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    LASER WELDING METHOD
    91.
    发明申请
    LASER WELDING METHOD 审中-公开
    激光焊接方法

    公开(公告)号：US20100224601A1

    公开(公告)日：2010-09-09

    申请号：US12429209

    申请日：2009-04-24

    Applicant: Yujiro Sugaya ,  Tomomitsu Saito

    Inventor： Yujiro Sugaya ,  Tomomitsu Saito

    IPC: B23K26/20

    CPC classification number: H01R43/0221 ,  H01R13/6585 ,  H01R13/6666 ,  H05K1/189 ,  H05K3/328 ,  H05K2201/0112 ,  H05K2201/09381 ,  H05K2201/09663 ,  H05K2203/107 ,  H05K2203/1136

    Abstract: When a laser beam is incident on a thin film, carbide generated by the heat of the beam is not ejected between respective metallic thin plates. In each of second conductive sections of a metallic thin plate, a slit extends from a welding position to the end of the second conductive section. The second conductive sections are respectively welded to terminals by making the laser beam incident on the respective welding positions of a substrate for the thin film. Thereby, when the beam is incident on a resin, the resin is carbonized by the thermal energy of the laser beam and the resin carbide is ejected from the welded portion, and the carbide is discharged to the outside from the lower end of the second conductive section via the slit of the second conductive section. Thereby, the carbide is not ejected between the adjacent second conductive sections. Consequently, lowering of the insulation resistance between the respective second conductive sections due to the carbide is prevented.

    Abstract translation: 当激光束入射到薄膜上时，由光束的热量产生的碳化物不会在相应的金属薄板之间喷射。 在金属薄板的每个第二导电部分中，狭缝从焊接位置延伸到第二导电部分的端部。 通过使激光束入射到用于薄膜的基板的各个焊接位置上，将第二导电部分分别焊接到端子。 因此，当光束入射到树脂上时，树脂被激光束的热能碳化，并且树脂碳化物从焊接部分喷出，碳化物从第二导电体的下端排出到外部 通过第二导电部分的狭缝。 因此，碳化物不会在相邻的第二导电部分之间喷射。 因此，防止了由于碳化物导致的各个第二导电部分之间的绝缘电阻的降低。

    METHOD OF OBTAINING ELECTRONIC CIRCUITRY FEATURES
    92.
    发明申请
    METHOD OF OBTAINING ELECTRONIC CIRCUITRY FEATURES 审中-公开
    获得电子电路特征的方法

    公开(公告)号：US20100181284A1

    公开(公告)日：2010-07-22

    申请号：US12369798

    申请日：2009-02-12

    Applicant: Yueh-Ling Lee ,  Glenn Oliver ,  Shane Fang

    Inventor： Yueh-Ling Lee ,  Glenn Oliver ,  Shane Fang

    IPC: B44C1/22

    CPC classification number: H05K3/0032 ,  H05K3/048 ,  H05K3/107 ,  H05K2201/0112 ,  H05K2203/1383

    Abstract: The present disclosure relates to a method of obtaining fine circuitry features by positioning a circuit board precursor, the circuit board precursor having a cover layer and an insulating substrate, in proximity to a source of laser radiation. Selectively laser ablating through the cover layer and into the underlying insulating substrate and then treating with water, dilute alkali solution or dilute acid solution to remove the cover layer to reveal one or more circuitry features on the insulating substrate that are smaller than if a cover layer is not used.

    Abstract translation: 本公开涉及通过将电路板前体（具有覆盖层和绝缘基板）的电路板前体定位在激光辐射源附近来获得精细电路特征的方法。 通过选择性激光烧蚀通过覆盖层并进入下面的绝缘基底，然后用水，稀碱溶液或稀酸溶液处理以除去覆盖层，以揭示绝缘基底上的一个或多个电路特征，如果覆盖层 未使用。

    Multi-chip light emitting diode modules
    93.
    发明申请
    Multi-chip light emitting diode modules 有权
    多芯片发光二极管模块

    公开(公告)号：US20100117099A1

    公开(公告)日：2010-05-13

    申请号：US12291293

    申请日：2008-11-07

    Applicant: Jacob Chi Wing Leung

    Inventor： Jacob Chi Wing Leung

    IPC: H01L33/00 ,  H01L23/48 ,  H01L21/027

    CPC classification number: H01L25/0753 ,  H01L33/483 ,  H01L33/60 ,  H01L33/62 ,  H01L2224/48091 ,  H05K1/056 ,  H05K2201/0112 ,  H05K2201/10106 ,  H01L2924/00014 ,  H01L2924/00

    Abstract: A multi-chip lighting module is disclosed for maximizing luminous flux output and thermal management. In one embodiment, a multi-chip module device comprises a substantially thermally dissipative substrate with a dark insulating layer deposited on a surface of the substrate. A plurality of light emitting devices is also provided. An electrically conductive layer is applied to a surface of the substrate, with the conductive layer comprising a plurality of chip carrier parts each having a surface for carrying at least one of the light emitting devices. Each light emitting device has a first and a second electrical terminal. A reflective layer is also provided that at least partially covers the conductive layer.

    Abstract translation: 公开了一种用于最大化光通量输出和热管理的多芯片照明模块。 在一个实施例中，多芯片模块器件包括具有沉积在衬底的表面上的暗绝缘层的基本上散热的衬底。 还提供了多个发光器件。 将导电层施加到衬底的表面，其中导电层包括多个芯片载体部件，每个芯片载体部件具有用于承载至少一个发光器件的表面。 每个发光器件具有第一和第二电端子。 还提供了至少部分地覆盖导电层的反射层。

    Method for manufacturing printed wiring board and electrolytic etching solution for use in the manufacturing method
    98.
    发明申请
    Method for manufacturing printed wiring board and electrolytic etching solution for use in the manufacturing method 有权
    用于制造方法的印刷线路板和电解蚀刻溶液的制造方法

    公开(公告)号：US20090084684A1

    公开(公告)日：2009-04-02

    申请号：US12222995

    申请日：2008-08-21

    Applicant: Toshinori Kawamura ,  Haruo Akahoshi ,  Kunio Arai

    Inventor： Toshinori Kawamura ,  Haruo Akahoshi ,  Kunio Arai

    IPC: H05K3/07

    CPC classification number: H05K3/07 ,  H05K3/0035 ,  H05K3/0038 ,  H05K3/0055 ,  H05K2201/0112 ,  H05K2203/0315 ,  H05K2203/0346

    Abstract: There is provided a method for manufacturing a printed wiring board that allows molten scattered Cu and an overhang to be selectively removed while scarcely decreasing a thickness of wires, and an electrolytic etching solution suitably used in the method. In the method for manufacturing a printed wiring board in which a via that reaches from a surface copper layer to an inner-layer copper layer of a multilayer board in which copper layers and insulating layers are alternately layered is machined by means of a laser, a process of machining the via including steps of forming a laser absorbing layer on a surface of a copper layer disposed on the surface of the multilayer board, irradiating the laser, performing an electrolytic etching and removing the laser absorbing layer is carried out in this order.

    Abstract translation: 提供了一种制造印刷线路板的方法，其允许选择性地去除熔融散射的Cu和悬空，同时几乎不减少线的厚度，以及在该方法中适当使用的电解蚀刻溶液。 在其中通过激光加工其中铜层和绝缘层交替层叠的从表面铜层到达多层板的内层铜层的通孔的印刷线路板的制造方法中， 在通过包括在多层板的表面设置的铜层的表面上形成激光吸收层的步骤，照射激光，进行电解蚀刻和去除激光吸收层的步骤是按顺序进行的。

    Thermosetting adhesive and pressure-sensitive adhesive composition, thermosetting adhesive and pressure-sensitive adhesive tape or sheet, and wiring circuit board
    100.
    发明申请
    Thermosetting adhesive and pressure-sensitive adhesive composition, thermosetting adhesive and pressure-sensitive adhesive tape or sheet, and wiring circuit board 审中-公开
    热固性粘合剂和压敏粘合剂组合物，热固性粘合剂和压敏胶带或片材和布线电路板

    公开(公告)号：US20070036953A1

    公开(公告)日：2007-02-15

    申请号：US11502376

    申请日：2006-08-11

    Applicant: Takahiro Nonaka ,  Miyoko Ikishima ,  Kanji Nishida ,  Masahiro Ooura

    Inventor： Takahiro Nonaka ,  Miyoko Ikishima ,  Kanji Nishida ,  Masahiro Ooura

    IPC: B32B3/00

    CPC classification number: H05K3/386 ,  C08L61/06 ,  C08L2666/02 ,  C09J133/08 ,  C09J2201/606 ,  H05K3/0032 ,  H05K3/0058 ,  H05K3/281 ,  H05K2201/0112 ,  H05K2201/0355 ,  Y10T428/24917

    Abstract: A thermosetting adhesive and pressure-sensitive adhesive composition containing 100 parts by weight of an acrylic polymer (X) containing, as monomer components, a (meth)acrylic acid alkyl ester (a) where the alkyl group has 2 to 14 carbon atoms in an amount of 60 to 75% by weight relative to the total amount of monomer components, a cyano group-containing monomer (b) in an amount of 20 to 35% by weight relative to the total amount of monomer components, and a carboxyl group-containing monomer (c) in an amount of 0.5 to 10% by weight relative to the total amount of monomer components and 1 to 20 parts by weight of a carbolic acid-based resorcinol-type phenol resin (Y) represented by the following formula (1), and further containing an ultraviolet absorbent (Z). wherein R1 represents —CH2— or —CH2—O—CH2—, n is a positive integer, and m is an integer of 1 to 4.

    Abstract translation: 含有100重量份丙烯酸类聚合物（X）的热固性粘合剂和压敏粘合剂组合物，其含有（甲基）丙烯酸烷基酯（a）作为单体组分，其中烷基具有2至14个碳原子 相对于单体成分的总量为60〜75重量％的含氰基单体（b），相对于单体成分的总量为20〜35重量％ 含有单体（c）的量相对于单体成分的总量为0.5〜10重量％，和1〜20重量份由下式表示的碳酸间苯二酚型酚醛树脂（Y） 1），并且还含有紫外线吸收剂（Z）。 其中R 1表示-CH 2 - 或-CH 2 -O-CH 2 - ，n是 正整数，m为1〜4的整数。

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