System for characterizing a transistor circuit

    公开(公告)号:US12282054B2

    公开(公告)日:2025-04-22

    申请号:US18500249

    申请日:2023-11-02

    Abstract: A system for characterizing a transistor circuit which has a local minimum in its transfer characteristic by finding its local minimum. The system comprises: a bias voltage generator for generating a toggling signal; a multiplier configured for multiplying an electrical signal which is a function of the drain source current of the transistor circuit, with a waveform alternating between two predefined values synchronously with the toggling signal; a first integrator configured for integrating the electrical signal from the multiplier, and wherein if more integrators are present, linear combinations of output signals of the integrators are provided to the further integrators; a summator configured for summing the toggling signal and an integration signal and configured for outputting the sum to the gate of the transistor circuit.

    Advanced bus protocol for dynamic lighting

    公开(公告)号:US12135670B2

    公开(公告)日:2024-11-05

    申请号:US18315032

    申请日:2023-05-10

    Abstract: A method of operating a plurality of driving units for powering electronic units is described. The method includes interchanging a data frame including a bit sequence, between a master control unit and at least one of a plurality of driving units at slave nodes. The method includes applying an ID field for addressing at least one driving unit, and applying a data field comprising information and/or instructions regarding the status of the electronic units. Applying the ID field comprises indicating the driving unit address using a first bit sub-string comprising N bits, allowing the master control unit to identify whether data should be received or transmitted, performing a data length decoding step, and adding a further bit string to the data field including information for carrying out an action by the driving unit.

    PRESSURE SENSOR RESISTOR CONFIGURATION FOR STRESS COMPENSATION

    公开(公告)号:US20240288325A1

    公开(公告)日:2024-08-29

    申请号:US18587396

    申请日:2024-02-26

    CPC classification number: G01L9/0054 G01L9/065 G01L9/08 G01L27/005

    Abstract: A semiconductor pressure sensor comprising a membrane, delineated by an edge, and a group of neighboring piezo resistors: a first pair of piezo resistors near the edge of the membrane (a first piezo resistor RTmemb, a second piezo resistor RLmemb); a second pair of piezo resistors (a third piezo resistor RTref, a fourth piezo resistor RLref) at a position where applied pressure causes reduced surface stress compared to surface stress at the position of the first and the second piezo resistor. A signal from the first piezo resistor and a signal from the second piezo resistor, corrected with a signal from the third piezo resistor and a signal from the fourth piezo resistor, are used as a measure of a pressure on the membrane.

    SYSTEM FOR CHARACTERIZING A TRANSISTOR CIRCUIT
    104.
    发明公开

    公开(公告)号:US20240159820A1

    公开(公告)日:2024-05-16

    申请号:US18500249

    申请日:2023-11-02

    CPC classification number: G01R31/2837 G01R31/287

    Abstract: A system for characterizing a transistor circuit which has a local minimum in its transfer characteristic by finding its local minimum. The system comprises: a bias voltage generator for generating a toggling signal; a multiplier configured for multiplying an electrical signal which is a function of the drain source current of the transistor circuit, with a waveform alternating between two predefined values synchronously with the toggling signal; a first integrator configured for integrating the electrical signal from the multiplier, and wherein if more integrators are present, linear combinations of output signals of the integrators are provided to the further integrators; a summator configured for summing the toggling signal and an integration signal and configured for outputting the sum to the gate of the transistor circuit.

    METHOD OF AUTOCONFIGURATION OF COMMUNICATION NETWORK

    公开(公告)号:US20240031239A1

    公开(公告)日:2024-01-25

    申请号:US18355815

    申请日:2023-07-20

    CPC classification number: H04L41/12 H04L67/12

    Abstract: A method for autoconfiguration of a plurality of nodes in a linear network allows extracting the address and position of each node. The nodes are identified by a unique identifier. The method comprises choosing a node in a network and extracting its identifier, and for the first node to the last but one node, transmitting a current in the network from the chosen node, and reading the direction of the current flowing through at least the nodes not chosen in previous iteration cycles. The identifier is linked with the direction of the current for said not chosen nodes, obtaining the position of said not chosen nodes relative to the chosen node. These steps are repeated by choosing a different node not chosen before. Autoconfiguration is finished when the identifier of each node is extracted, and the physical position of each node is determined.

    TRENCH CAPACITOR WITH REDUCED MECHANICAL STRESS

    公开(公告)号:US20230386753A1

    公开(公告)日:2023-11-30

    申请号:US18310202

    申请日:2023-05-01

    CPC classification number: H01G4/385 H01G4/33 H01G4/012

    Abstract: A trench capacitor includes a plurality of unit trench capacitors arranged in a 2D repetitive pattern in a substrate. The unit trench capacitors are separated by elongated trenches or elongated walls between the unit trench capacitors. The trench capacitor includes a plurality of stress compensation elements. Each unit trench capacitor has one or more closed trenches, with each trench further having a bottom electrode, a top electrode, and a dielectric between the bottom electrode and the top electrode. The unit trench capacitors are connected in parallel and the stress compensation elements are arranged between the unit trench capacitors such that they interrupt the elongated walls or trenches.

    Magnetic sensor sensitivity matching calibration

    公开(公告)号:US11828827B2

    公开(公告)日:2023-11-28

    申请号:US18057324

    申请日:2022-11-21

    CPC classification number: G01R35/005 G01R33/022

    Abstract: A magnetic sensor device comprises a substrate. A first magnetic sensor, a second magnetic sensor, and one or more inductors are disposed over the substrate and are controlled by a magnetic sensor controller having a control circuit. The control circuit is adapted for controlling the first magnetic sensor to measure magnetic fields under presence of a first set of magnetic fields, and for controlling the second magnetic sensor to measure magnetic fields under presence of a second set of magnetic fields generated by the inductors. The control circuit calculates a relative sensitivity matching value that converts magnetic field values measured by the second magnetic sensor to a comparable magnetic field value measured by the first magnetic sensor or vice versa. The control circuit is further adapted for correcting a measurement by the second magnetic sensor using the relative sensitivity matching value to produce a corrected measurement, and for calculating a magnetic field gradient by combining a measurement by the first magnetic sensor with the corrected measurement.

    REFLECTIVITY MEASUREMENT APPARATUS AND METHOD OF MEASURING REFLECTIVITY THEREFOR

    公开(公告)号:US20230333014A1

    公开(公告)日:2023-10-19

    申请号:US18182010

    申请日:2023-03-10

    CPC classification number: G01N21/55 G01N2201/123 G01N2201/12746

    Abstract: In a heating appliance comprising a substrate for receiving an item of cookware, a method of measuring reflectivity comprises emitting a time-varying electromagnetic signal from a first side of the substrate, a portion of the time-varying electromagnetic signal propagating through the substrate. Electromagnetic radiation is then received at the first side of the substrate, the received electromagnetic radiation comprising a background ambient component received and a component reflected by the substrate. A gain factor is applied to translate the received electromagnetic radiation to a receive electrical signal. An offset signal component is then identified from the receive electrical signal, the offset signal component arising from the background ambient component of the received electromagnetic radiation. The gain factor from the offset signal component is then estimated using a characterisation of the offset signal component, and the reflectivity is calculated using the receive electrical signal and the estimated gain factor.

    Method of digitally processing an image and method of digitally processing a plurality of pixels

    公开(公告)号:US11729516B2

    公开(公告)日:2023-08-15

    申请号:US17667646

    申请日:2022-02-09

    CPC classification number: H04N23/80 H04N25/44

    Abstract: A method of digitally processing an image comprises: generating an intensity distribution model (170) in respect of at least a portion of the array of sensing pixels (102) of a detector device (100). The array of sensing pixels comprises clusters of pixels. A pixel (140) from the array of sensing pixels is then selected (202) and a first distance and a second distance from the selected pixel to a first neighbouring pixel (142) and a second neighbouring pixel (144), respectively, are determined (402) and the intensity distribution model (170) referenced (406) by the first distance is used to calculate a first weight and a second weight to apply to the first and second neighbouring pixels, respectively. The first distance comprises an intra-cluster distance and the second distance comprises an inter-cluster distance, the intra-cluster distance being different from the inter-cluster distance. The first weight is applied (214) to the first neighbouring pixel (142) and the second weight is applied (214) to the second neighbouring pixel (144).

    Method of manufacturing a sensor device and moulding support structure

    公开(公告)号:US11655142B2

    公开(公告)日:2023-05-23

    申请号:US16744593

    申请日:2020-01-16

    Abstract: A method of manufacturing a sensor device comprising: configuring a moulding support structure and a packaging mould so as to provide predetermined pathways to accommodate a moulding compound, the moulding support structure defining a first notional volume adjacent a second notional volume. An elongate sensor element and the moulding support structure are configured so that the moulding support structure fixedly carries the elongate sensor element and the elongate sensor element resides substantially in the first notional volume and extends towards the second notional volume, the elongate sensor element having an electrical contact electrically coupled to another electrical contact disposed within the second notional volume. The moulding support structure carrying (102) the elongate sensor element is disposed within the packaging mould (106). The moulding compound is then introduced (110) into the packaging mould during a predetermined period of time (112) so that the moulding compound fills the predetermined pathways, thereby filling the second notional volume and surrounding the elongate sensor element within the second notional volume without contacting the elongate sensor element.

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