公开(公告)号：US09158345B1

公开(公告)日：2015-10-13

申请号：US13651946

申请日：2012-10-15

Applicant: Jeremy Rice ,  Gregory P. Imwalle

Inventor： Jeremy Rice ,  Gregory P. Imwalle

IPC: G06F19/00 ,  G06F1/18 ,  H04L12/24

CPC classification number: G06F1/184 ,  G06F1/206 ,  G06F2200/201 ,  H04L41/0253

Abstract: Techniques for managing performance of a computing system include monitoring an operating power and an operating temperature of a rack-mounted computer in a data center; determining that the operating power is at or near a threshold operating power of the computer; and adjusting the operating frequency of the computer based on the adjusted operating temperature of the computer.

Abstract translation: 用于管理计算系统的性能的技术包括监视数据中心中的机架式计算机的操作功率和操作温度; 确定所述操作功率处于或接近所述计算机的阈值操作功率; 并根据计算机的调整后的工作温度来调整计算机的工作频率。

公开(公告)号：US20150219406A1

公开(公告)日：2015-08-06

申请号：US14169426

申请日：2014-01-31

Applicant: Asia Vital Components Co., Ltd.

Inventor： Chih-Yeh Lin ,  Chih-Ming Chen

IPC: F28F3/02 ,  G06F1/20

CPC classification number: F28F3/02 ,  F28D15/0233 ,  F28D15/04 ,  F28F3/06 ,  F28F13/18 ,  F28F13/185 ,  F28F13/187 ,  F28F21/04 ,  F28F21/084 ,  F28F21/085 ,  F28F2245/06 ,  F28F2255/20 ,  F28F2275/02 ,  G06F1/203 ,  G06F2200/201 ,  H01L23/3733 ,  H01L23/427 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A heat dissipation device includes a main body and a radiation heat dissipation layer. The main body has a first board body and a second board body. The first and second board bodies are correspondingly mated with each other to define a receiving space. At least one capillary structure and a working fluid are disposed in the receiving space. The radiation heat dissipation layer is formed on one face of the second board body, which face is distal from the first board body. The heat dissipation device is disposed in a mobile device to provide a very good heat dissipation effect for the closed space of the mobile device by way of natural convection and radiation. Therefore, the heat dissipation performance of the entire mobile device is greatly enhanced.

Abstract translation: 散热装置包括主体和辐射散热层。 主体具有第一板体和第二板体。 第一和第二板体相互配合以限定接收空间。 至少一个毛细结构和工作流体设置在容纳空间中。 辐射散热层形成在第二基板主体的一个面上，该表面远离第一基板主体。 散热装置设置在移动装置中，通过自然对流和辐射为移动装置的封闭空间提供非常好的散热效果。 因此，整个移动设备的散热性能大大提高。

公开(公告)号：US09069533B2

公开(公告)日：2015-06-30

申请号：US13677305

申请日：2012-11-15

Applicant: Xu Yang

Inventor： Xu Yang

IPC: H05K7/14 ,  F25D21/14 ,  H05K7/20 ,  G06F1/20

CPC classification number: G06F1/20 ,  G06F2200/201 ,  H05K7/1497

Abstract: A data center container includes a chassis, a cooling system, a draining mechanism, and a latching member. The chassis includes a front plate with a securing hole. The cooling system includes a water tray and a drainer tray. The water tray communicates with the drainer tray. The draining mechanism communicates with the drainer tray and extends out of the chassis. The latching member is attached to the draining mechanism. The latching member includes an inserting post, and the inserting post being engaged in the securing hole, to position the draining mechanism to the front plate.

Abstract translation: 数据中心容器包括底盘，冷却系统，排水机构和锁定构件。 底盘包括具有固定孔的前板。 冷却系统包括水盘和排水盘。 水盘与排水盘通信。 排水机构与排水盘连通并延伸出底盘。 锁定构件附接到排水机构。 闩锁构件包括插入柱，并且插入柱接合在固定孔中，以将排水机构定位到前板。

公开(公告)号：US20150160704A1

公开(公告)日：2015-06-11

申请号：US14623237

申请日：2015-02-16

Applicant: QARNOT COMPUTING

Inventor： Paul Benoit

IPC: G06F1/20

CPC classification number: F24H3/062 ,  F24D2200/29 ,  F28F7/00 ,  G06F1/20 ,  G06F1/206 ,  G06F2200/201 ,  H05K7/20 ,  H05K7/20263 ,  H05K7/20272

Abstract: An electric radiator is provided using calculating processors as a heat source and includes a heating body where the heat transfer between the heat source and the ambient air takes place; a number of processors distributed over a number of printed circuit boards forming the heat source of the radiator and a power resource carrying out calculations by external computer systems; a man-machine interface enabling the control of the calculating and calorific power supplied by the radiator; a power source stabilised for the different electrical components; and a network interface for connecting the radiator to the external networks.

Abstract translation: 使用计算处理器作为热源提供电散热器，并且包括在热源和周围空气之间发生热传递的加热体; 分布在形成散热器的热源的多个印刷电路板上的多个处理器和由外部计算机系统执行计算的电力资源; 能够控制由散热器供给的计算和发热功率的人机界面; 为不同的电气部件稳定的电源; 以及用于将散热器连接到外部网络的网络接口。

公开(公告)号：US20150103485A1

公开(公告)日：2015-04-16

申请号：US14467462

申请日：2014-08-25

Applicant: Fujitsu Limited

Inventor： Jumpei KUBOTA

IPC: G06F1/20

CPC classification number: G06F1/206 ,  G06F2200/201 ,  H05K7/20281 ,  Y02D10/16

Abstract: An electronic apparatus includes: a flowpath through which a liquid flows; a heat-generating body that is cooled by the liquid; a liquid temperature measuring device that measures a temperature of the liquid; a temperature measuring device that measures a temperature of the heat-generating body; a heat generation amount measuring device that measures a heat generation amount of the heat-generating body; a storage apparatus that stores information representing a relationship between a temperature of the liquid, a temperature of the heat-generating body, a heat generation amount of the heat-generating body, and a flow rate of the liquid; and a processing apparatus that calculates the flow rate of liquid from the temperature of the liquid measured by the liquid temperature measuring device, the temperature of the heat-generating body measured by the temperature measuring device, and the heat generation amount of the heat-generating body based on information inside the storage apparatus.

Abstract translation: 电子设备包括：液体流过的流路; 由液体冷却的发热体; 液体温度测量装置，其测量液体的温度; 温度测量装置，其测量发热体的温度; 发热量测量装置，其测量发热体的发热量; 存储表示液体的温度，发热体的温度，发热体的发热量和液体的流量之间的关系的信息的存储装置; 以及处理装置，其计算由液体温度测量装置测量的液体的温度，由温度测量装置测量的发热体的温度和发热量的发热量 基于存储装置内的信息。

公开(公告)号：US20150077937A1

公开(公告)日：2015-03-19

申请号：US14026992

申请日：2013-09-13

Applicant: Alcatel Lucent

Inventor： John Daly ,  Brian Donnelly ,  Nicholas Jeffers ,  Wei Ling ,  Salvatore J. Messana ,  Paul M. Rominski

IPC: H05K7/20 ,  H04B10/40

CPC classification number: H04B10/40 ,  G02B6/4261 ,  G02B6/4268 ,  G02B6/428 ,  G06F2200/201 ,  H01L23/427 ,  H01L2924/0002 ,  H01L2924/00

Abstract: An apparatus comprising a fluid-circulator loop configured to be located on a circuit board, wherein a heat-removal portion of the fluid-circulator loop is configured to be located adjacent to an optical transceiver module on the circuit board.

Abstract translation: 一种包括流体循环器回路的装置，其被配置为位于电路板上，其中流体循环器回路的散热部分被配置为位于电路板上的光收发器模块附近。

公开(公告)号：US20140362525A1

公开(公告)日：2014-12-11

申请号：US14467809

申请日：2014-08-25

Applicant: Zheming Zhou

Inventor： Zheming Zhou ,  Faming Zhou

IPC: G06F1/20

CPC classification number: G06F1/20 ,  G06F1/203 ,  G06F2200/201 ,  H01L23/427 ,  H01L23/467 ,  H01L2924/0002 ,  H05K7/20009 ,  H05K7/20809 ,  H01L2924/00

Abstract: The present application discloses a low-noise computer heat dissipation device, which relates to electronic devices, and more particularly to the dissipation of heat generated by computer devices such as a server, a network device, a personal computer (PC), a notebook computer, etc. The computer heat dissipation device comprises a heat conduction member, a central radiator, and auxiliary heat dissipation fans. The heat conduction member is mainly formed by heat pipes, evaporation ends of the heat pipes are connected to main heating members inside a chassis, condensation ends of the heat pipes are connected to the central radiator, and the central radiator has cooling fins with large heat dissipation areas and a low-speed fan. The advantages of this technical solution are that noise of heat dissipation fans of the chassis can be reduced and the overall heat dissipation efficiency can be enhanced.

Abstract translation: 本申请公开了一种低噪声计算机散热装置，其涉及电子装置，更具体地说，涉及由诸如服务器，网络装置，个人计算机（PC），笔记本电脑 等等。计算机散热装置包括导热构件，中央散热器和辅助散热风扇。 导热构件主要由热管形成，热管的蒸发端与底盘内的主加热构件连接，热管的冷凝端连接到中央散热器，中央散热器具有散热大的散热片 散热区域和低速风扇。 该技术方案的优点在于可以降低底盘散热风扇的噪音，提高整体散热效率。

公开(公告)号：US20140362524A1

公开(公告)日：2014-12-11

申请号：US14458614

申请日：2014-08-13

Applicant: OCZ Storage Solutions Inc.

Inventor： Dokyun Kim ,  Karl Reinke

IPC: G06F1/20 ,  H05K5/02 ,  H05K7/14 ,  G06F1/18

CPC classification number: G06F1/20 ,  F28D15/02 ,  G06F1/185 ,  G06F2200/201 ,  H01L23/427 ,  H01L2924/0002 ,  H05K5/0213 ,  H05K7/1417 ,  Y10T29/49002 ,  Y10T29/49004 ,  Y10T29/49826 ,  H01L2924/00

Abstract: A mounting structure adapted for mounting an expansion card within a computer enclosure and configured to directly absorb and conduct heat from a heat source (such as an IC chip) on the card to the ambient atmosphere surrounding the enclosure. The mounting structure includes a mounting bracket, a heat sink adapted to contact a surface of the heat source on the expansion card, an extension interconnecting the heat sink and the mounting bracket, one or more features for conducting heat from the heat sink to the mounting bracket, and one or more features associated with the mounting bracket for dissipating heat from the mounting structure to the ambient atmosphere surrounding the enclosure.

Abstract translation: 一种安装结构，其适于将扩展卡安装在计算机外壳内并且被配置为直接吸收并将热量从卡上的热源（例如IC芯片）传导到围绕外壳的环境大气。 安装结构包括安装支架，适于接触膨胀卡上的热源的表面的散热器，将散热器和安装支架相互连接的延伸件，用于将热量从散热器传导到安装件的一个或多个特征 支架和与安装支架相关联的一个或多个特征，用于将热量从安装结构散发到围绕外壳的周围环境。

公开(公告)号：US08885336B2

公开(公告)日：2014-11-11

申请号：US13339413

申请日：2011-12-29

Applicant: Dokyun Kim ,  Karl Reinke

Inventor： Dokyun Kim ,  Karl Reinke

IPC: G06F1/20 ,  H05K7/20 ,  H01L23/427 ,  G06F1/18 ,  F28D15/02

CPC classification number: G06F1/20 ,  F28D15/02 ,  G06F1/185 ,  G06F2200/201 ,  H01L23/427 ,  H01L2924/0002 ,  H05K5/0213 ,  H05K7/1417 ,  Y10T29/49002 ,  Y10T29/49004 ,  Y10T29/49826 ,  H01L2924/00

Abstract: A mounting structure adapted for mounting an expansion card within a computer enclosure and configured to directly absorb and conduct heat from a heat source (such as an IC chip) on the card to the ambient atmosphere surrounding the enclosure. The mounting structure includes a mounting bracket, a heat sink adapted to contact a surface of the heat source on the expansion card, an extension interconnecting the heat sink and the mounting bracket, one or more features for conducting heat from the heat sink to the mounting bracket, and one or more features associated with the mounting bracket for dissipating heat from the mounting structure to the ambient atmosphere surrounding the enclosure.

Abstract translation: 一种安装结构，其适于将扩展卡安装在计算机外壳内并且被配置为直接吸收并将热量从卡上的热源（例如IC芯片）传导到围绕外壳的环境大气。 安装结构包括安装支架，适于接触膨胀卡上的热源的表面的散热器，将散热器和安装支架相互连接的延伸件，用于将热量从散热器传导到安装件的一个或多个特征 支架和与安装支架相关联的一个或多个特征，用于将热量从安装结构散发到围绕外壳的周围环境。

公开(公告)号：US08854809B2

公开(公告)日：2014-10-07

申请号：US13387092

申请日：2010-03-22

Applicant: Matthew Daniel Neumann ,  Timothy Michael Rau

Inventor： Matthew Daniel Neumann ,  Timothy Michael Rau

IPC: H05K7/20 ,  E04H1/00 ,  E04H3/00 ,  E04H5/00 ,  E04H6/00 ,  E04H9/00 ,  E04H14/00 ,  F25B45/00 ,  G05D23/00 ,  G06F1/20 ,  H05K5/00 ,  H05K7/14 ,  H05K5/02

CPC classification number: H05K7/1497 ,  G06F1/20 ,  G06F1/206 ,  G06F2200/201 ,  H05K5/00 ,  H05K5/0004 ,  H05K5/02 ,  H05K7/14 ,  H05K7/1485 ,  H05K7/1488 ,  H05K7/20254 ,  H05K7/2039 ,  H05K7/20409 ,  H05K7/2049 ,  H05K7/2079 ,  Y10T29/49002

Abstract: A data center includes a modular building structure forming an enclosure having a bottom side. An external support system extends from the modular building structure. A series of heat sinks are each configured to extend from an interior to an exterior of the enclosure and protrude below the bottom side of the modular building structure into a fluid. Electronic components and devices are housed within the enclosure.

Abstract translation: 数据中心包括形成具有底侧的外壳的模块化建筑结构。 外部支持系统从模块化建筑结构延伸。 一系列散热器各自构造成从外壳的内部延伸到外部并且突出到模块化建筑结构的底侧下方成为流体。 电子组件和设备安装在外壳内。