公开(公告)号：US20120281362A1

公开(公告)日：2012-11-08

申请号：US13522218

申请日：2011-01-13

Applicant: Yuusaku Ishimine ,  Masayuki Moriyama ,  Kenji Komatsubara

Inventor： Yuusaku Ishimine ,  Masayuki Moriyama ,  Kenji Komatsubara

IPC: H01L23/15 ,  H05K7/20 ,  B32B33/00 ,  H05K1/00

CPC classification number: H01L23/13 ,  C04B35/587 ,  C04B37/026 ,  C04B2235/3206 ,  C04B2235/3217 ,  C04B2235/3224 ,  C04B2235/3878 ,  C04B2235/3882 ,  C04B2235/5276 ,  C04B2235/5436 ,  C04B2235/5445 ,  C04B2235/604 ,  C04B2235/6581 ,  C04B2235/6582 ,  C04B2235/6587 ,  C04B2235/721 ,  C04B2235/723 ,  C04B2235/77 ,  C04B2235/786 ,  C04B2235/80 ,  C04B2235/945 ,  C04B2235/9607 ,  C04B2237/125 ,  C04B2237/368 ,  C04B2237/407 ,  C04B2237/74 ,  H01L23/15 ,  H01L23/3731 ,  H01L23/3735 ,  H01L35/32 ,  H01L2924/0002 ,  H05K1/0306 ,  H05K3/38 ,  H05K2201/0248 ,  H05K2201/0266 ,  H05K2201/0269 ,  Y10T428/24413 ,  Y10T428/24421 ,  Y10T428/25 ,  Y10T428/259 ,  H01L2924/00

Abstract: A silicon nitride substrate comprises a substrate comprising a silicon nitride sintered body, and a plurality of granular bodies containing silicon and integrated to a principal surface of the substrate, wherein a plurality of needle crystals or column crystals comprising mainly silicon nitride are extended from a portion of the granular bodies. A brazing material is applied to a principal surface of the substrate, and a circuit member and a heat radiation member are arranged on the applied brazing material, and bonded by heating. Because of a plurality of granular bodies integrated to the principal surface of the substrate, and a plurality of the needle crystals or the column crystals extended from a portion of the granular bodies, a high anchor effect is produced so that the circuit member and the heat radiation member are firmly bonded to the silicon nitride substrate.

Abstract translation: 氮化硅衬底包括含有氮化硅烧结体的衬底和多个含有硅的颗粒体并且与衬底的主表面集成在一起，其中主要包含氮化硅的多个针状晶体或柱状晶体从一部分 的颗粒体。 将钎焊材料施加到基板的主表面，并且将电路构件和散热构件布置在所施加的钎焊材料上，并通过加热粘合。 由于集成到基板的主面的多个粒状体以及从一部分粒状体延伸的多个针状晶体或柱状晶体，产生高的锚定效应，使得电路部件和热量 辐射构件牢固地结合到氮化硅衬底上。

公开(公告)号：US07951446B2

公开(公告)日：2011-05-31

申请号：US12265561

申请日：2008-11-05

Applicant: Beom Joon Cho ,  Jong Myeon Lee ,  Myung Whun Chang

Inventor： Beom Joon Cho ,  Jong Myeon Lee ,  Myung Whun Chang

IPC: B32B18/00 ,  B32B5/16 ,  C04B35/00

CPC classification number: B32B18/00 ,  C04B35/638 ,  C04B2235/3217 ,  C04B2235/5292 ,  C04B2235/5436 ,  C04B2235/6562 ,  C04B2235/6567 ,  C04B2235/721 ,  C04B2235/9615 ,  C04B2237/562 ,  H05K1/0306 ,  H05K3/4611 ,  H05K3/4629 ,  H05K2201/0209 ,  H05K2201/0266 ,  H05K2201/0269 ,  H05K2203/308 ,  Y10T428/24942 ,  Y10T428/2495 ,  Y10T428/25 ,  Y10T428/252

Abstract: There is provided a hard-to-sinter constraining green sheet and a method of manufacturing a multilayer ceramic substrate using the same. The hard-to-sinter constraining green sheet disposed at least one of top and bottom surfaces of a non-sintered multi-layer ceramic substrate, the hard-to-sinter constraining green sheet including: a first constraining layer having a surface to be positioned on the multi-layer ceramic substrate, the first constraining layer including a first organic binder and a first inorganic powder having a spherical shape or a quasi-spherical shape; and a second constraining layer bonded to a top surface of the first constraining layer and including a second organic binder and a second inorganic powder having a flake shape, the second constraining layer having a powder packing density lower than that of the first constraining layer.

Abstract translation: 提供了难以烧结的约束生片和使用其制造多层陶瓷基板的方法。 所述难烧结约束生片设置在非烧结多层陶瓷衬底的顶表面和底表面中的至少一个上，所述难烧结约束生片包括：具有待定位表面的第一约束层 在多层陶瓷基板上，第一约束层包括第一有机粘合剂和具有球形或准球形的第一无机粉末; 以及第二约束层，其结合到所述第一约束层的顶表面并且包括第二有机粘合剂和具有片状形状的第二无机粉末，所述第二约束层的粉末堆积密度低于所述第一约束层的密度。

公开(公告)号：US20100065314A1

公开(公告)日：2010-03-18

申请号：US12256665

申请日：2008-10-23

Applicant: Pui-Yan Lin ,  Govindasamy Paramasivam Rajendran ,  George Elias Zahr

Inventor： Pui-Yan Lin ,  Govindasamy Paramasivam Rajendran ,  George Elias Zahr

IPC: H05K1/00 ,  G03F7/20

CPC classification number: H01L23/49894 ,  H01L2924/0002 ,  H01L2924/3011 ,  H05K1/0271 ,  H05K3/108 ,  H05K3/4661 ,  H05K2201/0209 ,  H05K2201/0269 ,  H05K2201/068 ,  Y10T29/49126 ,  Y10T29/49156 ,  Y10T29/49165 ,  Y10T428/24917 ,  Y10T428/25 ,  Y10T428/2998 ,  Y10T428/31515 ,  Y10T428/31518 ,  Y10T428/31529 ,  H01L2924/00

Abstract: Provided, are multi-layer chip carriers comprising an asymmetric cross-linked polymeric dielectric film, and processes for making the chip carriers.

Abstract translation: 提供了包括不对称交联聚合物电介质膜的多层芯片载体，以及用于制造芯片载体的工艺。

公开(公告)号：US20100055393A1

公开(公告)日：2010-03-04

申请号：US12467542

申请日：2009-05-18

Applicant: Yun Hwi PARK ,  Bong Gyun Kim ,  Yoon Hyuck Choi

Inventor： Yun Hwi PARK ,  Bong Gyun Kim ,  Yoon Hyuck Choi

IPC: B32B3/10

CPC classification number: H05K3/4061 ,  H05K1/0242 ,  H05K3/4629 ,  H05K2201/0269 ,  H05K2201/096 ,  H05K2203/082 ,  Y10T428/24322 ,  Y10T428/24926

Abstract: There is provided a multilayer ceramic substrate including a conductive via of a dual-layer structure capable of preventing loss in electrical conductivity and signal. The multilayer ceramic substrate includes: a plurality of dielectric layers; and a circuit pattern part formed on at least a portion of the dielectric layers, the circuit pattern part including at least one conductive via and conductive pattern, wherein the at least one conductive via comprises an outer peripheral portion and an inner peripheral portion, the outer peripheral portion formed along an inner wall of a via hole extending through the dielectric layers and formed of a first conductive material containing a metal, and the inner peripheral portion filled in the outer peripheral portion and formed of a second conductive material having a shrinkage initiation temperature higher than a shrinkage initiation temperature of the first conductive material.

Abstract translation: 提供了一种包括能够防止导电性和信号损失的双层结构的导电通孔的多层陶瓷基板。 多层陶瓷基板包括：多个电介质层; 以及形成在所述电介质层的至少一部分上的电路图形部分，所述电路图形部分包括至少一个导电通路和导电图案，其中所述至少一个导电通孔包括外周部分和内周部分， 沿着贯穿电介质层的通路孔的内壁形成的周边部分，并且由包含金属的第一导电材料形成，并且内周部分填充在外周部分中，并由具有收缩起始温度的第二导电材料形成 高于第一导电材料的收缩起始温度。

公开(公告)号：US20100006334A1

公开(公告)日：2010-01-14

申请号：US12476276

申请日：2009-06-02

Applicant: Yoshinori TAKENAKA ,  Takeshi NAKAMURA ,  Takamitsu HATTORI

Inventor： Yoshinori TAKENAKA ,  Takeshi NAKAMURA ,  Takamitsu HATTORI

IPC: H05K1/14 ,  H05K3/10

CPC classification number: H05K1/115 ,  H05K3/0032 ,  H05K3/107 ,  H05K3/205 ,  H05K3/465 ,  H05K3/4661 ,  H05K3/4682 ,  H05K2201/0195 ,  H05K2201/0209 ,  H05K2201/0266 ,  H05K2201/0269 ,  H05K2201/0376 ,  H05K2203/025 ,  Y10T29/49155 ,  Y10T29/49204

Abstract: A printed wiring board including an insulative material, a first conductive circuit formed on the insulative material, a resin insulation layer including a first insulation layer formed on the insulative material and on the first conductive circuit and which insulates between lines of the first conductive circuit, the first insulation layer including inorganic particles having a first average diameter, and a second insulation layer formed on the first insulation layer and including a recessed portion and an opening portion, the second insulation layer including inorganic particles having a second average diameter smaller than the first average diameter, a second conductive circuit formed in the recessed portion, and a via conductor formed in the opening portion and which connects the first conductive circuit to the second conductive circuit.

Abstract translation: 1.一种印刷线路板，包括绝缘材料，形成在所述绝缘材料上的第一导电电路，树脂绝缘层，所述树脂绝缘层包括形成在所述绝缘材料上的第一绝缘层和所述第一导电电路，并且在所述第一导电电路的线之间绝缘， 所述第一绝缘层包括具有第一平均直径的无机颗粒和形成在所述第一绝缘层上并包括凹部和开口部的第二绝缘层，所述第二绝缘层包括具有小于所述第一绝缘层的第二平均直径的第二平均直径的无机颗粒 平均直径，形成在凹部中的第二导电电路，以及形成在开口部分中并将第一导电电路连接到第二导电电路的通孔导体。

公开(公告)号：US20090264028A1

公开(公告)日：2009-10-22

申请号：US12440986

申请日：2006-09-14

Applicant: Toshiaki Chuma

Inventor： Toshiaki Chuma

IPC: H01R4/02 ,  H05K3/00

CPC classification number: H05K3/4617 ,  B23K1/0016 ,  B23K35/001 ,  B23K35/0238 ,  B23K35/262 ,  B23K35/3613 ,  B23K35/3618 ,  B23K35/362 ,  C25D5/48 ,  H05K3/341 ,  H05K3/3463 ,  H05K2201/0269 ,  H05K2203/1476 ,  Y02P70/613 ,  Y10T29/49149 ,  Y10T428/12708 ,  Y10T428/12715 ,  Y10T428/12903

Abstract: A joint structure of the present invention includes a conductive member containing copper as a major component thereof, an electrode member containing copper as a major component thereof, and a joint portion formed by fusion welding the conductive member and the electrode member with a brazing material containing tin as a major component thereof and containing substantially no copper, wherein the amount of copper atoms contained in the alloy in the central part of the joint portion is higher than that in the outer circumference part.

Abstract translation: 本发明的接合结构包括以铜为主要成分的导电构件，以铜为主要成分的电极构件和通过将导电构件和电极构件与含有 锡作为其主要组分并且基本上不含铜，其中在接合部分的中心部分中合金中包含的铜原子的量高于外周部分。

公开(公告)号：US20090110909A1

公开(公告)日：2009-04-30

申请号：US12256662

申请日：2008-10-23

Applicant: Jeffrey Glenn Innocenzo ,  Pui-Yan Lin ,  Richard C. Oliver ,  Govindasamy Paramasivam Rajendran ,  George Elias Zahr

Inventor： Jeffrey Glenn Innocenzo ,  Pui-Yan Lin ,  Richard C. Oliver ,  Govindasamy Paramasivam Rajendran ,  George Elias Zahr

IPC: B32B5/16 ,  B32B27/38

CPC classification number: H05K3/4673 ,  H05K3/4652 ,  H05K3/4655 ,  H05K3/4661 ,  H05K2201/0209 ,  H05K2201/0269 ,  H05K2201/0358 ,  H05K2201/068 ,  Y10T428/25 ,  Y10T428/31511

Abstract: Cross-linked polymeric films suitable for use as a dielectric build-up layer in multi-layer chip carriers are provided. The films are suitable for use in any application using films that are dimensionally stable to temperature changes.

Abstract translation: 提供了适合用作多层芯片载体中的电介质堆积层的交联聚合物膜。 这些薄膜适用于使用尺寸稳定于温度变化的薄膜的任何应用。

公开(公告)号：US20070117263A1

公开(公告)日：2007-05-24

申请号：US11651273

申请日：2007-01-08

Applicant: Song-Hua Shi ,  Lejun Wang ,  Tian-An Chen

Inventor： Song-Hua Shi ,  Lejun Wang ,  Tian-An Chen

IPC: H01L21/00

CPC classification number: C08G73/02 ,  B32B27/08 ,  C08L79/02 ,  C09J161/34 ,  C09J179/04 ,  H01B3/303 ,  H01B3/38 ,  H01L21/563 ,  H01L23/293 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/83 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2224/29 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/73204 ,  H01L2224/83101 ,  H01L2224/8319 ,  H01L2224/838 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01033 ,  H01L2924/01051 ,  H01L2924/01056 ,  H01L2924/0665 ,  H01L2924/14 ,  H01L2924/3025 ,  H05K3/323 ,  H05K2201/0269 ,  Y10T428/12528 ,  Y10T428/31511 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2924/00014 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299

Abstract: Microelectronic and optoelectronic packaging embodiments are described with underfill materials including polybenzoxazine, having the general formula:

Abstract translation: 使用具有以下通式的聚苯并恶嗪的底部填充材料描述微电子和光电子封装实施例：

公开(公告)号：US20060003137A1

公开(公告)日：2006-01-05

申请号：US10884722

申请日：2004-07-02

Applicant: Aaron Amstutz ,  Thomas Grabenstetter ,  Randall Sommer ,  Christopher Stickling

Inventor： Aaron Amstutz ,  Thomas Grabenstetter ,  Randall Sommer ,  Christopher Stickling

IPC: B32B1/04 ,  B29C65/00

CPC classification number: B29C45/14819 ,  B29C43/146 ,  B29C43/18 ,  B29C43/52 ,  B29K2995/0087 ,  B32B7/02 ,  H05K3/284 ,  H05K2201/0269 ,  H05K2203/1316 ,  H05K2203/1322 ,  Y10T428/23 ,  Y10T428/233 ,  Y10T428/239

Abstract: A system and method for encapsulating and protecting a component assembly is disclosed. A barrier system comprising a first layer having a first set of physical properties and a second layer having a second set of physical properties is adapted to protectively surround the component assembly. A continuous transitory material is formed between the first layer and the second layer at associated first and second margin portions such that the first layer and the second layer are not prone to delamination. The physical properties of each layer of the barrier system provide protection to the component assembly from various types of physical and environmental damage.

Abstract translation: 公开了一种用于封装和保护部件组件的系统和方法。 包括具有第一组物理性质的第一层和具有第二组物理性质的第二层的屏障系统适于保护性地围绕该组件组件。 在相关联的第一和第二边缘部分处，在第一层和第二层之间形成连续的短暂材料，使得第一层和第二层不易分层。 每个屏障系统层的物理特性为组件组件提供了对各种物理和环境损害的保护。

公开(公告)号：US20050196906A1

公开(公告)日：2005-09-08

申请号：US11099907

申请日：2005-04-05

Applicant: Song-Hua Shi ,  Lejun Wang ,  Tian-An Chen

Inventor： Song-Hua Shi ,  Lejun Wang ,  Tian-An Chen

IPC: B32B27/08 ,  C09J161/34 ,  C09J179/04 ,  H01B3/30 ,  H01B3/38 ,  H01L21/56 ,  H01L23/29 ,  H01L21/44 ,  H01L21/48 ,  H01L51/40

CPC classification number: C08G73/02 ,  B32B27/08 ,  C08L79/02 ,  C09J161/34 ,  C09J179/04 ,  H01B3/303 ,  H01B3/38 ,  H01L21/563 ,  H01L23/293 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/83 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2224/29 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/73204 ,  H01L2224/83101 ,  H01L2224/8319 ,  H01L2224/838 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01033 ,  H01L2924/01051 ,  H01L2924/01056 ,  H01L2924/0665 ,  H01L2924/14 ,  H01L2924/3025 ,  H05K3/323 ,  H05K2201/0269 ,  Y10T428/12528 ,  Y10T428/31511 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2924/00014 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299

Abstract: Microelectronic and optoelectronic packaging embodiments are described with underfill materials including polybenzoxazine, having the general formula: