117243A1

公开(公告)日：2007-05-24

申请号：US11286065

申请日：2005-11-22

Applicant: Manish Sharma

Inventor： Manish Sharma

IPC: H01L21/00 ,  H01L21/4763

CPC classification number: B81C1/00063 ,  B81B2201/06 ,  B81C2201/0133 ,  B81C2201/0153

Abstract: The present invention provides a method of fabricating a biosensor. The method includes providing a substrate which has a surface coating. The surface coating is deformable and the substrate includes a layered structure which has at least two electrically conductive layers separated by at least one electrically insulating layer. The method also includes imprinting a structure into the surface coating. Further, the method includes etching at least a region of the imprinted structure and the substrate to remove at least a portion of the structure and the substrate. The structure is shaped so that the etching forms at least a portion of the biosensor in the substrate and exposes at least a portion of each electrically conductive layer to form electrodes of the biosensor.

Abstract translation: 本发明提供一种制造生物传感器的方法。 该方法包括提供具有表面涂层的基底。 表面涂层是可变形的，并且衬底包括具有由至少一个电绝缘层分开的至少两个导电层的分层结构。 该方法还包括将结构压印到表面涂层中。 此外，所述方法包括蚀刻所述压印结构的至少一个区域和所述基板以去除所述结构和所述基板的至少一部分。 该结构被成形为使得蚀刻形成衬底中的生物传感器的至少一部分并且暴露出每个导电层的至少一部分以形成生物传感器的电极。

公开(公告)号：US20060057761A1

公开(公告)日：2006-03-16

申请号：US11256959

申请日：2005-10-25

Applicant: Xiaoyu Mi ,  Norinao Kouma ,  Osamu Tsuboi ,  Masafumi Iwaki ,  Hisao Okuda ,  Hiromitsu Soneda ,  Satoshi Ueda ,  Ippei Sawaki

Inventor： Xiaoyu Mi ,  Norinao Kouma ,  Osamu Tsuboi ,  Masafumi Iwaki ,  Hisao Okuda ,  Hiromitsu Soneda ,  Satoshi Ueda ,  Ippei Sawaki

IPC: H01L21/00

CPC classification number: B81C1/00547 ,  B81B2201/042 ,  B81B2203/0136 ,  B81C2201/0132 ,  B81C2201/0133 ,  G01P15/0802 ,  G02B26/0841

Abstract: A method of making a microstructure with thin wall portions (T1-T3) includes a step of performing a first etching process to a material substrate having a laminate structure including a first conductive layer (11) and a second conductive layer (12) having a thickness of the thin wall portions (T1-T3), where the etching is performed from the side of the first conductive layer (11) thereby forming in the second conductive layer (12) pre thin wall portions (T1′-T3′) which has a pair of side surfaces apart from each other in an in-plane direction of the second conductive layer (12) and contact the first conductive layer (11). The method also includes a step of performing a second etching process from the side of the first conductive layer (11) for removing part of the first conductive layer (11) contacting the pre thin wall portions (T1′-T3′) to form the thin wall portions.

Abstract translation: 制造具有薄壁部分（T 1 -T 3）的微结构的方法包括对具有包括第一导电层（11）和第二导电层（12）的层压结构的材料基板进行第一蚀刻工艺的步骤， 具有薄壁部分（T 1 -T 3）的厚度，其中从第一导电层（11）的侧面进行蚀刻，从而在第二导电层（12）中形成预薄壁部分（T 1' -T 3'），其在第二导电层（12）的面内方向上具有彼此分离的一对侧表面，并与第一导电层（11）接触。 该方法还包括从第一导电层（11）侧进行第二蚀刻处理以去除与预薄壁部分（T 1'-T 3'）接触的第一导电层（11）的一部分的步骤 形成薄壁部分。

公开(公告)号：US20050202585A1

公开(公告)日：2005-09-15

申请号：US11000652

申请日：2004-11-30

Applicant: Mark Eskridge

Inventor： Mark Eskridge

IPC: B81B3/00 ,  G01P15/08 ,  G01P15/097 ,  G01P15/10 ,  G01P15/125 ,  H01L21/00 ,  G01P15/00

CPC classification number: G01P15/125 ,  B81B3/0051 ,  B81B2201/0235 ,  B81B2203/0181 ,  B81B2203/058 ,  B81C2201/0133 ,  G01P15/08 ,  G01P15/097 ,  G01P2015/0828 ,  G01P2015/0831

Abstract: A method for suspending a movable structure form a support structure wherein first and second flat and thin arcuately shaped flexures are formed having spaced apart substantially planar and parallel opposing surfaces, each of the first and second flexures being structured for connection between a support structure and a movable structure to be suspended from the support structure and being aligned along a common axis of rotation between the support structure and the movable structure.

Abstract translation: 一种用于将可移动结构悬挂形成支撑结构的方法，其中形成具有间隔开的基本上平坦且平行的相对表面的第一和第二扁平和细弧形弯曲的弯曲部，所述第一和第二挠曲中的每一个构造成用于在支撑结构和 可移动结构从支撑结构悬挂并且沿着支撑结构和可移动结构之间的公共旋转轴对准。

公开(公告)号：US06831765B2

公开(公告)日：2004-12-14

申请号：US10073304

申请日：2002-02-13

Applicant: Susumu Yasuda ,  Hidemasa Mizutani ,  Takayuki Yagi ,  Yasuhiro Shimada ,  Futoshi Hirose ,  Takahisa Kato

Inventor： Susumu Yasuda ,  Hidemasa Mizutani ,  Takayuki Yagi ,  Yasuhiro Shimada ,  Futoshi Hirose ,  Takahisa Kato

IPC: G02B2608

CPC classification number: G02B26/105 ,  B81B3/0051 ,  B81B3/0067 ,  B81B2201/038 ,  B81B2201/042 ,  B81B2203/0181 ,  B81B2203/058 ,  B81C2201/0133 ,  G02B26/0841 ,  Y10S359/90 ,  Y10S359/904

Abstract: The tiltable-body apparatus including a frame member, a tiltable body, and a pair of torsion springs having a twisting longitudinal axis. The torsion springs are disposed along the twisting longitudinal axis opposingly with the tiltable body being interposed, support the tiltable body flexibly and rotatably about the twisting longitudinal axis relative to the frame member, and include a plurality of planar portions, compliant directions of which intersect each other when viewed along a direction of the twisting longitudinal axis. A center of gravity of the tiltable body is positioned on the twisting longitudinal axis of the torsion springs.

Abstract translation: 可倾斜体装置包括框架构件，可倾斜体和具有扭转纵向轴线的一对扭转弹簧。 扭转弹簧沿着与可倾斜主体相对的扭转纵向轴线布置，其相对于框架构件围绕扭转纵向轴线柔性地和可旋转地支撑可倾斜体，并且包括多个平面部分，顺应方向与每个 另外当沿着扭转纵向轴线的方向观察时。 可倾斜体的重心位于扭转弹簧的扭转纵向轴线上。

公开(公告)号：US20040065637A1

公开(公告)日：2004-04-08

申请号：US10242213

申请日：2002-09-12

Applicant: Network Photonics, Inc.

Inventor： Bevan Staple ,  Jillian Buriak

IPC: C23F001/00

CPC classification number: B82Y30/00 ,  B81C1/00476 ,  B81C1/00801 ,  B81C2201/0114 ,  B81C2201/0133 ,  B81C2201/0139 ,  B81C2201/053

Abstract: A microelectromechanical structure is formed by depositing sacrificial and structural material over a substrate to form a structural layer on a component electrically attached with the substrate. The galvanic potential of the structural layer is greater than the galvanic potential of the component. At least a portion of the structural material is covered with a protective material that has a galvanic potential less than or equal to the galvanic potential of the component. The sacrificial material is removed with a release solution. At least one of the protective material and release solution is surfactanated, the surfactant functionalizing a surface of the component.

Abstract translation: 通过将牺牲和结构材料沉积在衬底上以在与衬底电连接的部件上形成结构层来形成微机电结构。 结构层的电位大于元件的电位。 结构材料的至少一部分被保护材料覆盖，该保护材料具有小于或等于部件的电位的电位。 牺牲材料用释放溶液除去。 保护材料和释放溶液中的至少一种被表面活性化，表面活性剂对组分的表面进行官能化。

公开(公告)号：US20020135266A1

公开(公告)日：2002-09-26

申请号：US09905037

申请日：2001-07-13

Inventor： Zine Eddine Boutaghou

IPC: H02N002/00

CPC classification number: B81C1/00103 ,  B81B2203/0346 ,  B81B2203/0361 ,  B81B2203/0376 ,  B81C1/00404 ,  B81C1/00547 ,  B81C1/00626 ,  B81C2201/0133 ,  C04B41/009 ,  C04B41/5346 ,  C04B41/91 ,  G11B5/4813 ,  C04B35/00

Abstract: The device of the present invention facilitates engaging mating elements, such as actuators used in disc drives, with a pattern on the device. The improved device includes arcuate edges between at least one of the sidewalls in the pattern and the surface of the device. The arcuate edges minimize some of the fracturing of the device that typically occurs when a mating element is inserted on or into the device. The present invention also relates to a method of fabricating a device. The method comprises positioning a mask in the form of a pattern relative to the device, and then etching the pattern into a surface on the device to form at least one sidewall and an arcuate edge such that the arcuate edge extends between the surface on the device and one of the sidewalls.

Abstract translation: 本发明的装置有助于将配合元件（例如在盘驱动器中使用的致动器）与设备上的图案相啮合。 改进的装置包括图案中的至少一个侧壁和装置的表面之间的弧形边缘。 弧形边缘最小化当将配合元件插入或插入设备时通常发生的装置的一些破裂。 本发明还涉及一种制造装置的方法。 所述方法包括以相对于所述装置的图案的形式定位掩模，然后将所述图案刻蚀到所述装置上的表面中以形成至少一个侧壁和弓形边缘，使得所述弧形边缘在所述装置上的所述表面之间延伸 和一个侧壁。

公开(公告)号：US20020123048A1

公开(公告)日：2002-09-05

申请号：US09848727

申请日：2001-05-03

Inventor： Vincent Jen-Jr. Gau

IPC: C12Q001/68 ,  G01N033/53 ,  C12Q001/00 ,  G01F001/64

CPC classification number: B01L3/5088 ,  B01J2219/00317 ,  B01J2219/00497 ,  B01J2219/00585 ,  B01J2219/00596 ,  B01J2219/00605 ,  B01J2219/0061 ,  B01J2219/00612 ,  B01J2219/00617 ,  B01J2219/00619 ,  B01J2219/00621 ,  B01J2219/0063 ,  B01J2219/00637 ,  B01J2219/00653 ,  B01J2219/00659 ,  B01J2219/00702 ,  B01J2219/00722 ,  B01J2219/00725 ,  B81C2201/0133 ,  B82Y30/00 ,  C12Q1/68 ,  C12Q1/6876 ,  C12Q2600/156 ,  C40B40/06 ,  C40B40/10 ,  C40B60/14 ,  G01N27/3277

Abstract: A microelectromechanical systems (MEMS) and integrated circuit (IC) based biosensor capable of sensing or detecting various ionic molecules and macromelecules (DNA, RNA or protein). The MEMS based biosensor may utilize a hybridization and enzyme amplification scheme and an electrochemical detection scheme for sensitivity improvement and system miniaturization. The biosensor or biosensors are incorporated on a single substrate. Preferably, the biosensor system comprises at least two electrodes. The electrodes may comprise a working electrode, a reference electrode and a counter (auxiliary) electrode. The biosensor or biosensors also provide an apparatus and method for confinement of reagent and/or solution in the biosensor or biosensors using surface tension at small scale. The confinement system provides controlled contacts between the reagent(s) and/or solution(s) with the components (i.e., electrodes) of the biosensor or biosensors using controllable surface properties and surface tension forces. The confinement system allows for incorporation of the biosensor or biosensors into a portable or handheld device and is immune to shaking and/or flipping. The invention also provide for a biosensor and/or sensors that are integrated with integrated circuit (IC) technologies. Preferably, the entire sensor system or systems are fabricated on a single IC substrate or chip and no external component and/or instrument is required for a complete detection system or systems. Preferably, the sensor system or systems are fabricated using the IC process and on a silicon substrate.

Abstract translation: 基于微机电系统（MEMS）和基于集成电路（IC）的生物传感器能够感测或检测各种离子分子和大分子（DNA，RNA或蛋白质）。 基于MEMS的生物传感器可以利用杂交和酶扩增方案和用于灵敏度改善和系统小型化的电化学检测方案。 生物传感器或生物传感器结合在单个基底上。 优选地，生物传感器系统包括至少两个电极。 电极可以包括工作电极，参考电极和计数器（辅助）电极。 生物传感器或生物传感器还提供了使用小规模的表面张力限制生物传感器或生物传感器中的试剂和/或溶液的装置和方法。 限制系统使用可控的表面性质和表面张力提供试剂和/或溶液与生物传感器或生物传感器的组分（即电极）之间的受控接触。 限制系统允许将生物传感器或生物传感器并入便携式或手持式装置中，并且不受摇动和/或翻转的影响。 本发明还提供了与集成电路（IC）技术集成的生物传感器和/或传感器。 优选地，整个传感器系统或系统制造在单个IC衬底或芯片上，并且对于完整的检测系统或系统不需要外部组件和/或仪器。 优选地，传感器系统或系统使用IC工艺和硅衬底制造。

公开(公告)号：US20010046346A1

公开(公告)日：2001-11-29

申请号：US09366428

申请日：1999-08-02

Inventor： BRENT E. BURNS

IPC: G02B006/35

CPC classification number: G02B26/085 ,  B81B2201/047 ,  B81C1/00182 ,  B81C2201/0133 ,  B81C2201/014 ,  G02B6/3518 ,  G02B6/3572 ,  G02B6/3584 ,  G02B26/0833

Abstract: An opto-mechanical micro-switch has a micromachined structure fabricated from a single silicon substrate. The micromachined structure includes an inner frame connected by a pair of beams to an outer frame. The beams define an axis of rotation around which the inner frame rotates relative to the outer frame. Flat walls are formed on the inner frame by an anisotropic etching process. When the inner frame rotates relative to the outer frame, the flat wall pivots into a vertical position to reflect or impede light passing from a light source to a light receiver. During fabrication, etch-stop material is selectively deposited in predefined regions of the single silicon substrate, and then a masking layer is formed and patterned. The anisotropic etching process is then performed through openings in the masking layer to form the inner frame and the outer frame. The etch-stop material prevents etching in the predefined regions that are located between the inner and outer frames, thereby forming the beams. In one embodiment, Permalloy regions are formed on the inner frame prior to the anisotropic etching process. These Permalloy regions are subsequently utilized as part of a drive motor to rotate the inner frame relative to the outer frame.

Abstract translation: 光机械微型开关具有由单个硅衬底制造的微加工结构。 微加工结构包括通过一对梁连接到外框架的内框架。 梁限定旋转轴线，内框架围绕其旋转相对于外框架。 通过各向异性蚀刻工艺在内框架上形成平坦的壁。 当内框架相对于外框架旋转时，平壁枢转成垂直位置以反射或阻碍从光源通向光接收器的光。 在制造期间，将蚀刻停止材料选择性地沉积在单个硅衬底的预定区域中，然后形成掩模层并构图。 然后通过掩模层中的开口进行各向异性蚀刻工艺以形成内框架和外框架。 蚀刻停止材料防止位于内框架和外框架之间的预定区域中的蚀刻，从而形成梁。 在一个实施例中，在各向异性蚀刻工艺之前，在内框架上形成坡莫合金区域。 这些坡莫合金区域随后被用作驱动马达的一部分，以使内框架相对于外框架旋转。