公开(公告)号：US4517051A

公开(公告)日：1985-05-14

申请号：US599839

申请日：1984-04-13

Applicant: Charles E. Gazdik ,  Donald G. McBride

Inventor： Charles E. Gazdik ,  Donald G. McBride

IPC: H01L21/48 ,  H01L23/14 ,  H01L23/538 ,  H05K1/00 ,  H05K3/00 ,  H05K3/20 ,  H05K3/38 ,  H05K3/46 ,  C23F1/02 ,  B29C17/08 ,  B44C1/22 ,  C03C15/00

CPC classification number: H05K3/467 ,  H01L21/4846 ,  H01L23/145 ,  H01L23/5384 ,  H05K3/20 ,  H01L2224/16225 ,  H05K1/0393 ,  H05K2201/0154 ,  H05K2201/0317 ,  H05K2203/0152 ,  H05K2203/0376 ,  H05K2203/0723 ,  H05K3/002 ,  H05K3/388 ,  Y10T29/49165

Abstract: A high density electronic circuit module which includes a thin flexible film chip carrier having circuitry on both sides thereof. The double-sided thin, flexible circuitry is fabricated by depositing a first layer of chrome-copper-chrome circuitry on an aluminum substrate. This first layer of chrone-copper-chrome circuitry is covered with a layer of polyimide. Vias are etched into the polyimide. Next, a second layer of chrome-copper-chrome circuitry is deposited on top of the polyimide. The first and second layers of circuitry are connected through the etched vias. Finally, hydrochloric acid is utilized to etch away the aluminum substrate carrier. It is noted that hydrochloric acid etches aluminum whereas it does not etch chrome-copper-chrome circuitry.

Abstract translation: 一种高密度电子电路模块，其包括在其两侧具有电路的薄柔性薄膜芯片载体。 通过在铝基板上沉积第一层铬 - 铜 - 铬电路来制造双面薄柔性电路。 这个第一层铜 - 铜 - 铬电路被一层聚酰亚胺覆盖。 通孔被刻蚀成聚酰亚胺。 接下来，在聚酰亚胺的顶部上沉积第二层铬 - 铜 - 铬电路。 第一和第二层电路通过蚀刻的通孔连接。 最后，使用盐酸蚀刻掉铝基板载体。 应注意，盐酸腐蚀铝，而不会蚀刻铬 - 铜 - 铬电路。

公开(公告)号：US4484038A

公开(公告)日：1984-11-20

申请号：US445694

申请日：1982-12-01

Applicant: William E. Dorman ,  Gary Brown

Inventor： William E. Dorman ,  Gary Brown

IPC: H01H13/702 ,  H01H13/703 ,  H01H13/785 ,  H05K1/00 ,  H05K1/09 ,  H01H13/70

CPC classification number: H01H13/785 ,  H01H13/702 ,  H05K1/09 ,  H01H13/703 ,  H01H2201/018 ,  H01H2201/024 ,  H01H2207/004 ,  H01H2207/04 ,  H01H2209/038 ,  H01H2209/06 ,  H01H2209/082 ,  H01H2213/01 ,  H01H2229/004 ,  H01H2229/012 ,  H01H2229/028 ,  H01H2231/004 ,  H05K1/0393 ,  H05K1/095 ,  H05K2201/0317 ,  H05K2201/0391

Abstract: A flexible membrane touch panel switch having contacts comprised of a first set of thin conductive metal film strips formed on a first layer, and of a second set of thin conductive metal film strips orthogonal to the first set and formed on a second layer, the second layer being spaced apart from and selectively movable into contact with the first layer, the panel further having silver conductive leads formed on each of the layers, each lead being integrally affixed at one end to, in electrical contact with, and extending from one of the strips for connection to external circuitry.

Abstract translation: 一种柔性膜触摸面板开关，其具有由形成在第一层上的第一组薄导电金属薄膜带和与第一组垂直并形成在第二层上的第二组薄导电金属薄膜条构成的触点，第二组 层与第一层间隔开并且选择性地可移动地与第一层接触，该面板还具有形成在每个层上的银导电引线，每个引线一端固定在一个端部上， 用于连接到外部电路的条。

公开(公告)号：US4463338A

公开(公告)日：1984-07-31

申请号：US291113

申请日：1981-08-07

Applicant: Ferdinand Utner ,  Harald Vetter

Inventor： Ferdinand Utner ,  Harald Vetter

IPC: H01C3/06 ,  H01C13/02 ,  H01C17/06 ,  H01G4/40 ,  H01L27/01 ,  H05K1/11 ,  H05K1/16 ,  H05K3/00 ,  H05K3/40 ,  H01C3/00

CPC classification number: H01C13/02 ,  H01C17/06 ,  H05K1/118 ,  H05K1/167 ,  H05K2201/0317 ,  H05K2201/055 ,  H05K2201/09263 ,  H05K3/0097 ,  H05K3/403 ,  Y10T29/49101

Abstract: An electrical network containing at least one electric resistor, includes a support foil and at least one resistance layer coating the support foil forming the at least one electric resistor. The support foil and resistance layer are folded along a zig-zag line forming two outer surfaces of the resistance layer. Contact layers are each disposed on a different one of the outer surfaces of the resistance layer, a plastic layer is applied on the contact layers, and outer contact layers each make contact with a different one of the contact layers. A method is also provided for producing the same.

Abstract translation: 包含至少一个电阻器的电网包括支撑箔和至少一个电阻层，该电阻层涂覆形成至少一个电阻器的支撑箔。 支撑箔和电阻层沿着形成电阻层的两个外表面的之字形线折叠。 接触层各自设置在电阻层的不同的一个外表面上，塑料层被施加在接触层上，外部接触层各自与不同的接触层接触。 还提供了一种用于制造该方法的方法。

公开(公告)号：US4452664A

公开(公告)日：1984-06-05

申请号：US519280

申请日：1983-08-01

Applicant: Delton A. Grey, Jr. ,  Robert W. Green

Inventor： Delton A. Grey, Jr. ,  Robert W. Green

IPC: B21C37/00 ,  C23C14/14 ,  C23C14/16 ,  H05K3/02 ,  H05K3/20 ,  H05K3/38 ,  B44C1/00

CPC classification number: H05K3/025 ,  H05K2201/0317 ,  H05K2201/0355 ,  H05K2203/0152 ,  H05K2203/095 ,  H05K2203/1105 ,  H05K3/389 ,  Y10T156/11

Abstract: A low temperature (about 0.degree. C. to about 100.degree. C.) method is disclosed for forming an ultrathin film of copper on an aluminum carrier sheet. By this method, which employs matte finish aluminum foil, the peel strength for separating the aluminum carrier from the copper film can be preset at a desired value between 0.1 and 2 pounds per inch.

Abstract translation: 公开了在铝载体片上形成铜的超薄膜的低温（约0℃至约100℃）的方法。 通过采用无光泽铝箔的方法，将铝载体与铜膜分离的剥离强度可以预设为0.1至2磅/英寸的期望值。

公开(公告)号：US4383003A

公开(公告)日：1983-05-10

申请号：US189003

申请日：1980-09-22

Applicant: Eric Lifshin ,  Joseph D. Cargioli ,  Stephen J. Schroder ,  Joe Wong

Inventor： Eric Lifshin ,  Joseph D. Cargioli ,  Stephen J. Schroder ,  Joe Wong

IPC: C23C14/06 ,  B32B15/08 ,  C23C14/00 ,  H05K3/02 ,  H05K3/38 ,  B32B15/20

CPC classification number: C23C14/0005 ,  H05K3/025 ,  H05K3/388 ,  H05K2201/0317 ,  H05K2201/0355 ,  H05K2203/0152 ,  H05K3/382 ,  H05K3/389 ,  Y10T428/12465 ,  Y10T428/12549 ,  Y10T428/12556 ,  Y10T428/12604 ,  Y10T428/12611 ,  Y10T428/12792 ,  Y10T428/12903

Abstract: A copper-clad laminate having special utility in the production of high resolution printed circuit patterns by either subtractive or semi-additive processing is made by vapor depositing a film of zinc on a copper film on a silica-coated aluminum carrier sheet, vapor depositing a silica film on the resulting zinc-copper foil, bonding the resulting body to a substrate and then stripping the silica-coated aluminum carrier sheet from the copper-clad laminate.

Abstract translation: 通过减色或半加成处理生产高分辨率印刷电路图案的特殊用途的覆铜层压板是通过在二氧化硅涂覆的铝载体片上的铜膜上蒸镀锌膜， 在所得到的锌 - 铜箔上形成二氧化硅膜，将所得体粘合到基材上，然后从覆铜层压板剥离二氧化硅涂覆的铝载体片。

公开(公告)号：US4342020A

公开(公告)日：1982-07-27

申请号：US138708

申请日：1980-04-09

Applicant: Ferdinand Utner ,  Harald Vetter ,  Ludwig Nutz

Inventor： Ferdinand Utner ,  Harald Vetter ,  Ludwig Nutz

IPC: H01C1/16 ,  H01C7/22 ,  H01C17/07 ,  H05K1/00 ,  H05K1/05 ,  H05K1/16 ,  H05K3/00 ,  H05K3/06 ,  H05K3/28 ,  H05K3/46 ,  H01C1/012

CPC classification number: H05K1/167 ,  H01C1/16 ,  H01C17/07 ,  H01C7/22 ,  H05K1/0393 ,  H05K1/056 ,  H05K2201/0317 ,  H05K2201/0355 ,  H05K2201/056 ,  H05K2203/0361 ,  H05K3/0061 ,  H05K3/06 ,  H05K3/28

Abstract: A mechanically stable electrical network has a metal carrier and an insulating layer which supports the electrical network on the metal carrier.

Abstract translation: 机械稳定的电网具有支撑金属载体上的电网的金属载体和绝缘层。

公开(公告)号：US4237606A

公开(公告)日：1980-12-09

申请号：US933073

申请日：1978-08-11

Applicant: Koichi Niwa ,  Teruo Murase ,  Masatoshi Fujimori ,  Kyohei Murakawa

Inventor： Koichi Niwa ,  Teruo Murase ,  Masatoshi Fujimori ,  Kyohei Murakawa

IPC: B32B18/00 ,  H01L23/13 ,  H01L23/498 ,  H05K1/03 ,  H05K1/09 ,  H05K1/18 ,  H05K3/00 ,  H05K3/46 ,  H05K3/36

CPC classification number: H05K3/4605 ,  H01L23/13 ,  H01L23/49827 ,  H01L23/49838 ,  H05K3/4667 ,  H01L2924/0002 ,  H01L2924/09701 ,  H05K1/0306 ,  H05K1/092 ,  H05K1/183 ,  H05K2201/0175 ,  H05K2201/0317 ,  H05K2203/061 ,  H05K3/002 ,  H05K3/0029 ,  H05K3/4611 ,  H05K3/4688 ,  H05K3/4697 ,  Y10T29/49126

Abstract: In a method of manufacture of a multilayer ceramic board, a conductor land is formed and baked on a first substrate. A second substrate on which the wiring pattern is formed is then electrically connected to the first substrate via the land. An error in the substrate due to shrinkage at the time of sintering is thereby compensated by the conductor land. This assures the formation of a highly accurate wiring pattern on the sintered substrate surface, despite shrinkage of the ceramic during sintering of the raw sheets of ceramic.

Abstract translation: 在制造多层陶瓷板的方法中，在第一基板上形成导体焊盘并烘烤。 其上形成有布线图案的第二基板然后经由焊盘电连接到第一基板。 由于烧结时的收缩导致的基板的误差由导体接地补偿。 这确保了在烧结的基材表面上形成高度精确的布线图案，尽管在陶瓷的原始片材的烧结期间陶瓷的收缩。

公开(公告)号：US3756887A

公开(公告)日：1973-09-04

申请号：US3756887D

申请日：1971-07-29

Applicant: US NAVY

Inventor： CRUTHERS R

IPC: H01C7/00 ,  H01H69/02 ,  H05K1/00 ,  H05K1/16 ,  B44C1/22

CPC classification number: H01H69/022 ,  H01C7/00 ,  H05K1/0293 ,  H05K1/167 ,  H05K2201/0317 ,  H05K2201/10181

Abstract: A METHOD OF MAKING MICROFUSES ON A THIN FILM CIRCUITRY PANEL COMPRISING DEPOSITING A LAYER OF CHROMIUM ON A SUBSTRATE AND THEN ETCHING SAID CHROMIUM TO PROVIDE A PLURALITY OF RECTANGULAR AREAS EACH HAVING A NOTCH THEREIN. A LAYER OF CONDUCTIVE METAL IS PROVIDED AT EACH END OF EACH RECTANGULAR AREA TO SERVE AS CONDUCTORS.

公开(公告)号：US3666967A

公开(公告)日：1972-05-30

申请号：US3666967D

申请日：1971-05-12

Applicant: US NAVY

Inventor： KEISTER FRANK Z ,  SMOLKER GARY S

IPC: F41H13/00 ,  H01L49/02 ,  H05K1/00 ,  H02H7/20

CPC classification number: H05K1/0293 ,  F41H13/00 ,  H01L49/02 ,  H05K1/0275 ,  H05K2201/0317 ,  H05K2203/1163 ,  H05K2203/175 ,  Y10S428/926 ,  Y10S428/933 ,  Y10T428/12486 ,  Y10T428/12736 ,  Y10T428/12889 ,  Y10T428/12944 ,  Y10T428/265 ,  Y10T428/273

Abstract: A multilayer thin film circuit board having thin film layers of the thermite reaction class, such as tungstic oxide and aluminum materials, coupled to a switched voltage source to be switched in circuit to cause ignition of the thermite layer and cause destruction of the film circuit.

Abstract translation: 具有诸如氧化钨和铝材料的热铝反应级薄膜层的多层薄膜电路板耦合到开关电压源，以切换电路以引起铝酸盐层的点燃并导致薄膜电路的破坏。

公开(公告)号：US3240624A

公开(公告)日：1966-03-15

申请号：US17814962

申请日：1962-03-07

Applicant: CORNING GLASS WORKS

Inventor： BECK RONALD A

IPC: C03C17/00 ,  C03C23/00 ,  C23F1/02 ,  H01B1/00 ,  H01C17/00 ,  H05K1/16 ,  H05K3/04

CPC classification number: H05K3/04 ,  C03C17/00 ,  C03C23/00 ,  C23F1/02 ,  H01B1/00 ,  H01C17/003 ,  H05K1/167 ,  H05K2201/0166 ,  H05K2201/0317 ,  H05K2203/025