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    METHOD OF FORMING FIBROUS LAMINATE CHIP CARRIER STRUCTURES
    91.
    发明申请
    METHOD OF FORMING FIBROUS LAMINATE CHIP CARRIER STRUCTURES 审中-公开
    形成薄片层状载体结构的方法

    公开(公告)号：US20120012553A1

    公开(公告)日：2012-01-19

    申请号：US12837584

    申请日：2010-07-16

    Applicant: Robert M. Japp ,  Kostas I. Papathomas ,  Cheryl Palomaki

    Inventor： Robert M. Japp ,  Kostas I. Papathomas ,  Cheryl Palomaki

    IPC: B32B38/10 ,  C23F1/02

    CPC classification number: H05K1/0366 ,  B32B37/02 ,  B32B2309/105 ,  B32B2457/08 ,  H05K3/42 ,  H05K2201/0293 ,  H05K2201/0358 ,  H05K2203/063 ,  Y10T156/1062

    Abstract: A method for making a leadless chip carrier (LCC) for use in electronic packages having a core layer stripped of copper cladding, containing drilled clearance holes within, a layer of resin coated copper (RCC) placed on the upper surface of the core layer and a second layer of RCC placed on the lower surface of the core layer. The layers are laminated together with the RCC filling the clearance holes during lamination. A pattern is etched on the RCC and vias are drilled through the filled clearance holes and pre-plated with seed copper layers. The seed copper layers in the vias are then covered by a layer of copper plating to meet the requirements of the core buildup layer, and resin inhibiting conductive anodic filament (CAF) growth within the structure.

    Abstract translation: 一种制造用于电子封装的无引线芯片载体（LCC）的方法，所述无引线芯片载体（LCC）具有剥离铜包层的芯层，其中包含钻孔的间隙孔，放置在芯层的上表面上的树脂涂覆铜层（RCC），以及 第二层RCC放置在芯层的下表面上。 层压在一起，RCC在层压期间填充间隙孔。 在RCC上蚀刻图案，并且通过填充的间隙孔钻出通孔并且预镀有种子铜层。 然后通孔中的种子铜层被镀铜层覆盖以满足堆芯层的要求，并且在结构内树脂抑制导电阳极丝（CAF）生长。

    MULTI LAYER CIRCUIT BOARD AND MANUFACTURING METHOD OF THE SAME
    92.
    发明申请
    MULTI LAYER CIRCUIT BOARD AND MANUFACTURING METHOD OF THE SAME 有权
    多层电路板及其制造方法

    公开(公告)号：US20110214907A1

    公开(公告)日：2011-09-08

    申请号：US13063631

    申请日：2008-12-18

    Applicant: Jeong Don Kwon ,  Seung Min Hong ,  Ju Ho Shin

    Inventor： Jeong Don Kwon ,  Seung Min Hong ,  Ju Ho Shin

    IPC: H05K1/09 ,  B32B37/02

    CPC classification number: H05K3/4655 ,  H05K1/0263 ,  H05K3/4652 ,  H05K2201/0195 ,  H05K2201/0293 ,  Y10T428/24479 ,  Y10T428/24917 ,  Y10T442/3431

    Abstract: Disclosed is a PCB having multiple layers of heavy copper. A prepreg having a nonwoven glass web substrate is used alone or together with another prepreg having a glass fabric substrate so that the space between heavy copper, which is comparable to a thick film, can be filled efficiently without creating voids. The PCB includes a copper clad laminate having first copper patterned on one surface or both surfaces of a core substrate; at least one first prepreg laminated on one surface or both surfaces of the copper clad laminate, nonwoven glass web being used as the substrate of the first prepreg; at least one second prepreg laminated on one surface or both surfaces of the first prepreg, glass fabric being used as a substrate of the second prepreg; and second copper laminated on one surface or both surfaces of the second prepreg.

    Abstract translation: 公开了具有多层重铜的PCB。 具有非织造玻璃网状基材的预浸料单独使用或与具有玻璃织物基材的另一种预浸料一起使用，使得可以有效地填充与厚膜相当的重铜之间的空间而不产生空隙。 PCB包括在芯基板的一个表面或两个表面上图案化的第一铜的覆铜层压板; 层叠在覆铜层压板的一个表面或两个表面上的至少一个第一预浸料，用作第一预浸料的基材的非织造玻璃纤维网; 在所述第一预浸料的一个表面或两个表面上层叠的至少一个第二预浸料，用作所述第二预浸料的基材的玻璃织物; 和第二铜层压在第二预浸料的一个表面或两个表面上。

    Circuit board and production method therefor
    94.
    发明申请
    Circuit board and production method therefor 审中-公开

    公开(公告)号：US20060210780A1

    公开(公告)日：2006-09-21

    申请号：US11434931

    申请日：2006-05-17

    Applicant: Toshihiro Nishii

    Inventor： Toshihiro Nishii

    IPC: B32B3/00

    CPC classification number: H05K3/4688 ,  H05K1/0366 ,  H05K3/4069 ,  H05K3/4614 ,  H05K3/4626 ,  H05K3/4652 ,  H05K3/4655 ,  H05K2201/0278 ,  H05K2201/029 ,  H05K2201/0293 ,  H05K2201/10378 ,  Y10T428/24917

    Abstract: A method of manufacturing a circuit board comprising: an inner layer board laminating step for laminating inner layer board material and one or more metal sheet(s) for inner layer; an inner layer circuit forming step for forming circuits of the metal sheet to make an inner layer circuit board; a multi-layer laminating step for laminating one or more metal sheet(s) for multi-layer, one or more multi-layer board material(s) and one or more inner layer circuit board(s); and a multi-layer circuit forming step for forming circuits of the metal sheet for the multi-layer, wherein the inner layer board material and the multi-layer board material are different in material composition from each other. According to the present invention, it is possible to stabilize the quality of interstitial connection of the inner layer circuit board and to improve the mechanical strength such as the adhesive strength of an outer layer circuit.

    Circuit board having an interstitial inner via hole structure
    97.
    发明授权
    Circuit board having an interstitial inner via hole structure 失效
    具有间隙内通孔结构的电路板

    公开(公告)号：US06734375B2

    公开(公告)日：2004-05-11

    申请号：US09956205

    申请日：2001-09-18

    Applicant: Yoshihiro Kawakita ,  Daizo Andoh ,  Fumio Echigo ,  Tadashi Nakamura

    Inventor： Yoshihiro Kawakita ,  Daizo Andoh ,  Fumio Echigo ,  Tadashi Nakamura

    IPC: H05K111

    CPC classification number: H05K3/4626 ,  H05K1/036 ,  H05K1/0366 ,  H05K3/20 ,  H05K3/4069 ,  H05K3/4614 ,  H05K3/4652 ,  H05K3/4655 ,  H05K3/4658 ,  H05K2201/0116 ,  H05K2201/0195 ,  H05K2201/0278 ,  H05K2201/0293 ,  H05K2201/0355 ,  H05K2203/0191 ,  H05K2203/1461 ,  Y10T29/49149 ,  Y10T29/49151 ,  Y10T29/49155 ,  Y10T29/49163 ,  Y10T29/49165 ,  Y10T428/24917 ,  Y10T428/249953 ,  Y10T428/249996

    Abstract: A circuit board including a desired number of electrically insulating layers and wiring layers laminated alternately, and an inner via hole for securing an electrical connection between the wiring layers by compressing and hardening a conductive paste including a conductive particle and a resin. In the electrically insulating layer, a porous sheet is provided a resin sheet at least one surface, and the porous sheet is not impregnated with a resin at least at a central portion. A through hole penetrating the electrically insulating layer in the direction of the thickness of the electrically insulating layer is filled with a conductive paste including a conductive particle and a resin, and pores that are present inside the porous sheet are filled with laminated resin. The average hole diameter of the pores inside the porous sheet may be smaller than the average particle size of the conductive particle. Thereby, it is possible to make the insulating layer of the circuit board securing the interlayer electrically connection by an inner via hole including a conductive paste to be homogenized and ultra-thin and improve the reliability of the connection of the inner via hole.

    Abstract translation: 包括所需数量的电绝缘层和交替层叠的布线层的电路板，以及用于通过压缩和硬化包括导电颗粒和树脂的导电膏来固定布线层之间的电连接的内通孔。 在电绝缘层中，多孔片材至少在一个表面上设置有树脂片，多孔片材至少在中心部分不浸渍树脂。 在电绝缘层的厚度方向贯通电绝缘层的贯通孔填充有包含导电性粒子和树脂的导电性糊剂，并且在多孔质片材内存在的孔填充有层叠树脂。 多孔片内的孔的平均孔径可以小于导电性粒子的平均粒径。 由此，可以使电路基板的绝缘层通过包含导电性糊剂的内部通路孔进行层间电连接，使其均匀化，超薄化，提高内部通孔连接的可靠性。

    Glass fiber nonwoven fabric and printed wiring board
    98.
    发明授权
    Glass fiber nonwoven fabric and printed wiring board 有权
    玻璃纤维无纺布和印刷线路板

    公开(公告)号：US06615616B2

    公开(公告)日：2003-09-09

    申请号：US10361701

    申请日：2003-02-11

    Applicant: Michio Konno ,  Yasushi Miura ,  Shoichi Saito ,  Shin Kasai

    Inventor： Michio Konno ,  Yasushi Miura ,  Shoichi Saito ,  Shin Kasai

    IPC: C03B37083

    CPC classification number: H05K1/0366 ,  C03B37/083 ,  D04H1/4218 ,  D04H1/4226 ,  D04H1/4382 ,  D04H1/4391 ,  D04H3/00 ,  H05K2201/0293 ,  H05K2201/0296 ,  Y02P40/57

    Abstract: A nonwoven fabric is constructed of a highly flat glass fiber which is a glass fiber whose section is flat and has a flatness ratio of 2.0 to 10 and which has such a section that the packing fraction is at least 85%, preferably at least 90%. In this nonwoven fabric, the glass fiber section has a shape near rectangle, and hence, the glass fibers can be arranged very densely to form a thin nonwoven fabric having a high bulk density, and when it is used as a laminate material, the glass fiber content can be increased and the surface smoothness can simultaneously be enhanced and can be used appropriately as a reinforcing material for a printed wiring board. Moreover, the above flat glass fiber can be produced by use of, for example, a nozzle having such a shape that one side of the major axis walls of a nozzle chip having a flat nozzle hole is partly notched.

    Abstract translation: 非织造布由高度扁平的玻璃纤维构成，该玻璃纤维的截面为平坦的玻璃纤维，平坦度为2.0〜10，填充率为85％以上，优选为90％以上， 。 在该非织造布中，玻璃纤维部分的形状接近矩形，因此玻璃纤维可以非常密集地布置以形成具有高堆积密度的薄无纺布，并且当其用作层压材料时，玻璃纤维 可以提高纤维含量，同时可以提高表面平滑性，并且可以适当地用作印刷线路板的增强材料。 此外，上述平板玻璃纤维可以通过使用例如具有扁平喷嘴孔的喷嘴片的长轴壁的一侧部分凹口的形状的喷嘴来制造。

    GLASS FIBER NONWOVEN FABRIC AND PRINTED WIRING BOARD
    99.
    发明申请
    GLASS FIBER NONWOVEN FABRIC AND PRINTED WIRING BOARD 有权
    玻璃纤维非织造布和印刷线路板

    公开(公告)号：US20030131632A1

    公开(公告)日：2003-07-17

    申请号：US10361701

    申请日：2003-02-11

    Applicant: NITTO BOSEKI CO., LTD.

    Inventor： Michio Konno ,  Yasushi Miura ,  Shoichi Saito ,  Shin Kasai

    IPC: C03B037/083

    CPC classification number: H05K1/0366 ,  C03B37/083 ,  D04H1/4218 ,  D04H1/4226 ,  D04H1/4382 ,  D04H1/4391 ,  D04H3/00 ,  H05K2201/0293 ,  H05K2201/0296 ,  Y02P40/57

    Abstract: A nonwoven fabric is constructed of a highly flat glass fiber which is a glass fiber whose section is flat and has a flatness ratio of 2.0 to 10 and which has such a section that the packing fraction is at least 85%, preferably at least 90%. In this nonwoven fabric, the glass fiber section has a shape near rectangle, and hence, the glass fibers can be arranged very densely to form a thin nonwoven fabric having a high bulk density, and when it is used as a laminate material, the glass fiber content can be increased and the surface smoothness can simultaneously be enhanced and can be used appropriately as a reinforcing material for a printed wiring board. Moreover, the above flat glass fiber can be produced by use of, for example, a nozzle having such a shape that one side of the major axis walls of a nozzle chip having a flat nozzle hole is partly notched.

    Abstract translation: 非织造布由高度扁平的玻璃纤维构成，该玻璃纤维的截面为平坦的玻璃纤维，平坦度为2.0〜10，填充率为85％以上，优选为90％以上的部分， 。 在该非织造布中，玻璃纤维部分的形状接近矩形，因此玻璃纤维可以非常密集地布置以形成具有高堆积密度的薄无纺布，并且当其用作层压材料时，玻璃纤维 可以提高纤维含量，同时可以提高表面平滑性，并且可以适当地用作印刷线路板的增强材料。 此外，上述平板玻璃纤维可以通过使用例如具有扁平喷嘴孔的喷嘴片的长轴壁的一侧部分凹口的形状的喷嘴来制造。

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