-
公开(公告)号:US12282054B2
公开(公告)日:2025-04-22
申请号:US18500249
申请日:2023-11-02
Applicant: Melexis Technologies NV
Inventor: Francois Piette , Cliff De Locht , Axel Fanget , Andreas Ott , Andreas Laute , Thomas Freitag
IPC: G01R31/28
Abstract: A system for characterizing a transistor circuit which has a local minimum in its transfer characteristic by finding its local minimum. The system comprises: a bias voltage generator for generating a toggling signal; a multiplier configured for multiplying an electrical signal which is a function of the drain source current of the transistor circuit, with a waveform alternating between two predefined values synchronously with the toggling signal; a first integrator configured for integrating the electrical signal from the multiplier, and wherein if more integrators are present, linear combinations of output signals of the integrators are provided to the further integrators; a summator configured for summing the toggling signal and an integration signal and configured for outputting the sum to the gate of the transistor circuit.
-
公开(公告)号:US12135670B2
公开(公告)日:2024-11-05
申请号:US18315032
申请日:2023-05-10
Applicant: Melexis Technologies NV
Inventor: Kevin Berlit , Jorgen Sturm
IPC: G06F13/42
Abstract: A method of operating a plurality of driving units for powering electronic units is described. The method includes interchanging a data frame including a bit sequence, between a master control unit and at least one of a plurality of driving units at slave nodes. The method includes applying an ID field for addressing at least one driving unit, and applying a data field comprising information and/or instructions regarding the status of the electronic units. Applying the ID field comprises indicating the driving unit address using a first bit sub-string comprising N bits, allowing the master control unit to identify whether data should be received or transmitted, performing a data length decoding step, and adding a further bit string to the data field including information for carrying out an action by the driving unit.
-
公开(公告)号:US20240288325A1
公开(公告)日:2024-08-29
申请号:US18587396
申请日:2024-02-26
Applicant: Melexis Technologies NV
Inventor: Ben MAES , Appo VAN DER WIEL , Johan VERGAUWEN
CPC classification number: G01L9/0054 , G01L9/065 , G01L9/08 , G01L27/005
Abstract: A semiconductor pressure sensor comprising a membrane, delineated by an edge, and a group of neighboring piezo resistors: a first pair of piezo resistors near the edge of the membrane (a first piezo resistor RTmemb, a second piezo resistor RLmemb); a second pair of piezo resistors (a third piezo resistor RTref, a fourth piezo resistor RLref) at a position where applied pressure causes reduced surface stress compared to surface stress at the position of the first and the second piezo resistor. A signal from the first piezo resistor and a signal from the second piezo resistor, corrected with a signal from the third piezo resistor and a signal from the fourth piezo resistor, are used as a measure of a pressure on the membrane.
-
公开(公告)号:US20240159820A1
公开(公告)日:2024-05-16
申请号:US18500249
申请日:2023-11-02
Applicant: Melexis Technologies NV
Inventor: Francois PIETTE , Cliff DE LOCHT , Axel FANGET , Andreas OTT , Andreas LAUTE , Thomas FREITAG
IPC: G01R31/28
CPC classification number: G01R31/2837 , G01R31/287
Abstract: A system for characterizing a transistor circuit which has a local minimum in its transfer characteristic by finding its local minimum. The system comprises: a bias voltage generator for generating a toggling signal; a multiplier configured for multiplying an electrical signal which is a function of the drain source current of the transistor circuit, with a waveform alternating between two predefined values synchronously with the toggling signal; a first integrator configured for integrating the electrical signal from the multiplier, and wherein if more integrators are present, linear combinations of output signals of the integrators are provided to the further integrators; a summator configured for summing the toggling signal and an integration signal and configured for outputting the sum to the gate of the transistor circuit.
-
公开(公告)号:US20240031239A1
公开(公告)日:2024-01-25
申请号:US18355815
申请日:2023-07-20
Applicant: Melexis Technologies NV
Inventor: Raik FROST , Thomas FREITAG , Michael FREY , Heiko LEUTERT
IPC: H04L41/12
Abstract: A method for autoconfiguration of a plurality of nodes in a linear network allows extracting the address and position of each node. The nodes are identified by a unique identifier. The method comprises choosing a node in a network and extracting its identifier, and for the first node to the last but one node, transmitting a current in the network from the chosen node, and reading the direction of the current flowing through at least the nodes not chosen in previous iteration cycles. The identifier is linked with the direction of the current for said not chosen nodes, obtaining the position of said not chosen nodes relative to the chosen node. These steps are repeated by choosing a different node not chosen before. Autoconfiguration is finished when the identifier of each node is extracted, and the physical position of each node is determined.
-
公开(公告)号:US20230386753A1
公开(公告)日:2023-11-30
申请号:US18310202
申请日:2023-05-01
Applicant: Melexis Technologies NV
Inventor: Appo VAN DER WIEL , Thomas FREITAG
Abstract: A trench capacitor includes a plurality of unit trench capacitors arranged in a 2D repetitive pattern in a substrate. The unit trench capacitors are separated by elongated trenches or elongated walls between the unit trench capacitors. The trench capacitor includes a plurality of stress compensation elements. Each unit trench capacitor has one or more closed trenches, with each trench further having a bottom electrode, a top electrode, and a dielectric between the bottom electrode and the top electrode. The unit trench capacitors are connected in parallel and the stress compensation elements are arranged between the unit trench capacitors such that they interrupt the elongated walls or trenches.
-
公开(公告)号:US11828827B2
公开(公告)日:2023-11-28
申请号:US18057324
申请日:2022-11-21
Applicant: Melexis Technologies NV
Inventor: Samuel Huber Lindenberger , Javier Bilbao De Mendizabal
IPC: G01R35/00 , G01R33/022 , G01R33/09
CPC classification number: G01R35/005 , G01R33/022
Abstract: A magnetic sensor device comprises a substrate. A first magnetic sensor, a second magnetic sensor, and one or more inductors are disposed over the substrate and are controlled by a magnetic sensor controller having a control circuit. The control circuit is adapted for controlling the first magnetic sensor to measure magnetic fields under presence of a first set of magnetic fields, and for controlling the second magnetic sensor to measure magnetic fields under presence of a second set of magnetic fields generated by the inductors. The control circuit calculates a relative sensitivity matching value that converts magnetic field values measured by the second magnetic sensor to a comparable magnetic field value measured by the first magnetic sensor or vice versa. The control circuit is further adapted for correcting a measurement by the second magnetic sensor using the relative sensitivity matching value to produce a corrected measurement, and for calculating a magnetic field gradient by combining a measurement by the first magnetic sensor with the corrected measurement.
-
公开(公告)号:US20230333014A1
公开(公告)日:2023-10-19
申请号:US18182010
申请日:2023-03-10
Applicant: Melexis Technologies NV
Inventor: Jos RENNIES , Luc BUYDENS
IPC: G01N21/55
CPC classification number: G01N21/55 , G01N2201/123 , G01N2201/12746
Abstract: In a heating appliance comprising a substrate for receiving an item of cookware, a method of measuring reflectivity comprises emitting a time-varying electromagnetic signal from a first side of the substrate, a portion of the time-varying electromagnetic signal propagating through the substrate. Electromagnetic radiation is then received at the first side of the substrate, the received electromagnetic radiation comprising a background ambient component received and a component reflected by the substrate. A gain factor is applied to translate the received electromagnetic radiation to a receive electrical signal. An offset signal component is then identified from the receive electrical signal, the offset signal component arising from the background ambient component of the received electromagnetic radiation. The gain factor from the offset signal component is then estimated using a characterisation of the offset signal component, and the reflectivity is calculated using the receive electrical signal and the estimated gain factor.
-
109.
公开(公告)号:US11729516B2
公开(公告)日:2023-08-15
申请号:US17667646
申请日:2022-02-09
Applicant: Melexis Technologies NV
Inventor: Wouter Reusen , Adrian Hill , Luc Buydens
Abstract: A method of digitally processing an image comprises: generating an intensity distribution model (170) in respect of at least a portion of the array of sensing pixels (102) of a detector device (100). The array of sensing pixels comprises clusters of pixels. A pixel (140) from the array of sensing pixels is then selected (202) and a first distance and a second distance from the selected pixel to a first neighbouring pixel (142) and a second neighbouring pixel (144), respectively, are determined (402) and the intensity distribution model (170) referenced (406) by the first distance is used to calculate a first weight and a second weight to apply to the first and second neighbouring pixels, respectively. The first distance comprises an intra-cluster distance and the second distance comprises an inter-cluster distance, the intra-cluster distance being different from the inter-cluster distance. The first weight is applied (214) to the first neighbouring pixel (142) and the second weight is applied (214) to the second neighbouring pixel (144).
-
公开(公告)号:US11655142B2
公开(公告)日:2023-05-23
申请号:US16744593
申请日:2020-01-16
Applicant: Melexis Technologies NV
Inventor: Appolonius Jacobus Van Der Wiel
CPC classification number: B81B7/0051 , B81C1/00325 , G01L9/0072 , B81B2201/0264 , B81B2203/0127 , B81B2207/098 , B81C1/0046 , B81C2203/0154
Abstract: A method of manufacturing a sensor device comprising: configuring a moulding support structure and a packaging mould so as to provide predetermined pathways to accommodate a moulding compound, the moulding support structure defining a first notional volume adjacent a second notional volume. An elongate sensor element and the moulding support structure are configured so that the moulding support structure fixedly carries the elongate sensor element and the elongate sensor element resides substantially in the first notional volume and extends towards the second notional volume, the elongate sensor element having an electrical contact electrically coupled to another electrical contact disposed within the second notional volume. The moulding support structure carrying (102) the elongate sensor element is disposed within the packaging mould (106). The moulding compound is then introduced (110) into the packaging mould during a predetermined period of time (112) so that the moulding compound fills the predetermined pathways, thereby filling the second notional volume and surrounding the elongate sensor element within the second notional volume without contacting the elongate sensor element.
-
-
-
-
-
-
-
-
-