公开(公告)号：US09316230B2

公开(公告)日：2016-04-19

申请号：US14555276

申请日：2014-11-26

Applicant: DELTA ELECTRONICS, INC.

Inventor： Sheng-Wei Yeh ,  Chiu-Kung Chen ,  Cheng-Chieh Liu ,  Shao-Chang Tu

IPC: F04D25/06 ,  F04D29/32 ,  F04D29/54 ,  F04D19/00 ,  H05K3/10 ,  H05K3/18 ,  H05K3/34 ,  F04D17/16 ,  F04D29/28

CPC classification number: H05K3/182 ,  F04D17/16 ,  F04D19/002 ,  F04D25/0693 ,  F04D29/281 ,  F04D29/325 ,  F04D29/541 ,  F04D29/626 ,  H05K3/105 ,  H05K3/341 ,  H05K2201/0215 ,  H05K2201/0999 ,  Y10T29/49147

Abstract: A manufacturing method of the thin fan includes the steps of: providing a plastic material containing a plurality of metal particles; processing the plastic material to form a housing; removing a part surface of the housing and forming a layout area and an extended circuit on the housing, wherein one terminal of the extended circuit connects to the layout area; disposing a first signal connecting structure on the housing, wherein the first signal connecting structure connects to the other terminal of the extended circuit; and disposing a metal layer on the layout area and the extended circuit.

Abstract translation: 薄风扇的制造方法包括以下步骤：提供包含多个金属颗粒的塑料材料; 处理塑料材料以形成外壳; 去除所述壳体的部分表面并且在所述壳体上形成布局区域和扩展电路，其中所述扩展电路的一个端子连接到所述布局区域; 在壳体上设置第一信号连接结构，其中第一信号连接结构连接到扩展电路的另一端; 并在布局区域和扩展电路上设置金属层。

公开(公告)号：US09293389B2

公开(公告)日：2016-03-22

申请号：US14577490

申请日：2014-12-19

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Kyol Park ,  Yun-Hyeok Im

IPC: H01L23/22 ,  H01L23/367 ,  H01L25/065 ,  H01L25/10 ,  H01L21/56 ,  H01L23/00 ,  H05K3/30 ,  H05K1/02 ,  H05K3/28

CPC classification number: H01L23/3675 ,  H01L21/561 ,  H01L23/367 ,  H01L23/3677 ,  H01L24/83 ,  H01L24/97 ,  H01L25/0655 ,  H01L25/0657 ,  H01L25/105 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/73204 ,  H01L2224/8385 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2225/06589 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2225/1094 ,  H01L2924/10158 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H05K1/0209 ,  H05K3/284 ,  H05K3/30 ,  H05K2201/0215 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A semiconductor package includes a circuit board having an inner circuit pattern and a plurality of contact pads connected to the inner circuit pattern, at least one integrated circuit (IC) device on the circuit board and making contact with the contact pads, a mold on the circuit board, the mold fixing the IC device to the circuit board, and a surface profile modifier on a surface of the IC device and a surface of the mold, and the surface profile modifier enlarging a surface area of the IC device and the mold to dissipate heat.

Abstract translation: 半导体封装包括具有内部电路图案和连接到内部电路图案的多个接触焊盘的电路板，电路板上的至少一个集成电路（IC）装置并与接触焊盘接触，模具在 电路板，将IC器件固定到电路板上的模具，以及IC器件表面和模具表面上的表面轮廓改性剂，以及将IC器件和模具的表面积扩大的表面轮廓修改器 散热

公开(公告)号：US20160068964A1

公开(公告)日：2016-03-10

申请号：US14943861

申请日：2015-11-17

Applicant: BYD COMPANY LIMITED

Inventor： Qing GONG ,  Wei ZHOU ,  Weifeng MIAO

IPC: C23C18/16 ,  C23C18/38 ,  C23C18/28 ,  C09D11/03 ,  C08K3/22

CPC classification number: C23C18/1608 ,  B29C37/0025 ,  B29C2035/0838 ,  B29C2035/0872 ,  B29C2035/0877 ,  C01G19/006 ,  C01G19/02 ,  C01G30/002 ,  C01G31/00 ,  C01G39/00 ,  C01P2002/50 ,  C01P2002/52 ,  C01P2004/61 ,  C01P2004/62 ,  C01P2004/64 ,  C08K3/22 ,  C08K2003/2231 ,  C08K2003/2255 ,  C09D11/03 ,  C23C18/1612 ,  C23C18/1641 ,  C23C18/204 ,  C23C18/285 ,  C23C18/38 ,  H05K1/0373 ,  H05K3/107 ,  H05K3/185 ,  H05K2201/0215 ,  H05K2201/0218 ,  H05K2201/0236 ,  H05K2203/107

Abstract: Embodiments of the present disclosure are directed to a doped tin oxide. The doped tin oxide includes a tin oxide and at least one oxide of a doping element. The doping element includes at least one of vanadium and molybdenum. The doped tin oxide includes an amount of the tin oxide ranging from 90 mol % to 99 mol %, and an amount of the at least one oxide ranging from 1 mol % to 10 mol %.

Abstract translation: 本公开的实施方案涉及掺杂的氧化锡。 掺杂的氧化锡包括氧化锡和掺杂元素的至少一种氧化物。 掺杂元素包括钒和钼中的至少一种。 掺杂的氧化锡包括氧化锡的量为90mol％至99mol％，并且至少一种氧化物的量为1mol％至10mol％。

公开(公告)号：US20150319856A1

公开(公告)日：2015-11-05

申请号：US14651783

申请日：2013-12-06

Applicant: LG INNOTEK CO., LTD.

Inventor： Sungjin YUN ,  Jea Man PARK ,  Jong Heum YOON ,  Young Ju HAN

IPC: H05K1/03 ,  C08K3/22 ,  C08K3/38

CPC classification number: H05K1/0373 ,  C08K3/22 ,  C08K3/38 ,  C08K2003/2227 ,  C08K2003/385 ,  H05K1/056 ,  H05K2201/0209 ,  H05K2201/0215 ,  C08L63/00

Abstract: According to one embodiment of the present invention, an epoxy resin composition comprises an epoxy compound, a curing agent, and an inorganic filler, wherein the inorganic filler includes boron nitride (BN).

Abstract translation: 根据本发明的一个实施方案，环氧树脂组合物包含环氧化合物，固化剂和无机填料，其中无机填料包括氮化硼（BN）。

公开(公告)号：US20150197642A1

公开(公告)日：2015-07-16

申请号：US14156635

申请日：2014-01-16

Applicant: International Business Machines Corporation

Inventor： Dylan J. Boday ,  Joseph Kuczynski ,  Jason T. Wertz ,  Jing Zhang

IPC: C09D5/08 ,  C09D183/04 ,  H05K7/02 ,  H05K3/28

CPC classification number: C09D5/10 ,  C08K3/015 ,  C08K2003/0806 ,  C08K2003/085 ,  C09D5/084 ,  C09D7/67 ,  C09D7/68 ,  C09D183/04 ,  C23F15/00 ,  H05K1/09 ,  H05K1/181 ,  H05K3/284 ,  H05K3/285 ,  H05K2201/0215 ,  H05K2201/0257 ,  H05K2201/09872 ,  H05K2201/10022 ,  H05K2201/10636 ,  Y02P70/611

Abstract: A conformal coating composition for protecting a metal surface from sulfur related corrosion includes a polymer and metal nanoparticles blended with the polymer. In accordance with some embodiments of the present invention, an apparatus includes an electronic component mounted on a substrate, metal conductors electronically connecting the electronic component, and a polymer conformal coating containing metal nanoparticles overlying the metal conductors. Accordingly, the metal nanoparticle-containing conformal coating is able to protect the metal conductors from corrosion caused by sulfur components (e.g., elemental sulfur, hydrogen sulfide, and/or sulfur oxides) in the air. That is, the metal nanoparticles in the conformal coating react with any corrosion inducing sulfur component in the air and prevent the sulfur component from reacting with the underlying metal conductors.

Abstract translation: 用于保护金属表面免受硫相关腐蚀的保形涂料组合物包括与聚合物共混的聚合物和金属纳米颗粒。 根据本发明的一些实施例，一种装置包括安装在基板上的电子部件，电子连接电子部件的金属导体和包含覆盖金属导体的金属纳米颗粒的聚合物保形涂层。 因此，含金属纳米颗粒的保形涂层能够保护金属导体免受空气中的硫成分（例如元素硫，硫化氢和/或硫氧化物）引起的腐蚀。 也就是说，保形涂层中的金属纳米颗粒与空气中的任何腐蚀诱导的硫成分反应，并防止硫成分与下面的金属导体反应。

公开(公告)号：US20150188024A1

公开(公告)日：2015-07-02

申请号：US14578991

申请日：2014-12-22

Applicant: Seiko Epson Corporation

Inventor： Hideki ISHIGAMI ,  Hidefumi NAKAMURA ,  Yukihiko SHIOHARA ,  Taku KAWASAKI ,  Fumiaki AKAHANE

IPC: H01L41/047 ,  H01L41/053 ,  B22F3/105 ,  H01L41/29 ,  B22F5/12 ,  H05K1/03 ,  H01L41/333

CPC classification number: H01L41/0475 ,  B22F1/02 ,  B22F3/02 ,  B22F3/1055 ,  B22F5/12 ,  B22F2009/0828 ,  B22F2009/0884 ,  H01L41/0533 ,  H01L41/29 ,  H01L41/333 ,  H03H9/1021 ,  H03H9/13 ,  H03H2003/026 ,  H05K1/0306 ,  H05K3/105 ,  H05K3/1225 ,  H05K3/321 ,  H05K2201/0215 ,  H05K2201/0224 ,  H05K2201/10068 ,  H05K2203/107 ,  H05K2203/1126 ,  H05K2203/1136 ,  Y10T428/252

Abstract: A method of manufacturing an electric wiring layer including an electric wiring includes obtaining a pressed powder molded layer by pressurizing a powder including a metal particle with an insulating layer, the metal particle being constituted by a metal particle having conductivity and a surface insulating layer which is located on a surface of the metal particle and which mainly contains a glass material; and irradiating the pressed powder molded layer with energy rays and forming the electric wiring in an irradiation region.

Abstract translation: 一种制造包括电气布线的电布线层的方法包括：通过加压包含具有绝缘层的金属颗粒的粉末来获得压制粉末成型层，所述金属颗粒由具有导电性的金属颗粒和表面绝缘层构成，所述金属颗粒是 位于金属颗粒的表面上，主要含有玻璃材料; 并用能量射线照射压制成型层，并在照射区域形成电布线。

公开(公告)号：US20150104905A1

公开(公告)日：2015-04-16

申请号：US14577490

申请日：2014-12-19

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Kyol PARK ,  Yun-Hyeok IM

IPC: H01L23/367 ,  H01L23/00 ,  H05K3/30 ,  H01L21/56

CPC classification number: H01L23/3675 ,  H01L21/561 ,  H01L23/367 ,  H01L23/3677 ,  H01L24/83 ,  H01L24/97 ,  H01L25/0655 ,  H01L25/0657 ,  H01L25/105 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/73204 ,  H01L2224/8385 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2225/06589 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2225/1094 ,  H01L2924/10158 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H05K1/0209 ,  H05K3/284 ,  H05K3/30 ,  H05K2201/0215 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A semiconductor package includes a circuit board having an inner circuit pattern and a plurality of contact pads connected to the inner circuit pattern, at least one integrated circuit (IC) device on the circuit board and making contact with the contact pads, a mold on the circuit board, the mold fixing the IC device to the circuit board, and a surface profile modifier on a surface of the IC device and a surface of the mold, and the surface profile modifier enlarging a surface area of the IC device and the mold to dissipate heat.

Abstract translation: 半导体封装包括具有内部电路图案和连接到内部电路图案的多个接触焊盘的电路板，电路板上的至少一个集成电路（IC）装置并与接触焊盘接触，模具在 电路板，将IC器件固定到电路板上的模具，以及IC器件表面和模具表面上的表面轮廓改性剂，以及将IC器件和模具的表面积扩大的表面轮廓修改器 散热

公开(公告)号：US08963019B2

公开(公告)日：2015-02-24

申请号：US13570251

申请日：2012-08-09

Applicant: Cheng-Po Yu ,  Shang-Feng Huang ,  Chang-Ming Lee ,  Young-Sheng Bai

Inventor： Cheng-Po Yu ,  Shang-Feng Huang ,  Chang-Ming Lee ,  Young-Sheng Bai

IPC: H05K1/11 ,  H05K3/00

CPC classification number: H05K3/381 ,  H05K3/105 ,  H05K3/108 ,  H05K2201/0215 ,  H05K2201/09563 ,  H05K2203/0307 ,  H05K2203/095 ,  H05K2203/1461

Abstract: A circuit board and a manufacturing method thereof are provided. According to the method, a dielectric layer is formed on a dielectric substrate, and the dielectric layer contains active particles. A surface treatment is performed on a surface of the dielectric first conductive layer is formed on the activated surface of the dielectric layer. A conductive via is formed in the dielectric substrate and the dielectric layer. A patterned mask layer is formed on the first conductive layer, in which the patterned mask layer exposes the conductive via and a part of the first conductive layer. A second conductive layer is formed on the first conductive layer and conductive via exposed by the patterned mask layer. The patterned mask layer and the first conductive layer below the patterned mask layer are removed.

Abstract translation: 提供一种电路板及其制造方法。 根据该方法，在电介质基板上形成介电层，电介质层含有活性粒子。 在电介质层的活化表面上形成电介质第一导电层的表面进行表面处理。 在电介质基板和电介质层中形成导电通孔。 图案化的掩模层形成在第一导电层上，其中图案化掩模层暴露导电通孔和第一导电层的一部分。 在第一导电层上形成第二导电层，并且由图案化掩模层暴露出导电通路。 图案化掩模层和图案化掩模层下面的第一导电层被去除。

公开(公告)号：US20150035720A1

公开(公告)日：2015-02-05

申请号：US14385281

申请日：2013-03-15

Applicant: MITSUBISHI CHEMICAL EUROPE GMBH

Inventor： Bernardus Antonius Gerardus Schrauwen

IPC: C08K3/22 ,  H01Q1/36 ,  H05K1/03 ,  H05K3/00 ,  H05K3/18

CPC classification number: C08K3/22 ,  C08K3/2279 ,  C08K2003/2231 ,  C08K2003/2241 ,  C23C18/1608 ,  C23C18/1612 ,  C23C18/1641 ,  C23C18/1646 ,  C23C18/204 ,  C23C18/38 ,  H01Q1/36 ,  H05K1/0373 ,  H05K3/0014 ,  H05K3/105 ,  H05K3/181 ,  H05K2201/0129 ,  H05K2201/0215 ,  H05K2201/09118 ,  H05K2203/107

Abstract: A thermoplastic composition including a) a thermoplastic resin and b) a laser direct structuring (LDS) additive in an amount of at least 1 wt. % with respect to the weight of the total composition, wherein the LDS additive includes a mixed metal oxide including at least tin and a second metal selected from the group consisting of antimony, bismuth, aluminium and molybdenum, wherein the LDS additive includes at least 40 wt. % of tin and wherein the weight ratio of the second metal to tin is at least 0.02:1.

Abstract translation: 一种热塑性组合物，其包含a）热塑性树脂和b）至少1重量％的量的激光直接结构化（LDS）添加剂。 相对于总组合物的重量，其中LDS添加剂包括至少包含锡和选自锑，铋，铝和钼的第二金属的混合金属氧化物，其中LDS添加剂包括至少40 重量 ％的锡，其中第二金属与锡的重量比为至少0.02:1。

公开(公告)号：US08879275B2

公开(公告)日：2014-11-04

申请号：US13401028

申请日：2012-02-21

Applicant: Dylan J. Boday ,  Joseph Kuczynski ,  Jason T. Wertz ,  Jing Zhang

Inventor： Dylan J. Boday ,  Joseph Kuczynski ,  Jason T. Wertz ,  Jing Zhang

IPC: H05K7/00 ,  B32B33/00 ,  B32B3/02 ,  D03D27/00 ,  D04H11/00 ,  D05C17/00

CPC classification number: C07F9/5022 ,  H05K3/284 ,  H05K3/285 ,  H05K2201/0215 ,  H05K2201/0257 ,  H05K2201/09872 ,  H05K2201/10636 ,  Y02P70/611 ,  Y10T428/23986

Abstract: A conformal coating comprising modified porous silica particles is disclosed. A porous silica particle, such as MCM-14 or SBA-15 is modified with a sulfur gettering functionality, such as a phosphine compound, covalently bonded to silicon atoms in the porous silica particle. The conformal coating comprising the modified porous silica particles may be applied to metallic wiring areas of a circuit component, with the sulfur gettering functionality preventing sulfur from atmospheric gasses from penetrating the conformal coating to the metallic wiring.

Abstract translation: 公开了一种包含改性多孔二氧化硅颗粒的保形涂层。 诸如MCM-14或SBA-15的多孔二氧化硅颗粒用硫吸收官能团改性，例如与多孔二氧化硅颗粒中的硅原子共价结合的膦化合物。 包含改性多孔二氧化硅颗粒的保形涂层可以施加到电路部件的金属布线区域，硫吸气功能可以防止大气中的硫渗透到金属布线的保形涂层。