INFRARED THERMAL SENSOR WITH BEAM WITHOUT THERMOCOUPLE
    1.
    发明申请
    INFRARED THERMAL SENSOR WITH BEAM WITHOUT THERMOCOUPLE 有权
    红外热传感器,带有无热电偶的光束

    公开(公告)号:US20170003172A1

    公开(公告)日:2017-01-05

    申请号:US15107065

    申请日:2014-12-13

    Abstract: An infrared thermal sensor for sensing infrared radiation is disclosed. The infrared thermal sensor comprises a substrate and a cap structure together forming a sealed cavity, a membrane arranged in said cavity for receiving infrared radiation (IR) through a window or aperture and a plurality of beams for suspending the membrane. At least one beam has a thermocouple arranged therein or thereon for measuring a temperature difference (ΔT) between the membrane and the substrate, the plurality of beams. Furthermore at least one beam is mechanically supporting the membrane without a thermocouple being present therein or thereon.

    Abstract translation: 公开了一种用于感测红外辐射的红外热传感器。 红外热敏传感器包括一个基片和盖结构,一起形成一个密封的空腔,一个隔膜,布置在所述空腔中,用于通过窗口或孔口接收红外辐射(IR)和多个用于悬挂膜片的光束。 至少一个光束具有布置在其中或其上的热电偶,用于测量膜和基板之间的温度差(ΔT),多个光束。 此外,至少一个梁机械地支撑膜,而不存在其中或之上的热电偶。

    SEMICONDUCTOR PRESSURE SENSOR
    2.
    发明申请

    公开(公告)号:US20250076140A1

    公开(公告)日:2025-03-06

    申请号:US18791697

    申请日:2024-08-01

    Abstract: A semiconductor pressure sensor for measuring an external pressure exerted on the sensor, comprising a membrane as part of a semiconductor substrate for being deformed due to the external pressure, a first group of neighboring resistors comprising a sensing resistor pair and a compensating resistor pair and a second group of neighboring resistors comprising a sensing resistor pair and a compensating resistor pair, wherein the sensing resistor pairs are located on or adjacent to the membrane edge and wherein the compensating resistor pairs are located at least partially outside the membrane or on a zero stress zone of the membrane, and wherein the resistors of each resistor pair are orthogonal, and wherein the resistors are connected in a Wheatstone bridge configuration.

    PRESSURE SENSOR RESISTOR CONFIGURATION FOR STRESS COMPENSATION

    公开(公告)号:US20240288325A1

    公开(公告)日:2024-08-29

    申请号:US18587396

    申请日:2024-02-26

    CPC classification number: G01L9/0054 G01L9/065 G01L9/08 G01L27/005

    Abstract: A semiconductor pressure sensor comprising a membrane, delineated by an edge, and a group of neighboring piezo resistors: a first pair of piezo resistors near the edge of the membrane (a first piezo resistor RTmemb, a second piezo resistor RLmemb); a second pair of piezo resistors (a third piezo resistor RTref, a fourth piezo resistor RLref) at a position where applied pressure causes reduced surface stress compared to surface stress at the position of the first and the second piezo resistor. A signal from the first piezo resistor and a signal from the second piezo resistor, corrected with a signal from the third piezo resistor and a signal from the fourth piezo resistor, are used as a measure of a pressure on the membrane.

    INFRARED SENSING DEVICES AND METHODS
    4.
    发明申请

    公开(公告)号:US20180283956A1

    公开(公告)日:2018-10-04

    申请号:US15997836

    申请日:2018-06-05

    Abstract: An infrared sensor assembly for sensing infrared radiation comprises infrared sensing elements and the infrared sensing compensation elements that are different so that, for a same flux on the infrared sensing elements and the infrared sensing compensation elements, the radiation responsive element of the infrared sensing elements absorbs more radiation than the radiation responsive element of the infrared sensing compensation elements, as to receive substantially more radiation than the radiation responsive element of the infrared sensing compensation elements. An output of the sensor array is a subtractive function of a sum of the signals of the plurality of infrared sensing elements and a sum of the signals of the plurality of the infrared sensing compensation elements such that at least linear and/or non-linear parasitic thermal fluxes are at least partly compensated for.

    SENSOR CONFIGURATION
    5.
    发明公开

    公开(公告)号:US20240288323A1

    公开(公告)日:2024-08-29

    申请号:US18587283

    申请日:2024-02-26

    CPC classification number: G01L1/2268 G01L1/16 G01L1/225

    Abstract: A sensor device for measuring a physical parameter. The sensor device comprises at least three sensing elements. Each sensing element comprises a first node and a second node. The first nodes of all sensing elements are connected together, and the second nodes are accessible to a readout circuit for measuring differential signals between the second nodes. At least three of the sensing elements have a different sensitivity to the physical parameter.

    DUAL PRESSURE SENSOR
    6.
    发明申请

    公开(公告)号:US20220136915A1

    公开(公告)日:2022-05-05

    申请号:US17518746

    申请日:2021-11-04

    Abstract: A controller configured for monitoring disturbances of a pressure sensor assembly includes at least two sensors. The at least two sensors are configured for measuring a pressure and wherein the at least two sensors have a sensor dependent measurement sensitivity for the pressure, and at least one of the sensors is sensitive for a disturbance with a sensor dependent disturbance sensitivity. A ratio of the measurement sensitivity and the disturbance sensitivity is different for the at least two sensors. The controller is configured for detecting the disturbance by comparing outputs of the at least two sensors.

    PROTECTION OF SENSING ELEMENT DURING MOULDING

    公开(公告)号:US20240210262A1

    公开(公告)日:2024-06-27

    申请号:US18541593

    申请日:2023-12-15

    CPC classification number: G01L19/0618

    Abstract: A sensor package comprises an active element with a first region and an opposite second region. The first region includes a sensing structure. The second region comprises at least one contact pad. A moulding compound encapsulates the second region and not the first region. The active element comprises at least one conductive line for routing signals from the sensing structure to the contact pad. The projection of the conductive line over the active element corresponds to a portion of the external surface of the active element. The active element comprises at least one dummy track providing a protrusion thereby raising a portion of the surface of the active element to at least the same height as the portion corresponding to the conductive line. These protrusions can receive mechanical pressure from a moulding insert applied during manufacture, relieving pressure over the portion of the surface including the conductive lines.

    INFRARED SENSING DEVICES AND METHODS
    8.
    发明申请
    INFRARED SENSING DEVICES AND METHODS 有权
    红外传感装置和方法

    公开(公告)号:US20170016762A1

    公开(公告)日:2017-01-19

    申请号:US15211123

    申请日:2016-07-15

    Abstract: An infrared sensor assembly for sensing infrared radiation from an object is disclosed. The infrared sensor assembly comprises a sensor array comprising a plurality of sensing elements, provided on or embedded in a substrate extending in a substrate plane. The sensor array comprises at least two infrared sensing elements, each infrared sensing element having a radiation responsive element providing a proportionate electrical signal in response to infrared radiation incident thereto and at least two blind sensing elements, at least one blind sensing element being interspersed among the at least two sensing elements, each blind sensing element being shielded from incident infrared radiation from the object and providing a proportionate electrical signal in response to parasitic thermal fluxes. The output of the sensor array is a function of the infrared sensing elements and of the blind sensing elements such that parasitic thermal fluxes are at least partly compensated for.

    Abstract translation: 公开了一种用于感测来自物体的红外辐射的红外传感器组件。 红外传感器组件包括传感器阵列,该传感器阵列包括多个感测元件,其设置在衬底平面上延伸的衬底上或嵌入衬底中。 传感器阵列包括至少两个红外感测元件,每个红外感测元件具有响应于入射到其上的红外辐射而提供比例电信号的辐射响应元件和至少两个盲感测元件,至少一个盲感测元件散布在 至少两个感测元件,每个盲感测元件被屏蔽以避免来自物体的入射红外辐射,并响应于寄生热通量提供成比例的电信号。 传感器阵列的输出是红外感测元件和盲目感测元件的函数,使得寄生热通量至少部分被补偿。

    ETCHING OF INFRARED SENSOR MEMBRANE
    9.
    发明申请
    ETCHING OF INFRARED SENSOR MEMBRANE 有权
    红外传感器膜的蚀刻

    公开(公告)号:US20150179861A1

    公开(公告)日:2015-06-25

    申请号:US14578701

    申请日:2014-12-22

    Abstract: The invention relates to an infrared thermal sensor comprising a substrate having a cavity, a cavity bottom wall formed by a continuous substrate surface. The sensor comprises a membrane adapted for receiving heat from incident infrared radiation, a beam suspending the membrane, and a thermocouple. This membrane comprises openings extending through the membrane for facilitating the passage of an anisotropic etchant for etching the cavity during manufacture. Each opening has a cross-section with a length to width ratio of at least 4. The width direction of respectively a first and a second set of openings is oriented according to respectively a first crystallographic orientation and a second crystallographic orientation, these orientations corresponding to different directions lying in loosely packed crystal lattice faces of the semiconductor substrate.

    Abstract translation: 本发明涉及一种红外热传感器,其包括具有空腔的基板,由连续基板表面形成的空腔底壁。 传感器包括适于从入射的红外辐射接收热量的膜,悬挂膜的光束和热电偶。 该膜包括延伸穿过膜的开口,以便在制造期间便于各向异性蚀刻剂通过蚀刻腔。 每个开口具有长宽比至少为4的横截面。分别第一组和第二组开口的宽度方向分别根据第一结晶取向和第二结晶取向取向,这些取向对应于 不同的方向位于半导体衬底的松散堆积的晶格面上。

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