公开(公告)号：US5173542A

公开(公告)日：1992-12-22

申请号：US583898

申请日：1990-09-17

Applicant: Aldrich N. K. Lau ,  Lanchi P. Vo ,  Frank W. Mercer

Inventor： Aldrich N. K. Lau ,  Lanchi P. Vo ,  Frank W. Mercer

IPC: C08G61/00 ,  C07C245/22 ,  C07C245/24 ,  C08G65/40 ,  C08K5/17 ,  C08K5/22 ,  C08K5/27 ,  C08L27/12 ,  C08L71/00 ,  C08L71/08 ,  C08L71/10 ,  C08L79/08 ,  C08L101/00 ,  H01B3/30 ,  H01L23/12 ,  H01L23/498 ,  H01L23/532 ,  H05K1/03 ,  H05K3/46

CPC classification number: C08L71/00 ,  C07C245/24 ,  C08G65/40 ,  C08G65/4006 ,  C08K5/27 ,  H01L23/49894 ,  H01L23/5329 ,  C08G2650/20 ,  C08L2203/20 ,  C08L2312/00 ,  H01L2924/0002 ,  H01L2924/09701 ,  H05K1/034 ,  H05K2201/015

Abstract: Bistriazene compounds such as ##STR1## are useful for crosslinking polymers such as poly(imides), poly(aryl ether ketones), poly(aryl ether sulfones), poly(quinolines), poly(quinoxalines), and nonaromatic fluoropolymers having aliphatic C--H groups. Polymers crosslinked with these bistriazene compounds are useful as interlayer insulators in multilayer integrated circuit articles.

Abstract translation: 诸如聚（酰亚胺），聚（芳基醚酮），聚（芳基醚砜），聚（喹啉），聚（喹喔啉）和非芳族化合物等交联聚合物的双三烯化合物例如 + TR 具有脂族CH基团的含氟聚合物。 与这些双三烯化合物交联的聚合物可用作多层集成电路制品中的层间绝缘体。

公开(公告)号：US5102722A

公开(公告)日：1992-04-07

申请号：US489644

申请日：1990-02-27

Applicant: Kosuke Iida ,  Hiroshi Yamato ,  Yoji Kadono

Inventor： Kosuke Iida ,  Hiroshi Yamato ,  Yoji Kadono

IPC: B32B27/00 ,  B32B27/30 ,  B32B27/34 ,  B32B27/36 ,  B32B27/38 ,  B32B27/42 ,  C08J7/04 ,  H05K1/00 ,  H05K1/03

CPC classification number: H05K1/036 ,  C08J7/047 ,  H05K1/0393 ,  H05K2201/0129 ,  H05K2201/015 ,  H05K2201/0154 ,  H05K2201/0162 ,  H05K2203/0759 ,  Y10T428/24967 ,  Y10T428/269 ,  Y10T428/31507 ,  Y10T428/31511 ,  Y10T428/3154 ,  Y10T428/31544 ,  Y10T428/31663 ,  Y10T428/31667 ,  Y10T428/31721 ,  Y10T428/31786 ,  Y10T428/31797 ,  Y10T428/31935 ,  Y10T428/31942

Abstract: Functional films comprising a thermoplastic resin having formed thereon a coating layer and a process for their production are disclosed. The films have improved properties including improved heat resistance, are inexpensive, and are for general-purpose. They are produced by baking a thin film of a phenol resin, an epoxy resin, a silicone resin, etc., onto a thermoplastic resin substrate and can be utilized for flexible printed circuit base, insulating tapes, etc.

公开(公告)号：US5046238A

公开(公告)日：1991-09-10

申请号：US493975

申请日：1990-03-15

Applicant: Robert Daigle ,  Samuel Malbaurn ,  David Noddin

Inventor： Robert Daigle ,  Samuel Malbaurn ,  David Noddin

IPC: H05K3/20 ,  H05K3/28 ,  H05K3/40 ,  H05K3/42 ,  H05K3/46

CPC classification number: H05K3/4632 ,  H05K3/4617 ,  H05K2201/0129 ,  H05K2201/015 ,  H05K2201/0305 ,  H05K2201/09563 ,  H05K2203/1572 ,  H05K3/205 ,  H05K3/28 ,  H05K3/4038 ,  H05K3/423 ,  Y10T29/49126 ,  Y10T29/49158 ,  Y10T29/53174 ,  Y10T428/31544

Abstract: Methods of fabricating multilayer circuits are presented. In accordance with the present invention, a plurality of circuit layers comprised of a dielectric substrate having a circuit formed thereon are stacked, one on top of the other. The dielectric substrate is composed of a polymeric material capable of undergoing fusion bonding such as a fluoropolymeric based substrate. Fusible conductive bonding material (e.g. solder) is applied on selected exposed circuit traces (prior to the stacking step) whereupon the entire stack-up is subjected to lamination under heat and pressure to simultaneously fuse all of the substrate and conductive layers together to form an integral multilayer circuit having solid conductive interconnects.

公开(公告)号：US5024871A

公开(公告)日：1991-06-18

申请号：US483501

申请日：1990-02-21

Applicant: David J. Arthur ,  Gwo S. Swei

Inventor： David J. Arthur ,  Gwo S. Swei

IPC: C08K3/00 ,  C04B26/08 ,  C04B35/14 ,  C04B41/45 ,  C08K9/00 ,  C08K9/04 ,  C08L27/12 ,  H01B1/22 ,  H01L23/14 ,  H05K1/03 ,  H05K3/38 ,  H05K3/46

CPC classification number: C04B41/009 ,  C04B26/08 ,  C04B35/14 ,  C04B41/4584 ,  C08K9/04 ,  H01L23/145 ,  H05K1/0373 ,  C04B2111/00844 ,  H01L2924/0002 ,  H05K1/034 ,  H05K1/0366 ,  H05K2201/015 ,  H05K2201/0195 ,  H05K2201/0209 ,  H05K2201/0239 ,  H05K3/4626 ,  Y10S428/901 ,  Y10T428/24917 ,  Y10T428/25 ,  Y10T428/259 ,  Y10T428/29 ,  Y10T428/3154

Abstract: A composite material is presented comprised of a ceramic filled fluoropolymer wherein the ceramic is coated with a zirconate coupling agent and/or a titanate coupling agent.

公开(公告)号：US4915981A

公开(公告)日：1990-04-10

申请号：US231693

申请日：1988-08-12

Applicant: Richard T. Traskos ,  Cathy A. Fleischer ,  Carlos L. Barton ,  David B. Noddin

Inventor： Richard T. Traskos ,  Cathy A. Fleischer ,  Carlos L. Barton ,  David B. Noddin

IPC: B23K26/00 ,  B23K26/38 ,  B23K26/40 ,  H05K1/03 ,  H05K3/00 ,  H05K3/42

CPC classification number: B23K26/382 ,  B23K26/386 ,  B23K26/40 ,  B23K26/402 ,  H05K3/0032 ,  B23K2203/08 ,  B23K2203/12 ,  B23K2203/16 ,  B23K2203/172 ,  B23K2203/26 ,  B23K2203/42 ,  B23K2203/50 ,  H05K1/034 ,  H05K1/0373 ,  H05K2201/015 ,  H05K2201/0209 ,  H05K2203/056 ,  H05K3/0035 ,  H05K3/427

Abstract: A method of ablating fluoropolymer composite materials is presented wherein it has been found that small holes (less than 100 .mu.m) can be formed in fluoropolymer composite laminate materials using UV lasers. The resulting holes can be used to produce vias and plated through-holes having smooth side walls with little or no debris or residue remaining in the holes and minimal damage to the polymer. Thus, the vias and plated through-holes can be plated without further cleaning processes. In addition, the holes are formed at a relatively fast rate.

Abstract translation: 提出了一种消除含氟聚合物复合材料的方法，其中已经发现可以使用UV激光在含氟聚合物复合层压材料中形成小孔（小于100μm）。 所产生的孔可以用于产生具有平滑侧壁的通孔和电镀通孔，孔几乎没有或没有残留物残留在聚合物上。 因此，可以对通孔和电镀通孔进行电镀而无需进一步的清洁处理。 此外，孔以相对较快的速度形成。

公开(公告)号：US4911771A

公开(公告)日：1990-03-27

申请号：US274312

申请日：1988-11-21

Applicant: Satoshi Tanaka ,  Masahiro Suzuki

Inventor： Satoshi Tanaka ,  Masahiro Suzuki

IPC: B32B5/18 ,  B32B15/08 ,  B32B15/092 ,  H05K1/03 ,  H05K3/28 ,  H05K3/38

CPC classification number: H05K3/281 ,  B32B15/08 ,  H05K1/034 ,  H05K1/0353 ,  H05K2201/0116 ,  H05K2201/015 ,  H05K2201/0195 ,  H05K2201/0355 ,  H05K2203/0278 ,  H05K3/386 ,  Y10T156/10

Abstract: A process is provided for making a laminated board useful in printed circuitry. The process involves laminating a metal layer to at least one side of a sheet of porous, expanded polytetrafluoroethylene using an adhesive followed by compressing the polytetrafluoroethylene sheet to increase its density. The metal layer may be a metal foil or it may comprise electrical circuitry. Also provided are printed circuit boards produced by the aforesaid process.

公开(公告)号：US4895752A

公开(公告)日：1990-01-23

申请号：US363350

申请日：1989-06-06

Applicant: Craig S. McEwen

Inventor： Craig S. McEwen

IPC: B32B15/08 ,  H05K1/03

CPC classification number: H05K1/0366 ,  B32B15/08 ,  H05K2201/015 ,  H05K2201/0278 ,  H05K2201/029 ,  H05K2201/0293 ,  Y10S428/901 ,  Y10T428/31544 ,  Y10T428/31681 ,  Y10T428/31699 ,  Y10T442/3423

Abstract: Laminate is disclosed comprising a perfluoropolymer reinforced with polyaramid positioned between two layers of copper.

Abstract translation: 公开了包含用位于两层铜之间的聚芳酰胺增强的全氟聚合物的层压板。

公开(公告)号：US4886699A

公开(公告)日：1989-12-12

申请号：US113533

申请日：1987-10-26

Applicant: James R. Carroll ,  Leon W. McGinnis ,  Terry L. Miller ,  Michael B. Norris

Inventor： James R. Carroll ,  Leon W. McGinnis ,  Terry L. Miller ,  Michael B. Norris

IPC: B32B17/04 ,  B32B5/26 ,  C08J5/08 ,  H05K1/03 ,  H05K1/16

CPC classification number: B32B5/26 ,  H05K1/036 ,  H05K1/167 ,  H05K2201/015 ,  H05K2201/0251 ,  Y10S428/901 ,  Y10T428/24917 ,  Y10T428/252 ,  Y10T428/254 ,  Y10T428/26 ,  Y10T428/31544 ,  Y10T442/3439

Abstract: A fluoropolymeric circuit laminate consisting of one or more layers of fluoropolymer impregnated woven glass cloth sandwiched between one or more layers of "random" microfiberglass reinforced fluoropolymer is presented. This composite of fluoropolymer, woven glass fabric and random glass microfibers may be clad on one or both outer surfaces with a suitable conductive material such as copper or certain known resistive foils. The fluoropolymer impregnated woven glass layer or layers will be nested between microfiberglass reinforced fluoropolymer layers to provide the outer surfaces of the circuit with smooth surfaces for fine line circuitry. The circuit laminate of the present invention exhibits good dimensional stability, smooth surfaces for fine line circuitry, good electrical properties, and strong foil and interlaminar adhesion properties.

公开(公告)号：US4824511A

公开(公告)日：1989-04-25

申请号：US109586

申请日：1987-10-19

Applicant: Frederick N. Hartman ,  Alan C. Knight

Inventor： Frederick N. Hartman ,  Alan C. Knight

IPC: H05K1/03 ,  H05K3/46 ,  C09J5/10

CPC classification number: H05K3/4655 ,  H05K1/034 ,  H05K1/0366 ,  H05K2201/015 ,  H05K2201/0715 ,  H05K2203/1355 ,  H05K3/4626 ,  H05K3/4652 ,  Y10S428/901 ,  Y10T428/24917 ,  Y10T428/3154 ,  Y10T428/31544

Abstract: A multilayer circuit board consisting of multiple circuit layers supported on sheets of PTFE or PTFE containing a fibrous stiffening agent, said circuit-bearing sheets being joined in fixed relative positions by means of separating layers of a adhesive unsintered tetrafluoroethylene resin.

公开(公告)号：US4781969A

公开(公告)日：1988-11-01

申请号：US102033

申请日：1987-09-29

Applicant: Satoru Kobayashi ,  Tetsuya Hirose ,  Masahiro Suzuki

Inventor： Satoru Kobayashi ,  Tetsuya Hirose ,  Masahiro Suzuki

IPC: H05K1/00 ,  H05K1/03 ,  H05K1/09 ,  B32B9/00 ,  B22F3/00

CPC classification number: H05K1/09 ,  H05K1/034 ,  H05K1/0393 ,  H05K2201/015 ,  H05K2201/0338 ,  H05K2201/0355 ,  Y10S428/901 ,  Y10T29/49124 ,  Y10T428/12007 ,  Y10T428/1216 ,  Y10T428/12361 ,  Y10T428/12396 ,  Y10T428/12493 ,  Y10T428/12569 ,  Y10T428/12736 ,  Y10T428/1275 ,  Y10T428/24917

Abstract: A printed circuit board is provided wherein a composite metal layer is affixed to at least one surface of a flexible dielectric substrate, the composite metal layer comprising an inner aluminum layer and an outer copper layer. Owing to the relatively high elongation of the aluminum layer, when the printed circuit board is flexed the circuit thereon does not crack.

Abstract translation: 提供一种印刷电路板，其中复合金属层固定在柔性电介质基底的至少一个表面上，复合金属层包括内铝层和外铜层。 由于铝层的相对高的伸长率，当印刷电路板弯曲时，其上的电路不会破裂。