公开(公告)号：US20190246491A1

公开(公告)日：2019-08-08

申请号：US16264962

申请日：2019-02-01

Applicant: Kuprion, Inc.

Inventor： Alfred A. Zinn

IPC: H05K1/02 ,  H05K3/40 ,  H05K1/09

CPC classification number: H05K1/0206 ,  H05K1/09 ,  H05K3/4053 ,  H05K2201/0257 ,  H05K2201/066

Abstract: Vias may be established in printed circuit boards or similar structures and filled with a monolithic metal body to promote heat transfer. Metal nanoparticle paste compositions may provide a ready avenue for filling the vias and consolidating the metal nanoparticles under mild conditions to form each monolithic metal body. The monolithic metal body within each via can be placed in thermal contact with one or more heat sinks to promote heat transfer.

公开(公告)号：US20190029119A1

公开(公告)日：2019-01-24

申请号：US16039719

申请日：2018-07-19

Applicant: Molex, LLC

Inventor： Patrick Weber

IPC: H05K3/12 ,  H05K1/09 ,  H05K3/22

CPC classification number: H05K3/12 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/15311 ,  H05K1/095 ,  H05K3/1216 ,  H05K3/1283 ,  H05K3/22 ,  H05K3/247 ,  H05K2201/0215 ,  H05K2201/0245 ,  H05K2201/0257 ,  H05K2203/049 ,  H05K2203/1131 ,  H05K2203/1327 ,  H01L2924/00014

Abstract: A method of manufacturing includes bonding a paste material to an organic substrate by a polymer thick film (PTF) process to form a PTF trace, coating a sinterable material over the PTF trace, and sintering the sinterable material to the PTF trace.

公开(公告)号：US09807848B2

公开(公告)日：2017-10-31

申请号：US14792092

申请日：2015-07-06

Applicant: YISSUM RESEARCH DEVELOPMENT COMPANY OF THE HEBREW UNIVERSITY OF JERUSALEM, LTD.

Inventor： Shlomo Magdassi ,  Michael Grouchko ,  Michael Layani

IPC: H05B33/28 ,  H01B1/02 ,  H01B1/10 ,  H01L31/0224 ,  C23C4/18 ,  C23C26/00 ,  H01L31/18 ,  H05K1/03 ,  H05K1/09 ,  H05K3/12 ,  C23C16/513 ,  B05D3/10 ,  B05D5/06 ,  B05D5/12 ,  H01L33/42 ,  H05K1/02 ,  H05K3/14

CPC classification number: H05B33/28 ,  B05D3/107 ,  B05D5/061 ,  B05D5/12 ,  C23C4/18 ,  C23C16/513 ,  C23C26/00 ,  H01B1/02 ,  H01B1/026 ,  H01B1/10 ,  H01L31/022466 ,  H01L31/1884 ,  H01L33/42 ,  H01L2924/0002 ,  H01L2933/0016 ,  H05K1/0225 ,  H05K1/0278 ,  H05K1/0306 ,  H05K1/0313 ,  H05K1/0386 ,  H05K1/0393 ,  H05K1/092 ,  H05K1/095 ,  H05K1/097 ,  H05K3/125 ,  H05K3/14 ,  H05K2201/0257 ,  H05K2201/026 ,  H05K2201/0302 ,  H05K2201/0323 ,  H05K2201/0329 ,  H05K2201/0338 ,  H05K2201/035 ,  H05K2201/0391 ,  H05K2201/0969 ,  H05K2201/10053 ,  H05K2201/10106 ,  H05K2201/10151 ,  H05K2201/10166 ,  H05K2201/10174 ,  H05K2203/0545 ,  H05K2203/1173 ,  H05K2203/125 ,  Y02E10/50 ,  Y10T428/24273 ,  Y10T428/24331 ,  Y10T428/249978 ,  Y10T428/249979 ,  H01L2924/00

Abstract: The invention provides processes for the manufacture of conductive transparent films and electronic or optoelectronic devices comprising same.

公开(公告)号：US20170273192A1

公开(公告)日：2017-09-21

申请号：US15613752

申请日：2017-06-05

Applicant: Japan Aviation Electronics Industry, Limited

Inventor： Junya SATO ,  Ryosuke MITSUI

IPC: H05K3/12 ,  C09D11/52 ,  C09D11/38 ,  H01R4/70 ,  H05K3/40 ,  H05K3/38 ,  H01R4/02 ,  H01R4/04 ,  H05K3/00

CPC classification number: H05K3/1291 ,  C09D11/037 ,  C09D11/14 ,  C09D11/322 ,  C09D11/38 ,  C09D11/52 ,  H01R4/026 ,  H01R4/04 ,  H01R4/70 ,  H01R12/52 ,  H05K1/111 ,  H05K3/0011 ,  H05K3/321 ,  H05K3/381 ,  H05K3/382 ,  H05K3/403 ,  H05K3/4076 ,  H05K2201/0257 ,  H05K2201/09472 ,  H05K2201/10659 ,  Y02P70/611

Abstract: There is provided an electric connection member having a substrate, an insulating adhesive layer provided on the substrate, and a conductive interconnect, wherein the electric connection member is provided with a recess that opens at a side of the insulating adhesive layer, the conductive interconnect is disposed in the recess, a metal nano-ink is disposed on the conductive interconnect, and all of the metal nano-ink is contained inside the recess.

公开(公告)号：US20170171988A1

公开(公告)日：2017-06-15

申请号：US15368956

申请日：2016-12-05

Applicant: Rohm and Haas Electronic Materials LLC

Inventor： Donald E. Cleary

IPC: H05K3/42 ,  C23C18/48 ,  B01J31/26 ,  C23C18/38 ,  H05K3/18 ,  B01J31/06 ,  C23C18/50 ,  C23C18/32

CPC classification number: H05K3/422 ,  B01J31/06 ,  B01J31/26 ,  C23C18/1831 ,  C23C18/1879 ,  C23C18/2066 ,  C23C18/30 ,  C23C18/32 ,  C23C18/38 ,  C23C18/48 ,  C23C18/50 ,  H05K3/181 ,  H05K3/187 ,  H05K2201/0257 ,  H05K2203/0786

Abstract: Catalysts include nanoparticles of catalytic metal and dextrin as a stabilizer in molar ratios which enable stabilization of the catalyst during storage and during electroless metal plating. The catalysts are environmentally friendly and are tin free. The catalysts adhere well to dielectric materials of printed circuit boards including the walls of through-holes.

公开(公告)号：US20170020036A1

公开(公告)日：2017-01-19

申请号：US15196114

申请日：2016-06-29

Applicant: De Yu Zang ,  Michael M. Salour ,  James G. Grote

Inventor： De Yu Zang ,  Michael M. Salour ,  James G. Grote

IPC: H05K9/00 ,  C09D199/00 ,  C09D5/32 ,  H05K1/02 ,  H05K3/12

CPC classification number: H05K9/0083 ,  C09D5/32 ,  C09D199/00 ,  H05K1/0209 ,  H05K1/0216 ,  H05K3/1283 ,  H05K9/0022 ,  H05K9/009 ,  H05K2201/0257

Abstract: An electromagnetic interference (EMI) shielded device which includes an object to be shielded and an EMI shielding material encompassing the object. The EMI shielding material is made up of, but not limited to a broadband biopolymer or polymer dissolved in organic solvents, and metal and carbon-based nano-powders or nanoparticles. The specific makeup of the shielding material and fabrication procedure of the shielding material is also included herein.

Abstract translation: 一种电磁干扰（EMI）屏蔽装置，其包括被屏蔽的物体和包围物体的EMI屏蔽材料。 EMI屏蔽材料由但不限于溶解在有机溶剂中的宽带生物聚合物或聚合物以及金属和碳基纳米粉末或纳米颗粒构成。 屏蔽材料的具体组成和屏蔽材料的制造过程也包括在本文中。

公开(公告)号：US20160172328A1

公开(公告)日：2016-06-16

申请号：US14966585

申请日：2015-12-11

Applicant: DOWA Electronics Materials Co., Ltd.

Inventor： Keiichi ENDOH ,  Yutaka HISAEDA ,  Akihiro MIYAZAWA ,  Aiko NAGAHARA ,  Toshihiko UEYAMA

IPC: H01L23/00 ,  B23K35/30 ,  B23K1/00

CPC classification number: H01L24/83 ,  B22F1/0014 ,  B22F1/0018 ,  B22F1/0062 ,  B22F7/064 ,  B22F9/24 ,  B22F2301/255 ,  B22F2303/01 ,  B22F2304/054 ,  B22F2304/056 ,  B22F2999/00 ,  B23K1/0008 ,  B23K1/0016 ,  B23K1/20 ,  B23K1/203 ,  B23K35/025 ,  B23K35/3006 ,  B23K35/36 ,  B23K35/3618 ,  B23K2101/42 ,  B82Y30/00 ,  C09J11/06 ,  C22C5/06 ,  H01B1/02 ,  H01L24/11 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L2224/29139 ,  H01L2224/29339 ,  H01L2224/2949 ,  H01L2224/32145 ,  H01L2224/32221 ,  H01L2224/83011 ,  H01L2224/83048 ,  H01L2224/83075 ,  H01L2224/83801 ,  H01L2224/8384 ,  H01L2924/00 ,  H01L2924/0002 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/12042 ,  H01L2924/1301 ,  H01L2924/13033 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/15747 ,  H01L2924/20106 ,  H01L2924/20107 ,  H01L2924/20108 ,  H01L2924/20109 ,  H01L2924/2011 ,  H01L2924/20111 ,  H01L2924/203 ,  H05K3/32 ,  H05K3/3489 ,  H05K2201/0257 ,  H05K2203/086 ,  H05K2203/1131 ,  H01L2224/2919 ,  H01L2924/3512

Abstract: A method of bonding two different substances includes the steps of: applying a bonding material containing a flux component that includes an organic material having at least two carboxyl groups to a bonding surface of a bonding object, disposing an object to be bonded on the bonding material, performing preliminary firing at a preset temperature in a state in which the object to be bonded is disposed, and performing a main firing by heating at a temperature higher than the temperature of the preliminary firing.

Abstract translation: 接合两种不同物质的方法包括以下步骤：将包含含有至少两个羧基的有机材料的助熔剂成分的接合材料施加到接合物的接合表面，将待接合物体设置在接合材料上 在设置待接合物体的状态下，在预设温度下进行预烧，并且在比预热的温度高的温度下进行加热。

公开(公告)号：US09318243B2

公开(公告)日：2016-04-19

申请号：US14359958

申请日：2012-11-26

Applicant: SHOWA DENKO K.K.

Inventor： Hiroshi Uchida

IPC: C09D11/52 ,  H01B1/22 ,  H01B13/00 ,  H05K1/09 ,  H05K3/12 ,  C09D11/037 ,  C09D17/00

CPC classification number: H01B13/003 ,  C09D11/037 ,  C09D11/52 ,  C09D17/00 ,  H01B1/22 ,  H05K1/095 ,  H05K3/1283 ,  H05K2201/0218 ,  H05K2201/0257

Abstract: Provided are a conductive pattern forming method and a composition for forming a conductive pattern by photo irradiation or microwave heating, capable of increasing the conductivity of the conductive pattern. A conductive pattern is formed by preparing a composition for forming a conductive pattern comprising, copper particles each having a copper oxide thin film on the entirety or a part of the surface thereof, copper oxide particles, a reducing agent such as a polyhydric alcohol, a carboxylic acid, or a polyalkylene glycol, and a binder resin; forming a printed pattern having any selected shape on a substrate using this composition for forming a conductive pattern; and subjecting the printed pattern to photo irradiation or microwave heating to generate a sintered body of copper.

Abstract translation: 提供一种导电图案形成方法和通过光照射或微波加热形成导电图案的组合物，其能够增加导电图案的导电性。 通过制备形成导电图案的组合物形成导电图案，所述组合物包括在其整个或部分表面上各自具有氧化铜薄膜的铜颗粒，氧化铜颗粒，还原剂如多元醇， 羧酸或聚亚烷基二醇，和粘合剂树脂; 使用该用于形成导电图案的组合物在基板上形成具有任何选定形状的印刷图案; 并对印刷图案进行光照射或微波加热以产生铜烧结体。

公开(公告)号：US20160099087A1

公开(公告)日：2016-04-07

申请号：US14966598

申请日：2015-12-11

Applicant: DOWA Electronics Materials Co., Ltd.

Inventor： Keiichi ENDOH ,  Yutaka HISAEDA ,  Akihiro MIYAZAWA ,  Aiko NAGAHARA ,  Toshihiko UEYAMA

IPC: H01B1/02 ,  B23K35/30 ,  B23K35/02 ,  H01L23/00 ,  B23K1/00

CPC classification number: H01L24/83 ,  B22F1/0014 ,  B22F1/0018 ,  B22F1/0062 ,  B22F7/064 ,  B22F9/24 ,  B22F2301/255 ,  B22F2303/01 ,  B22F2304/054 ,  B22F2304/056 ,  B22F2999/00 ,  B23K1/0008 ,  B23K1/0016 ,  B23K1/20 ,  B23K1/203 ,  B23K35/025 ,  B23K35/3006 ,  B23K35/36 ,  B23K35/3618 ,  B23K2101/42 ,  B82Y30/00 ,  C09J11/06 ,  C22C5/06 ,  H01B1/02 ,  H01L24/11 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L2224/29139 ,  H01L2224/29339 ,  H01L2224/2949 ,  H01L2224/32145 ,  H01L2224/32221 ,  H01L2224/83011 ,  H01L2224/83048 ,  H01L2224/83075 ,  H01L2224/83801 ,  H01L2224/8384 ,  H01L2924/00 ,  H01L2924/0002 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/12042 ,  H01L2924/1301 ,  H01L2924/13033 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/15747 ,  H01L2924/20106 ,  H01L2924/20107 ,  H01L2924/20108 ,  H01L2924/20109 ,  H01L2924/2011 ,  H01L2924/20111 ,  H01L2924/203 ,  H05K3/32 ,  H05K3/3489 ,  H05K2201/0257 ,  H05K2203/086 ,  H05K2203/1131 ,  H01L2224/2919 ,  H01L2924/3512

Abstract: A bonded product is obtained by applying a silver paste containing silver nanoparticles having an average primary particle diameter of 1 to 200 nm, and performing firing. A diameter of a crystallite of the bonded product on a (111) plane of Ag when heated at 250° C. for 10 minutes in an inert atmosphere is 65 nm or larger.

Abstract translation: 通过涂布含有平均一次粒径为1〜200nm的银纳米粒子的银膏，进行烧成，得到粘合体。 在惰性气氛中在250℃加热10分钟时，Ag的（111）面上的结合产物的微晶直径为65nm以上。

公开(公告)号：US09273235B2

公开(公告)日：2016-03-01

申请号：US14124509

申请日：2011-06-10

Applicant: Satoru Kurita ,  Takashi Hinotsu ,  Shinya Sasaki

Inventor： Satoru Kurita ,  Takashi Hinotsu ,  Shinya Sasaki

IPC: B32B5/16 ,  B32B25/02 ,  C09J11/06 ,  C22C5/06 ,  H01L23/00 ,  H05K1/09 ,  B22F1/00

CPC classification number: C09J11/06 ,  B22F1/0018 ,  B22F1/0062 ,  C22C5/06 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/83 ,  H01L2224/2732 ,  H01L2224/29294 ,  H01L2224/29339 ,  H01L2224/32245 ,  H01L2224/83192 ,  H01L2224/83203 ,  H01L2924/00011 ,  H01L2924/00013 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/1301 ,  H01L2924/13033 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/15747 ,  H05K1/092 ,  H05K2201/0224 ,  H05K2201/0257 ,  Y10T428/24413 ,  H01L2224/29298 ,  H01L2924/00 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299 ,  H01L2224/2929 ,  H01L2924/00014

Abstract: A bonding material using silver nanoparticles considerably changes in coating-material property in response to a slight change in composition, and the stability thereof has been insufficient for large-amount application. A bonding material which uses silver nanoparticles, meets the requirements for mass printing, attains dimensional stability, and gives a smooth printed surface is provided. The bonding material includes silver nanoparticles which have at least an average primary particle diameter of 1 nm to 200 nm and have been coated with an organic substance having 8 or less carbon atoms, a dispersion medium, and a viscosity modifier composed of an organic substance, and has a viscosity (measured at a shear rate of 15.7 [1/s]) of 100 Pa·s or lower and a thixotropic ratio (measured at a shear rate of 3.1 [1/s]/measured at a shear rate of 15.7 [1/s]) of 4 or lower.

Abstract translation: 使用银纳米颗粒的接合材料响应于组成的轻微变化而显着改变涂层材料性质，并且其稳定性对于大量施加而言不足。 使用银纳米颗粒的接合材料满足大量印刷的要求，获得尺寸稳定性，并提供光滑的印刷表面。 接合材料包括至少具有1nm至200nm的平均初级粒径且已经涂覆有碳原子数为8以下的有机物的分散介质和由有机物构成的粘度调节剂的银纳米粒子， 并且具有100Pa·s以下的粘度（在剪切速度为15.7 [1 / s]下测定）和在剪切速度为15.7℃时测定的触变性比（在剪切速度为3.1 [1 / s]下测定） [1 / s]）为4以下。