公开(公告)号：US06222135B1

公开(公告)日：2001-04-24

申请号：US09176653

申请日：1998-10-21

Applicant: Yukiko Daido ,  Yoshihisa Hatta

Inventor： Yukiko Daido ,  Yoshihisa Hatta

IPC: H05K102

CPC classification number: H05K1/0271 ,  H05K3/0052 ,  H05K3/0097 ,  H05K3/34 ,  H05K3/3405 ,  H05K2201/09063 ,  H05K2201/0909 ,  H05K2201/10446 ,  Y10T29/4913 ,  Y10T29/49133 ,  Y10T29/49144 ,  Y10T29/49165

Abstract: A circuit board (10) on which surface electronic components (15) are mounted during a reflow process comprises a circuit portion (12), a surrounding circumferential portion (13) and at least one elongated opening (14) formed in the surrounding circumferential portion substantially parallel to the direction the board travels during the reflow direction (16) to prevent electronic component soldering failures that may occur as a result of the deflection of the circuit board flow process.

Abstract translation: 在回流处理期间，其上安装表面电子部件（15）的电路板（10）包括电路部分（12），周围圆周部分（13）和形成在周围圆周部分中的至少一个细长开口（14） 基本上平行于板在回流方向（16）行进的方向，以防止由于电路板流动过程的偏转而可能发生的电子部件焊接故障。

公开(公告)号：US6104464A

公开(公告)日：2000-08-15

申请号：US524567

申请日：1995-09-07

Applicant: Kohei Adachi ,  Toru Kokogawa ,  Takanori Takaki ,  Hayato Takasago ,  Mitsumasa Mori ,  Atsushi Tanaka

Inventor： Kohei Adachi ,  Toru Kokogawa ,  Takanori Takaki ,  Hayato Takasago ,  Mitsumasa Mori ,  Atsushi Tanaka

IPC: G02F1/1333 ,  G02F1/13 ,  G02F1/1345 ,  H01L23/538 ,  H05K1/00 ,  H05K1/02 ,  H05K3/00 ,  H05K3/36

CPC classification number: H05K1/028 ,  G02F1/13452 ,  H01L23/5387 ,  H05K1/0278 ,  H01L2224/16225 ,  H01L2224/45144 ,  H01L2224/48227 ,  H01L2924/09701 ,  H01L2924/181 ,  H05K2201/0191 ,  H05K2201/09036 ,  H05K2201/09063 ,  H05K2201/0909 ,  H05K2201/09827 ,  H05K2201/10136 ,  H05K2203/0228 ,  H05K2203/302 ,  H05K3/0061 ,  H05K3/0064 ,  H05K3/0067 ,  H05K3/361 ,  H05K3/4691

Abstract: A drive circuit module comprises a board formed of a hard base material having no flexibility, a circuit pattern formed on the board and having a plurality of input terminals and output terminals supported by a flexible insulation film, and a carrying section for carrying a drive LSI and the like on the circuit pattern; characterized in that the board is provided with at least one cutout on a surface opposite to the surface on which the circuit pattern of the board is formed, thereby making flexible the board in a direction in which the output terminal surface and the carrying section surface are different from each other.

Abstract translation: 驱动电路模块包括由不具有柔性的硬质基材形成的板，形成在板上的电路图案，具有由柔性绝缘膜支撑的多个输入端子和输出端子，以及用于承载驱动LSI的承载部分 电路图案等; 其特征在于，所述板在与所述基板的电路图案形成的表面相对的表面上设置有至少一个切口，从而使所述板沿着所述输出端子表面和所述承载部分表面是 彼此不同。

公开(公告)号：US6094357A

公开(公告)日：2000-07-25

申请号：US198932

申请日：1998-11-24

Applicant: Hans Deubler ,  Karl Hintermann ,  Walter Planegger ,  Peter Schaller

Inventor： Hans Deubler ,  Karl Hintermann ,  Walter Planegger ,  Peter Schaller

IPC: H05K1/18 ,  H01M2/10 ,  H05K1/00 ,  H05K3/30

CPC classification number: H05K3/301 ,  H01M2/1055 ,  H05K1/0293 ,  H05K2201/0909 ,  H05K2201/09127 ,  H05K2203/175 ,  H05K2203/176

Abstract: In a product including a printed circuit board which comprises a printed-circuit part and a terminal part and including a rechargeable battery having two terminals, and including retaining device for mechanically retaining the battery, the retaining device and the printed circuit board are arranged and constructed so as to be mechanically separate from one another, in such a manner that the printed circuit board does not form part of the retaining device, and each of the two terminals of the battery is connected to a terminal zone on the terminal part of the printed circuit board in an electrically conductive manner via a mechanically flexible and electrically conductive connecting device.

Abstract translation: 在包括印刷电路部分和端子部分并且包括具有两个端子的可再充电电池的印刷电路板的产品中，并且包括用于机械地保持电池的保持装置，保持装置和印刷电路板被布置和构造 以使得印刷电路板不形成保持装置的一部分，并且电池的两个端子中的每一个连接到印刷的端子部分上的端子区域上，以便彼此机械地分离 电路板通过机械柔性和导电的连接装置以导电方式。

公开(公告)号：US06047470A

公开(公告)日：2000-04-11

申请号：US915159

申请日：1997-08-20

Applicant: Zane Drussel ,  Derek Hinkle

Inventor： Zane Drussel ,  Derek Hinkle

IPC: H01L21/48 ,  H01L23/13 ,  H05K3/00 ,  H05K3/02

CPC classification number: H01L23/13 ,  H01L21/481 ,  H05K3/0052 ,  H01L2924/0002 ,  H05K2201/09063 ,  H05K2201/0909 ,  H05K2203/0195 ,  H05K2203/1536 ,  H05K2203/1545 ,  Y10S428/901 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49135 ,  Y10T29/49146 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49789 ,  Y10T29/49794

Abstract: A circuit board substrate assembly includes a generally planar circuit board substrate material having a longitudinal axis extending along a length of the substrate material between a first end and a second end thereof. The circuit board substrate material further has a first edge and a second edge extending along the length of the circuit board substrate material between the first end and the second end. A plurality of openings are defined in the substrate material. Each opening extends between a first distance from the first edge of the circuit board substrate and a second distance from the second edge of the circuit board substrate. Further, each opening separates adjacent circuit forming regions lying along the longitudinal axis and has first and second opposing end portions. The first end portions of each opening lie along a first singulation axis of the substrate material parallel to the longitudinal axis and the second end portions of each opening lie along a second singulation axis of the substrate material parallel to the longitudinal axis. Removing interconnect material along the first singulation axis and second singulation axis provide for singulation of the circuit forming regions and any circuits thereof.

Abstract translation: 电路板基板组件包括大致平面的电路板基板材料，其具有沿基板材料的长度在其第一端和第二端之间延伸的纵向轴线。 电路板基板材料还具有沿着电路板基板材料的长度在第一端和第二端之间延伸的第一边缘和第二边缘。 在基板材料中限定多个开口。 每个开口在距离电路板基板的第一边缘的第一距离和离开电路板基板的第二边缘的第二距离之间延伸。 此外，每个开口分开沿着纵向轴线的相邻的电路形成区域，并且具有第一和第二相对端部。 每个开口的第一端部沿着平行于纵向轴线的衬底材料的第一分割轴线，并且每个开口的第二端部沿着平行于纵向轴线的衬底材料的第二切割轴线。 沿着第一单个轴和第二单片轴移除互连材料提供电路形成区域的单个化及其任何电路。

公开(公告)号：US6028489A

公开(公告)日：2000-02-22

申请号：US215419

申请日：1998-12-18

Applicant: Shing-Yeu Juang ,  Tseng-Hsin Chiu ,  Wen-Yuh Liao

Inventor： Shing-Yeu Juang ,  Tseng-Hsin Chiu ,  Wen-Yuh Liao

IPC: H05K1/00 ,  H05K1/02 ,  H05K3/00 ,  H01R43/00

CPC classification number: H05K1/0268 ,  H05K3/0052 ,  H05K1/0237 ,  H05K1/0298 ,  H05K2201/09036 ,  H05K2201/0909 ,  H05K2201/0919 ,  H05K2201/09827 ,  Y10T29/49004 ,  Y10T29/49789 ,  Y10T29/4979 ,  Y10T29/49792

Abstract: A modular high-frequency oscillator structure utilizes a master circuit board to form a plurality of oscillator units. The master circuit board has an upper, middle and lower copper foil layer. The upper copper foil layer has a plurality of component circuit patterns and a plurality of positive voltage, ground and signal regulation circuit patterns. The middle copper foil layer has a plurality of power transfer and ground transfer circuit patterns. The lower copper foil layer has a large common ground circuit pattern. The master circuit board is etched in such a manner that the upper and lower copper foil layers are cut through to isolate each oscillator unit and the middle copper foil layer remains uncut.

Abstract translation: 模块化高频振荡器结构利用主电路板形成多个振荡器单元。 主电路板具有上，中，下铜箔层。 上铜箔层具有多个元件电路图案和多个正电压，接地和信号调节电路图案。 中间铜箔层具有多个功率传递和接地传输电路图案。 下铜箔层具有大的公共接地电路图案。 以这样的方式蚀刻主电路板，使得上下铜箔层被切割以隔离每个振荡器单元，并且中间铜箔层保持未切割。

公开(公告)号：US5866470A

公开(公告)日：1999-02-02

申请号：US727109

申请日：1996-10-08

Applicant: Jon A. Casey ,  Michael A. Cohn ,  John J. Garant ,  Abubaker S. Shagan ,  Candace A. Sullivan ,  Robert J. Sullivan ,  Andrew H. Vogel

Inventor： Jon A. Casey ,  Michael A. Cohn ,  John J. Garant ,  Abubaker S. Shagan ,  Candace A. Sullivan ,  Robert J. Sullivan ,  Andrew H. Vogel

IPC: H01G4/30 ,  H01L21/48 ,  H01L23/498 ,  H05K1/03 ,  H05K3/00 ,  H05K3/46 ,  H01L21/30 ,  H01L21/46

CPC classification number: H01G4/30 ,  H01L21/481 ,  H01L21/4857 ,  H01L21/4867 ,  H01L23/49894 ,  H05K3/0097 ,  H01L2924/0002 ,  H05K1/0306 ,  H05K2201/09036 ,  H05K2201/0909 ,  H05K2203/1536 ,  H05K3/0052 ,  H05K3/4611 ,  H05K3/4629 ,  Y10S156/925 ,  Y10T156/1163 ,  Y10T156/1911

Abstract: A process for making multiple microelectronic ceramic substrates uses an interface layer between stacked layers of green sheets that are laminated with the interface layer, then fired to produce the ceramic substrates. The interface layer acts to protect the substrates, and to hold them together before firing, then thermally degrades at a desired point in the firing cycle to separate the individual substrates. The invention also includes the ceramic substrates produced by the method.

Abstract translation: 制造多个微电子陶瓷基板的方法使用与界面层层叠的生片层叠层之间的界面层，然后烧制以制造陶瓷基板。 界面层用于保护基底，并在烧制之前将它们保持在一起，然后在烧制循环中的所需点处热分解以分离各个基底。 本发明还包括通过该方法制造的陶瓷基板。

公开(公告)号：US5702254A

公开(公告)日：1997-12-30

申请号：US783839

申请日：1997-01-13

Applicant: Duane Eugene Whitson ,  Michael Joseph O'Connor ,  Curtis Allen Stapert

Inventor： Duane Eugene Whitson ,  Michael Joseph O'Connor ,  Curtis Allen Stapert

IPC: H01R12/55 ,  H01R33/46 ,  H05K1/00 ,  H05K1/11 ,  H01R9/09

CPC classification number: H05K1/116 ,  H01R33/465 ,  H05K1/0293 ,  H05K1/0295 ,  H05K2201/09063 ,  H05K2201/0909 ,  H05K2201/09127 ,  H05K2201/09954 ,  H05K2201/10113 ,  H05K2203/175 ,  H05K2203/176

Abstract: A circuit board has a socket opening for a twist-in lamp bordered by a pair of arcuate conductors. The circuit board is configured to define a socket for a bi-pin lamp located concentrically within the opening and supported by bridges across the opening. The bridges carry conductors for the bi-pin lamp. The bridges are frangible to allow the socket for the bi-pin lamp to be removed. When a bi-pin lamp fails in service it is removed along with its socket and a twist-in lamp is installed in the remaining socket.

Abstract translation: 电路板具有用于由一对弓形导体接合的扭转灯的插座开口。 电路板被配置为限定用于双针灯的插座，其同心地位于开口内并由穿过开口的桥支撑。 桥接器承载双针灯的导体。 桥梁是易碎的，以允许双针灯的插座被移除。 当双针灯不工作时，它将与其插座一起拆下，并在其他插座中安装一个扭转灯。

公开(公告)号：US5598757A

公开(公告)日：1997-02-04

申请号：US382698

申请日：1995-02-02

Applicant: James L. Lloyd ,  Edward M. Olbrick ,  Ivan Pawlenko ,  Russell E. Schuss ,  Girard Sidone

Inventor： James L. Lloyd ,  Edward M. Olbrick ,  Ivan Pawlenko ,  Russell E. Schuss ,  Girard Sidone

IPC: B23D33/10 ,  B26D7/01 ,  H05K3/00 ,  H05K3/02

CPC classification number: H05K3/0052 ,  B23D33/10 ,  B26D7/015 ,  H05K2201/0909 ,  H05K2203/167 ,  H05K3/0008 ,  H05K3/005 ,  Y10T29/49155 ,  Y10T83/0448 ,  Y10T83/461 ,  Y10T83/4645 ,  Y10T83/741 ,  Y10T83/764

Abstract: A tab (22) at the edge of a panel (10) may be advantageously sheared by transporting the panel into an in-line shear (30). As the panel is transported into the shear, an adjustable rail (52) engages the tab (22) to guide the panel to maintain its orientation. The rail (52) is adjusted after the tab (22) has been sheared to now engage the panel (10) along its edge formed by the removal of the tab. In this way, the rail (52) can guide the panel upon transport from the shear.

Abstract translation: 有利的是，通过将面板输送到线内剪切（30）中，在板（10）的边缘处的突片（22）有利地剪切。 当面板被输送到剪切器中时，可调节的轨道（52）接合突片（22）以引导面板以保持其取向。 在突片（22）已经被剪切之后调节轨道（52），以便现在通过沿着通过移除突片形成的边缘接合面板（10）。 以这种方式，轨道（52）可以在从剪切机输送时引导面板。

公开(公告)号：US5577312A

公开(公告)日：1996-11-26

申请号：US400527

申请日：1995-03-07

Applicant: Yoshiharu Seto

Inventor： Yoshiharu Seto

IPC: B21D28/00 ,  B21D28/02 ,  B21D28/10 ,  B21D28/14 ,  B26D7/20 ,  B26F1/02 ,  B26F1/14 ,  H05K3/00 ,  B23P17/00

CPC classification number: B26F1/14 ,  B26D7/20 ,  B26F1/02 ,  H05K3/0052 ,  H05K2201/09063 ,  H05K2201/0909 ,  H05K3/005 ,  Y10T225/12 ,  Y10T225/371 ,  Y10T29/49799 ,  Y10T29/49822 ,  Y10T83/0467

Abstract: In a method of separating a product G connected to a skeleton portion S of work W via a micro joint M, from the skeleton portion, the product is separated from the skeleton portion by striking the skeleton portion in the vicinity of the micro joint to cut off the micro joint from the skeleton. Further, the die pair used for the above-mentioned method comprises a punch 17A provided with a projecting portion 17T at an end thereof and movable up and down; and a die 19A arranged under the punch and formed of an elastic substance. In this method, it is possible to separate products from the skeleton portion of the work efficiently by breaking the micro joints without scratching the products and without generating noise. Further, the separating work of the products from the skeleton portion can be easily automated.

Abstract translation: 在从骨架部分分离与工件W的骨架部S连接的制品G的方法中，通过将微型接头附近的骨架部分击打，使产品与骨架部分分离，从而切割 从骨架上脱下微关节。 此外，用于上述方法的模具组包括：冲头17A，其在端部设置有突出部分17T，可上下移动; 以及设置在冲头下方并由弹性物质形成的模具19A。 在这种方法中，通过断开微接头而不产生噪音，可以有效地将产品从骨架部分分离出来。 此外，产品与骨架部分的分离工作可以容易地自动化。

公开(公告)号：US5359168A

公开(公告)日：1994-10-25

申请号：US174754

申请日：1993-12-29

Applicant: Peter R. Cunningham

Inventor： Peter R. Cunningham

IPC: G01K3/04 ,  G07C11/00 ,  H01H3/00 ,  H05K1/00 ,  H05K5/02 ,  H01H85/00

CPC classification number: H05K5/0208 ,  G01K3/04 ,  G07C11/00 ,  H01H3/00 ,  H05K1/0293 ,  H05K1/029 ,  H05K2201/0909 ,  H05K2201/09127 ,  H05K2203/175

Abstract: In FIG. 1, an electrical circuit on a circuit board 9 can be controlled by operation of switches 2B, 3B, 4B. These are operated by removing portions of the board 9, effected by the snapping off of respective corresponding cover member portions 2A, 3A and 4A.When used as a thermal log this control can respectively activate, deactivate and display the thermal data but avoid any tampering.

Abstract translation: 在图 如图1所示，可以通过开关2B，3B，4B的操作来控制电路板9上的电路。 这些通过移除相应的相应的盖构件部分2A，3A和4A的扣合而移除板9的部分来操作。 当用作热记录时，该控件可以分别激活，停用和显示热数据，但是避免任何篡改。