公开(公告)号：US20180152793A1

公开(公告)日：2018-05-31

申请号：US15826788

申请日：2017-11-30

Applicant: Infineon Technologies Austria AG

Inventor： Stefan JOST ,  Wolfgang FRIZA ,  Stefan GEISSLER ,  Soenke PIRK

IPC: H04R9/08 ,  B81B7/00 ,  B81C1/00 ,  H04R31/00

CPC classification number: H04R9/08 ,  B81B7/0006 ,  B81B2201/0257 ,  B81B2203/0127 ,  B81B2203/04 ,  B81C1/00166 ,  H04R19/005 ,  H04R19/02 ,  H04R19/04 ,  H04R31/00 ,  H04R31/003 ,  H04R2201/003

Abstract: A MEMS device is provided. The MEMS device includes a membrane, and at least one electrode arranged at a distance from the membrane. The at least one electrode includes a layer stack. The layer stack includes a first insulation layer, a first conductive layer arranged thereabove, a second insulation layer arranged thereabove, a second conductive layer arranged thereabove, and a third insulation layer arranged thereabove.

公开(公告)号：US20180152792A1

公开(公告)日：2018-05-31

申请号：US15826255

申请日：2017-11-29

Applicant: Cirrus Logic International Semiconductor Ltd.

Inventor： Tsjerk Hans HOEKSTRA ,  Axel THOMSEN ,  Colin Robert JENKINS ,  Aleksey Sergeyevich KHENKIN

IPC: H04R9/08 ,  H04R29/00 ,  B81B3/00

CPC classification number: H04R9/08 ,  B81B3/0086 ,  B81B2201/0257 ,  B81B2203/0127 ,  B81B2203/04 ,  H04R19/005 ,  H04R19/04 ,  H04R29/004 ,  H04R2201/003

Abstract: A MEMS transducer comprising: a flexible membrane, the flexible membrane comprising a first membrane electrode; a back plate, the back plate comprising a first back plate electrode; wherein the back plate is supported in a spaced relation with respect to the flexible membrane. The MEMS transducer is configured to provide electrical connections to the first membrane electrode and the first back plate electrode. The flexible membrane further comprises a second membrane electrode, the second membrane electrode being electrically isolated from the first membrane electrode, wherein the first membrane electrode and the second membrane electrode are arranged to reduce variation in electrostatic forces across the flexible membrane.

公开(公告)号：US09986347B2

公开(公告)日：2018-05-29

申请号：US14751691

申请日：2015-06-26

Applicant: Starkey Laboratories, Inc.

Inventor： Gregory John Haubrich ,  Jeffrey Paul Solum

IPC: H04R25/00

CPC classification number: H04R25/554 ,  H04R2201/003 ,  H04R2225/021 ,  H04R2225/023 ,  H04R2225/025

Abstract: Disclosed herein, among other things, are methods and apparatus for wireless electronics using a MEMS switch for a hearing assistance device. The present application relates to a hearing assistance device configured to be worn by a wearer. The hearing assistance device includes a housing for electronics of the hearing assistance device, including wireless electronics. The wireless electronics include a plurality of radio frequency (RF) MEMS switches, in various embodiments. A hearing assistance processor is adapted to process signals for the wearer of the hearing assistance device. In various embodiments, the hearing assistance device includes an antenna, and a switchable capacitor bank configured for tuning the antenna, the switchable capacitor bank including one or more of the plurality of RF MEMS switches. The plurality of RF MEMS switches include an electrostatically deformed RF MEMS membrane, in an embodiment. Different configurations and approaches are provided.

公开(公告)号：US20180146301A1

公开(公告)日：2018-05-24

申请号：US15816078

申请日：2017-11-17

Applicant: Sonion Nederland B.V.

Inventor： Adrianus Maria Lafort ,  Michiel van Nieuwkerk

IPC: H04R19/04 ,  H03F3/187 ,  H03H11/28 ,  H04R19/00 ,  H04R3/00

CPC classification number: H03F1/548 ,  H03F1/523 ,  H03F1/56 ,  H03F3/10 ,  H03F3/187 ,  H03F3/195 ,  H03F2200/03 ,  H03F2200/222 ,  H03F2200/426 ,  H03F2200/444 ,  H03F2200/451 ,  H03H11/28 ,  H04R3/00 ,  H04R19/005 ,  H04R19/04 ,  H04R2201/003

Abstract: A system including a transducer and an amplifier as well as a circuit which always has a high impedance at low voltages. In addition, at high voltages, the circuit has a high impedance at high frequencies but a low impedance at low frequencies. In biased transducers, this circuit may be used between the charge pump and the transducer. In general, the circuit may be provided in a signal path between the transducer and the amplifier. The circuit has as an advantage that at startup, low frequency signals at high intensities may overload the amplifier, whereas at operation, higher frequency signals are desired fed to the amplifier at the same intensity. This is facilitated by the circuit.

公开(公告)号：US20180146272A1

公开(公告)日：2018-05-24

申请号：US15857203

申请日：2017-12-28

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Li-Wen Hung ,  John U. Knickerbocker

IPC: H04R1/04 ,  A61B5/02 ,  A61B5/024 ,  A61B5/00 ,  A61B7/00 ,  H04R19/01

CPC classification number: H04R1/04 ,  A61B5/0022 ,  A61B5/02 ,  A61B5/02028 ,  A61B5/02438 ,  A61B5/02444 ,  A61B5/6833 ,  A61B7/00 ,  A61B2560/0214 ,  A61B2560/0412 ,  A61B2562/0204 ,  A61B2562/0271 ,  A61B2562/028 ,  A61B2562/12 ,  A61B2562/164 ,  A61B2562/166 ,  H04R19/016 ,  H04R2201/003 ,  H04R2420/07

Abstract: A wearable monitoring system includes a microelectromechanical (MEMS) microphone to receive acoustic signal data through skin of a user. An integrated circuit chip is bonded to and electrically connected to the MEMS microphone. A portable power source is connected to at least the integrated circuit chip. A flexible substrate is configured to encapsulate and affix the MEMS microphone and the integrated circuit chip to the skin of the user.

公开(公告)号：US09980051B2

公开(公告)日：2018-05-22

申请号：US15311127

申请日：2015-05-13

Applicant: USound GmbH

Inventor： Andrea Rusconi Clerici ,  Ferruccio Bottoni

IPC: H04R25/00 ,  H04R17/00 ,  H04R7/18 ,  B81B3/00 ,  H01L23/12

CPC classification number: H04R19/005 ,  B81B3/0021 ,  B81B3/0037 ,  B81B2201/0257 ,  B81B2203/0127 ,  B81B2203/0315 ,  H04R7/18 ,  H04R17/00 ,  H04R17/005 ,  H04R23/02 ,  H04R2201/003

Abstract: The invention relates to a MEMS loudspeaker (1) for generating sound waves in the audible wavelength spectrum, with a carrier substrate (2) that features a substrate cavity (6) with two substrate openings (7, 8), which are formed on two opposite sides of the carrier substrate (2), an actuator structure (3), in particular a piezoelectric actuator structure, which is arranged in the area of one of the two substrate openings (7, 8) and is connected to the carrier substrate (2) in its edge area, and a membrane (4) anchored in its edge area, which, by means of the actuator structure (3), can be set into vibration for generating sound waves. In accordance with the invention, in a cross-sectional view of the MEMS loudspeaker (1), the membrane (4) is spaced at a distance from the actuator structure (3), such that an intermediate cavity (13) is formed between these two. Furthermore, the MEMS loudspeaker (1) features a coupling element (13) arranged in the intermediate cavity (13), which connects the actuator structure (3) to the membrane (4) and may vibrate with this with respect to the carrier substrate (2).

公开(公告)号：US09979367B2

公开(公告)日：2018-05-22

申请号：US15306534

申请日：2014-05-08

Applicant: Epcos AG

Inventor： Pirmin Hermann Otto Rombach ,  Niels Marker-Villumsen

IPC: H03G3/20 ,  H03G3/30 ,  H03F3/183 ,  H03F1/32 ,  H04R3/00

CPC classification number: H03G3/301 ,  H03F1/32 ,  H03F3/183 ,  H03G3/3005 ,  H03G3/3089 ,  H04R3/00 ,  H04R2201/003

Abstract: A circuit having a first amplifier with a variable gain, a second amplifier with a variable gain configured to provide an output signal, a control unit, a memory element, and a switching member. The control unit is configured to adjust the variable gain of the first amplifier and the variable gain of the second amplifier. The memory element is configured to store a sample of the output signal. The switching member is configured to connect an output port of the circuit to either the second amplifier or to the memory element. A method of operating this circuit is also disclosed.

公开(公告)号：US20180139543A1

公开(公告)日：2018-05-17

申请号：US15572825

申请日：2016-05-10

Applicant: USOUND GMBH

Inventor： ANDREA RUSCONI CLERICI ,  FERRUCCIO BOTTONI

IPC: H04R19/04 ,  H04R1/04

CPC classification number: H04R19/04 ,  H04R1/04 ,  H04R1/24 ,  H04R1/2876 ,  H04R1/2884 ,  H04R17/00 ,  H04R19/005 ,  H04R2201/003

Abstract: The present invention relates to a sound transducer assembly (1) with a MEMS sound transducer (21) for generating and/or detecting sound waves in the audible wavelength spectrum, which comprises a first cavity (41), and an ASIC (11) electrically connected to the MEMS sound transducer. In accordance with the invention, the ASIC (11) is embedded in a first substrate (10), and the first MEMS sound transducer (21) is arranged in a second substrate (20). In addition, it is provided that the first substrate (10) and the second substrate (20) are electrically connected to one another, and that the first cavity (41) is at least partially formed in the first and/or second substrate (10, 20).

公开(公告)号：US20180127264A1

公开(公告)日：2018-05-10

申请号：US15668844

申请日：2017-08-04

Applicant: SILICON INTEGRATED SYSTEMS CORP.

Inventor： Ssu-Che YANG ,  Wen-Chi LIN ,  Keng-Nan CHEN

IPC: B81B7/00 ,  G01R17/04

CPC classification number: B81B7/008 ,  B81B2201/02 ,  G01R17/04 ,  H02M3/07 ,  H04R3/04 ,  H04R2201/003 ,  H04R2410/00

Abstract: A sensing device includes a micro-electromechanical sensor, a source follower and an amplifier. The source follower includes a first output module including a first transistor and a second transistor. The micro-electromechanical sensor is configured to generate an input signal. A first terminal of the first transistor is configured to receive a first reference voltage. A second terminal and a control of the first transistor are electrically connected to the first output terminal and to a first current source respectively. A first terminal and a second terminal of the second transistor are electrically connected to the second terminal and the control terminal of the first transistor respectively. A control terminal of the second transistor is configured to receive the input signal. A first input terminal and a second input terminal of the amplifier are electrically connected to a first output terminal configured to receive a common-mode voltage respectively.

公开(公告)号：US09967677B2

公开(公告)日：2018-05-08

申请号：US14959560

申请日：2015-12-04

Applicant: Infineon Technologies AG

Inventor： Andreas Wiesbauer ,  Marc Fueldner ,  Elmar Bach

IPC: H04R3/00 ,  H04R19/04 ,  H04R1/04 ,  H04R3/04 ,  H04R29/00

CPC classification number: H04R19/04 ,  H04R1/04 ,  H04R3/04 ,  H04R29/004 ,  H04R2201/003 ,  H04R2430/01

Abstract: A system and method for a sensor-supported microphone includes an amplifier having an input configured to be coupled to a transducer, and an output coupled to an analog interface to output a transduced electrical signal from the transducer, a data bus configured to be coupled to an environmental sensor, a calibration parameter storage circuit coupled to the data bus, the calibration parameter storage circuit comprising calibration data relating sensitivity of the transducer with environmental measurements provided by the environmental sensor, and a digital interface coupled to the data bus and configured to output the calibration data and the environmental measurements.