公开(公告)号：US08025831B2

公开(公告)日：2011-09-27

申请号：US10852448

申请日：2004-05-24

Applicant: Yen Peng Kong ,  Hong Yee Low ,  Stella W. Pang ,  Albert F. Yee

Inventor： Yen Peng Kong ,  Hong Yee Low ,  Stella W. Pang ,  Albert F. Yee

IPC: B27N3/08 ,  B28B5/00 ,  A61M25/00 ,  B28B5/02 ,  B32B3/00 ,  B32B5/16

CPC classification number: A61M25/00 ,  B27N3/08 ,  B28B3/06 ,  B81C99/0085 ,  B81C2201/034 ,  B81C2203/032 ,  B81C2203/038 ,  B82Y10/00 ,  B82Y40/00 ,  G03F7/0002 ,  Y10T428/24479 ,  Y10T428/254

Abstract: The present invention is directed to micro- and nano-scale imprinting methods and the use of such methods to fabricate supported and/or free-standing 3-D micro- and/or nano-structures of polymeric, ceramic, and/or metallic materials. In some embodiments, a duo-mold approach is employed in the fabrication of these structures. In such methods, surface treatments are employed to impart differential surface energies to different molds and/or different parts of the mold(s). Such surface treatments permit the formation of three-dimensional (3-D) structures through imprinting and the transfer of such structures to a substrate. In some or other embodiments, such surface treatments and variation in glass transition temperature of the polymers used can facilitate separation of the 3-D structures from the molds to form free-standing micro- and/or nano-structures individually and/or in a film. In some or other embodiments, a “latch-on” assembly technique is utilized to form supported and/or free-standing stacked micro- and/or nano-structures that enable the assembly of polymers without a glass transition temperature and eliminate the heating required to assemble thermoplastic polymers.

Abstract translation: 本发明涉及微尺度和纳米级压印方法，并且使用这种方法来制造聚合物，陶瓷和/或金属材料的负载和/或独立的3-D微观和/或纳米结构 。 在一些实施例中，在制造这些结构中采用双模方法。 在这种方法中，使用表面处理以将不同的表面能赋予模具的不同模具和/或模具的不同部分。 这种表面处理允许通过压印形成三维（3-D）结构并将这种结构转移到基底上。 在一些或其它实施方案中，所使用的聚合物的这种表面处理和玻璃化转变温度的变化可促进3-D结构与模具的分离，以单独形成独立的和/或纳米结构，并且/ 电影。 在一些或其它实施方案中，使用“闭锁”组装技术来形成支撑和/或独立堆叠的微结构和/或纳米结构，其能够组装聚合物而不具有玻璃化转变温度并消除所需的加热 组装热塑性聚合物。

公开(公告)号：US20110135539A1

公开(公告)日：2011-06-09

申请号：US13057466

申请日：2009-07-13

Applicant: Kanji Sekihara ,  Takehiko Goshima

Inventor： Kanji Sekihara ,  Takehiko Goshima

IPC: G01N33/48 ,  B29C45/14

CPC classification number: B81C99/009 ,  B01J2219/00891 ,  B01L3/502707 ,  B01L3/502715 ,  B01L2200/027 ,  B01L2200/141 ,  B01L2300/0816 ,  B29C45/2628 ,  B29C45/40 ,  B29C65/02 ,  B29C66/54 ,  B29L2031/756 ,  B81B2201/051 ,  B81B2203/0338 ,  B81B2203/0384 ,  B81C2201/034

Abstract: A microchip which comprises: a resinous base having a plurality of fine channels formed on one side thereof, one or more cylindrical parts disposed so as to protrude from the other side, and a through-hole which pierces each cylindrical part along the axis thereof and communicates with the fine channel so that the diameter of the inner wall of the through-hole gradually decreases from the tip end of the cylindrical part toward the fine channel at a first inclination angle; and a resinous covering member bonded to that side of the resinous base on which the fine channels have been formed. The microchip has been configured so that a liquid sample can be introduced from the tip end of each cylindrical part through the through-hole. The wall thickness of the cylindrical part on the end side where a liquid sample is to be introduced has been made smaller than the wall thickness thereof on the base side where the cylindrical part has been formed, by forming a step therebetween.

Abstract translation: 一种微芯片，包括：具有形成在其一侧上的多个细通道的树脂基底，一个或多个从另一侧突出设置的圆柱形部分，以及沿着其轴线刺穿每个圆柱形部分的通孔， 与细通道连通，使得通孔的内壁的直径从圆筒部的前端朝向第一倾斜角的细通道逐渐减小; 以及与形成有微细通道的树脂基底的该侧接合的树脂覆盖部件。 微芯片已经被构造成使得液体样品可以通过通孔从每个圆柱形部分的末端引入。 通过在它们之间形成一个台阶，使得待引入液体样品的端侧的圆筒部分的壁厚比通过形成圆柱形部分的基底侧的壁厚小。

公开(公告)号：US07955644B2

公开(公告)日：2011-06-07

申请号：US11827169

申请日：2007-07-10

Applicant: Elijah Sansom ,  Derek Rinderknecht ,  Morteza Gharib

Inventor： Elijah Sansom ,  Derek Rinderknecht ,  Morteza Gharib

IPC: B05D7/00 ,  B05D1/38 ,  C01B31/02

CPC classification number: B29C70/64 ,  B29K2105/162 ,  B81C3/008 ,  B81C2201/034 ,  B82Y30/00 ,  B82Y40/00 ,  C01B32/168 ,  C01B32/18 ,  C01B2202/08 ,  Y10S977/742 ,  Y10S977/753 ,  Y10T156/109 ,  Y10T428/24479

Abstract: A method is provided for creating composites by combining pre-fabricated nanoscale structures (nanostructures) and other materials in which the nanostructures are anchored. This method results in anchored nanostructures with their base held and encased within the anchoring material to a specified depth and with a specified length of protrusion of the nanostructures from the anchoring material. This represents a major advance over previous methods of creating composites containing nanostructures which were limited to fully embedded nanostructures or, at best, very limited and uncontrolled protrusion of nanostructures. In summary, the current method involves bringing nanostructures and anchoring materials into physical contact in a controlled fashion and optionally conducting a treatment step to complete the anchoring process.

Abstract translation: 提供了一种通过组合预制纳米尺度结构（纳米结构）和其中纳米结构被锚定的其它材料来产生复合材料的方法。 该方法导致锚定的纳米结构，其基部保持并且被包裹在锚固材料内到达指定的深度并且具有来自锚定材料的纳米结构的特定长度的突出。 这代表了先前创建含有纳米结构的复合材料的方法的重大进步，这些纳米结构限于完全嵌入的纳米结构，或者至多是非常有限的和不受控制的纳米结构突起。 总之，目前的方法涉及使纳米结构和锚定材料以受控的方式物理接触，并且可选地进行处理步骤以完成锚定过程。

公开(公告)号：US20100310773A1

公开(公告)日：2010-12-09

申请号：US12859802

申请日：2010-08-20

Applicant: Hiroshi Yoshida ,  Haruo Akahoshi ,  Akihiro Miyauchi ,  Masahiko Ogino

Inventor： Hiroshi Yoshida ,  Haruo Akahoshi ,  Akihiro Miyauchi ,  Masahiko Ogino

IPC: B05D3/10

CPC classification number: B29C33/3842 ,  B29C33/424 ,  B81B2203/0361 ,  B81C1/00111 ,  B81C1/00206 ,  B81C99/0085 ,  B81C99/009 ,  B81C2201/034 ,  B82Y10/00 ,  B82Y40/00 ,  C23C18/1608 ,  C23C18/1651 ,  C23C18/1653 ,  C23C18/1657 ,  C23C18/1689 ,  C23C18/208 ,  C23C18/42 ,  G03F7/0002 ,  H01J1/304 ,  H01J9/025 ,  Y10T428/12389 ,  Y10T428/12993

Abstract: A fine metal structure having its surface furnished with microprojections of high strength, high precision and large aspect ratio; and a process for producing the fine metal structure free of defects. There is provided a fine metal structure having its surface furnished with microprojections, characterized in that the microprojections have a minimum thickness or minimum diameter ranging from 10 nanometers to 10 micrometers and that the ratio between minimum thickness or minimum diameter (D) of microprojections and height of microprojections (H), H/D, is greater than 1. There is further provided a process for producing a fine metal structure, characterized by comprising providing a substrate having a fine rugged pattern on its surface, applying a molecular electroless plating catalyst to the surface, thereafter carrying out electroless plating to thereby form a metal layer having the rugged pattern filled, and detaching the metal layer from the substrate to thereby obtain a fine metal structure furnished with a surface having undergone reversal transfer of the above rugged pattern.

Abstract translation: 精细的金属结构，其表面具有高强度，高精度和大纵横比的微喷射体; 以及没有缺陷的金属微细结构的制造方法。 提供了具有微喷射体的表面的细金属结构，其特征在于，微喷射体具有10纳米至10微米的最小厚度或最小直径，并且微喷射体的最小厚度或最小直径（D）与高度 的微喷射体（H）H / D大于1.还提供了一种制造精细金属结构的方法，其特征在于，在其表面上提供具有细凹凸图案的基板，将分子无电镀催化剂 然后进行无电解电镀，从而形成具有凹凸图案的金属层，并将金属层与基板分离，从而获得配备有经过上述凹凸图案的反转传送的表面的精细金属结构。

公开(公告)号：US20100227018A1

公开(公告)日：2010-09-09

申请号：US12715801

申请日：2010-03-02

Applicant: Stèfan LANDIS

Inventor： Stèfan LANDIS

IPC: C23F1/00 ,  B29C59/02

CPC classification number: G03F7/2059 ,  B81C99/009 ,  B81C2201/0159 ,  B81C2201/034 ,  B82Y10/00 ,  B82Y40/00 ,  G03F7/0002 ,  G03F7/0017

Abstract: The invention concerns a device forming an imprint mould in three dimensions and comprising at least: a substrate, comprising at least one alternation of layers having at least one part perpendicular to the plane of the substrate, in a first type of material and a second type of material which can be etched selectively relative to each other, a surface topology comprising at least: a) first patterns whose top lies at a first level relative to a surface of the substrate located either side of said topology, these first patterns being in a first type of material, b) and second patterns having at least a second level relative to said surface of the substrate, different from and lower than the first level, and these second patterns being in a second type of material.

Abstract translation: 本发明涉及一种在三维上形成压印模具的装置，其至少包括：基底，其包括至少一个具有垂直于基底的平面的部分的至少一部分的交替层，第一类型的材料和第二类型 可以相对于彼此选择性蚀刻的材料，表面拓扑结构至少包括：a）第一图案，其顶部相对于位于所​​述拓扑结构的任一侧的所述衬底的表面处于第一水平，所述第一图案位于 第一类型的材料，b）和具有相对于衬底的所述表面至少第二级别的第二图案，不同于和低于第一层级，并且这些第二图案是第二类型的材料。

公开(公告)号：US07615179B2

公开(公告)日：2009-11-10

申请号：US11089101

申请日：2005-03-24

Applicant: Jarrett Dumond ,  Hong Yee Low

Inventor： Jarrett Dumond ,  Hong Yee Low

IPC: A61M25/00 ,  B28B11/08 ,  B29C59/02 ,  C03C15/00 ,  H01J29/80

CPC classification number: A61M25/00 ,  B27N3/08 ,  B28B3/06 ,  B81C99/0085 ,  B81C2201/034 ,  B81C2203/032 ,  B81C2203/038 ,  B82Y10/00 ,  B82Y40/00 ,  G03F7/0002 ,  Y10T428/24479 ,  Y10T428/254

Abstract: The present invention is directed to micro- and nano-scale imprinting methods and the use of such methods to fabricate supported and/or free-standing 3-D micro- and/or nano-structures of polymeric, ceramic, and/or metallic materials, particularly for pixel segregation in OLED-based displays. In some embodiments, a duo-mold approach is employed in the fabrication of these structures. In such methods, surface treatments are employed to impart differential surface energies to different molds and/or different parts of the mold(s). Such surface treatments permit the formation of three-dimensional (3-D) structures through imprinting and the transfer of such structures to a substrate. In some or other embodiments, such surface treatments and variation in glass transition temperature of the polymers used can facilitate separation of the 3-D structures from the molds to form free-standing micro- and/or nano-structures individually and/or in a film. In some or other embodiments, a “latch-on” assembly technique is utilized to form supported and/or free-standing stacked micro- and/or nano-structures that enable the assembly of polymers without a glass transition temperature and eliminate the heating required to assemble thermoplastic polymers.

Abstract translation: 本发明涉及微尺度和纳米级压印方法，并且使用这种方法来制造聚合物，陶瓷和/或金属材料的负载和/或独立的3-D微观和/或纳米结构 特别是用于基于OLED的显示器中的像素分离。 在一些实施例中，在制造这些结构中采用双模方法。 在这种方法中，使用表面处理以将不同的表面能赋予模具的不同模具和/或模具的不同部分。 这种表面处理允许通过压印形成三维（3-D）结构并将这种结构转移到基底上。 在一些或其它实施方案中，所使用的聚合物的这种表面处理和玻璃化转变温度的变化可促进3-D结构与模具的分离，以单独形成独立的和/或纳米结构，并且/ 电影。 在一些或其它实施方案中，使用“闭锁”组装技术来形成支撑和/或独立堆叠的微结构和/或纳米结构，其能够组装聚合物而不具有玻璃化转变温度并消除所需的加热 组装热塑性聚合物。

公开(公告)号：US20090176060A1

公开(公告)日：2009-07-09

申请号：US11991477

申请日：2006-09-08

Applicant: Jun Taniguchi

Inventor： Jun Taniguchi

IPC: G03F7/20 ,  B29D11/00 ,  B32B3/00

CPC classification number: G03F7/36 ,  B29C33/3842 ,  B29C33/424 ,  B81C99/009 ,  B81C2201/034 ,  B82Y10/00 ,  B82Y40/00 ,  G02B5/1847 ,  G03F7/0002 ,  G03F7/0757 ,  Y10T428/24479

Abstract: A process for producing a 3-dimensional mold, including irradiating a resist layer of a processing object having the resist layer made of an organopolysiloxane on a substrate with an electron beam, and developing, by thermal desorption treatment, the resist layer after the irradiation with an electron beam to form protrusions and depressions in the resist layer; a process for producing a microfabrication product by using the 3-dimensional mold; a process for producing a micropattern molding by using the 3-dimensional mold or the microfabrication product; and a 3-dimensional mold, a microfabrication product and a micropattern molding which are finely formed by these production processes, as well as an optical device.

Abstract translation: 一种三维模具的制造方法，其特征在于，在电子束的基板上照射具有由有机聚硅氧烷构成的抗蚀剂层的加工对象的抗蚀剂层，并且通过热解吸附处理使照射后的抗蚀剂层照射 电子束在抗蚀剂层中形成突起和凹陷; 使用该三维模具生产微细加工产品的方法; 通过使用三维模具或微细加工产品来生产微图案模制品的方法; 以及通过这些制造方法精细地形成的3维模具，微细加工产品和微图案模塑件以及光学装置。

公开(公告)号：US20090165320A1

公开(公告)日：2009-07-02

申请号：US11825482

申请日：2007-07-06

Applicant: Joseph M. DeSimone ,  Jason P. Rolland ,  Stephen R. Quake ,  Derek A. Schorzman ,  Jason Yarbrough ,  Michael Van Dam

Inventor： Joseph M. DeSimone ,  Jason P. Rolland ,  Stephen R. Quake ,  Derek A. Schorzman ,  Jason Yarbrough ,  Michael Van Dam

IPC: G01B1/00

CPC classification number: B01L3/502707 ,  B01L3/0268 ,  B01L3/502738 ,  B01L7/52 ,  B01L2200/12 ,  B01L2300/0816 ,  B01L2400/0481 ,  B01L2400/0655 ,  B81B1/006 ,  B81B2201/058 ,  B81B2203/0323 ,  B81C2201/034 ,  B82Y10/00 ,  B82Y40/00 ,  C08G18/5015 ,  C08G18/8116 ,  C08G65/007 ,  C08G65/33348 ,  C08G2650/48 ,  C09D163/00 ,  C09D171/02 ,  F16K99/0001 ,  F16K99/0015 ,  F16K99/0026 ,  F16K99/0034 ,  F16K99/0036 ,  F16K99/0042 ,  F16K99/0046 ,  F16K99/0051 ,  F16K99/0059 ,  F16K99/0061 ,  F16K99/0065 ,  F16K2099/008 ,  F16K2099/0084 ,  F16K2099/0086 ,  G03F7/0002 ,  Y10T137/0396 ,  Y10T428/24479 ,  Y10T428/249954 ,  Y10T428/3154

Abstract: A functionalized photocurable perfluoropolyether is used as a material for fabricating a solvent-resistant microfluidic device. Such solvent-resistant microfluidic devices can be used to control the flow of small amounts of a fluid, such as an organic solvent, and to perform microscale chemical reactions that are not amenable to other polymer-based microfluidic devices.

Abstract translation: 功能化的光固化全氟聚醚用作制造耐溶剂微流体装置的材料。 这种耐溶剂微流体装置可用于控制少量流体（例如有机溶剂）的流动，并进行不适合于其它基于聚合物的微流体装置的微量化学反应。

公开(公告)号：US20090102101A1

公开(公告)日：2009-04-23

申请号：US11975414

申请日：2007-10-19

Applicant: Diane Kimberlie Guilfoyle ,  Paul John Shustack ,  Lung-Ming Wu

Inventor： Diane Kimberlie Guilfoyle ,  Paul John Shustack ,  Lung-Ming Wu

IPC: B29C35/08

CPC classification number: C03C17/28 ,  B81B2201/058 ,  B81C1/00071 ,  B81C2201/034 ,  C03B19/06 ,  C03C11/00 ,  C03C17/04 ,  C03C17/324 ,  C03C23/0005

Abstract: Disclosed is a method of forming a structured sintered article including providing a mixture comprising a sinterable particulate material and a binder, the binder comprising, as a function of total resin content of the binder, at least 50% by weight of a thermoplastic binder material and at least 5% by weight of a radiation-curable binder material; shaping the mixture with a mold to form a structure; setting the structure by cooling the structure or by allowing the structure to cool; separating the structure from the mold; irradiating the structure so as to at least partially cure the radiation-curable binder material, and debinding and sintering the structure so as to form a structured sintered article. Shaping may include forming a structure having one or more open channels, and sintering may include sintering in together in contact with at least one additional structure so as to cover or enclose the channels.

Abstract translation: 公开了一种形成结构化烧结制品的方法，包括提供包含可烧结颗粒材料和粘合剂的混合物，所述粘合剂包含作为粘合剂的总树脂含量的函数，至少50重量％的热塑性粘合剂材料和 至少5重量％的可辐射固化粘合剂材料; 用模具成型混合物以形成结构; 通过冷却结构或通过使结构冷却来设定结构; 将结构与模具分离; 照射该结构以至少部分地固化可辐射固化的粘合剂材料，以及脱结和烧结该结构以便形成结构化的烧结制品。 成形可以包括形成具有一个或多个开放通道的结构，并且烧结可以包括与至少一个附加结构接触在一起的烧结以覆盖或封闭通道。

公开(公告)号：US20080145616A1

公开(公告)日：2008-06-19

申请号：US11827169

申请日：2007-07-10

Applicant: Morteza Gharib ,  Derek Rinderknecht ,  Elijah Sansom

Inventor： Morteza Gharib ,  Derek Rinderknecht ,  Elijah Sansom

IPC: B32B3/00 ,  B29C65/00

CPC classification number: B29C70/64 ,  B29K2105/162 ,  B81C3/008 ,  B81C2201/034 ,  B82Y30/00 ,  B82Y40/00 ,  C01B32/168 ,  C01B32/18 ,  C01B2202/08 ,  Y10S977/742 ,  Y10S977/753 ,  Y10T156/109 ,  Y10T428/24479

Abstract: A method is provided for creating composites by combining pre-fabricated nanoscale structures (nanostructures) and other materials in which the nanostructures are anchored. This method results in anchored nanostructures with their base held and encased within the anchoring material to a specified depth and with a specified length of protrusion of the nanostructures from the anchoring material. This represents a major advance over previous methods of creating composites containing nanostructures which were limited to fully embedded nanostructures or, at best, very limited and uncontrolled protrusion of nanostructures. In summary, the current method involves bringing nanostructures and anchoring materials into physical contact in a controlled fashion and optionally conducting a treatment step to complete the anchoring process.

Abstract translation: 提供了一种通过组合预制纳米尺度结构（纳米结构）和其中纳米结构被锚定的其它材料来产生复合材料的方法。 该方法导致锚定的纳米结构，其基部保持并且被包裹在锚固材料内到达指定的深度并且具有来自锚定材料的纳米结构的特定长度的突出。 这代表了先前创建含有纳米结构的复合材料的方法的重大进步，这些纳米结构限于完全嵌入的纳米结构，或者至多是非常有限的和不受控制的纳米结构突起。 总之，目前的方法涉及使纳米结构和锚定材料以受控的方式物理接触，并且可选地进行处理步骤以完成锚定过程。