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公开(公告)号：US20160029488A1
公开(公告)日：2016-01-28
申请号：US14724496
申请日：2015-05-28
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Myung Sam KANG , Seung Eun LEE , Ki Jung SUNG , Yul Kyo CHUNG
CPC classification number: H05K1/056 , H05K3/4038 , H05K3/4608 , H05K2201/0154 , H05K2201/096 , H05K2201/09827
Abstract: There are provided a printed circuit board and a method of manufacturing the same. The printed circuit board according to an exemplary embodiment of the present disclosure includes a metal core; a through via penetrating through the metal core; and an insulating film formed between the metal core and the through via.
Abstract translation: 提供了一种印刷电路板及其制造方法。 根据本公开的示例性实施例的印刷电路板包括金属芯; 通孔穿过金属芯; 以及形成在金属芯和通孔之间的绝缘膜。
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102.发明授权Adhesiveless copper clad laminates and printed circuit board having adhesiveless copper clad laminates as base material 有权无粘性铜包覆层压板和印刷电路板，具有无粘性铜包层压板作为基材公开(公告)号：US09232649B2
公开(公告)日：2016-01-05
申请号：US14048450
申请日：2013-10-08
Applicant: Sumitomo Metal Mining Co., Ltd.
Inventor： Junichi Nagata
CPC classification number: H05K1/056 , H05K1/0313 , H05K1/0393 , H05K3/022 , H05K3/06 , H05K3/108 , H05K3/388 , H05K2201/0154 , H05K2201/0317 , Y10T428/12569
Abstract: Adhesiveless copper clad laminates obtained by metallizing excellent in wiring microfabrication ability in processing by semi-additive method, and a printed circuit board using the adhesiveless copper clad laminates excellent in wiring microfabrication ability as a base material are provided. The adhesiveless copper clad laminates include a base metal layer made of an alloy containing nickel and formed on at least one surface of an insulating film without using an adhesive in between, a thin copper layer formed on a front surface of the base metal layer by dry plating, and a copper plating film formed on a front surface of the thin copper layer by electroplating. The copper plating film contains 10 mass ppm to 150 mass ppm of sulfur in a depth range of at least 0.4 μm from the front surface of the copper plating film in a direction toward the insulating film.
Abstract translation: 提供了通过半加成方法的加工中的布线微细加工能力优异的金属化而得到的无粘性覆铜层压板，以及使用以布线微细加工能力优异的无粘合剂覆铜层压板作为基材的印刷电路板。 无粘合剂的铜包覆层压板包括由含有镍的合金制成的贱金属层，并且形成在绝缘膜的至少一个表面上，而不使用其间的粘合剂，通过干燥形成在贱金属层的前表面上的薄铜层 电镀，以及通过电镀在薄铜层的前表面上形成的镀铜膜。 镀铜膜在从镀铜膜的前表面到绝缘膜的方向上至少0.4μm的深度范围内含有10质量ppm〜150质量ppm的硫。
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公开(公告)号：US20150359092A1
公开(公告)日：2015-12-10
申请号：US14410116
申请日：2013-06-21
Applicant: E.E. DU PONT DE NEMOURS AND COMPANY
Inventor： Sidney G. Cox , Christopher Dennis Simone , Carl Robert Haeger , Richard A. Wessel
CPC classification number: H05K1/056 , B32B7/12 , B32B15/08 , B32B15/20 , B32B27/20 , B32B27/281 , B32B2307/204 , B32B2307/206 , B32B2307/302 , B32B2307/4026 , B32B2457/00 , B32B2457/08 , C08G73/1039 , C08G73/1042 , C08G73/105 , C08G73/1067 , C08G73/1071 , H01B3/306 , H05K1/0271 , H05K1/0298 , H05K1/0346 , H05K1/036 , H05K1/0373 , H05K1/09 , H05K3/022 , H05K3/281 , H05K2201/0154 , H05K2201/0323 , Y10T428/24851 , Y10T428/263 , Y10T428/264 , Y10T428/266 , Y10T428/31681
Abstract: The present disclosure is directed to a circuit board having a first polyimide coverlay, a first imaged metal layer, a first electrically insulating layer, a second imaged metal layer, a polyimide bondply, a third imaged metal layer, a second electrically insulating layer, a forth imaged metal layer and a second polyimide coverlay. The first polyimide coverlay, the polyimide bondply and the second polyimide coverlay are derived from 100 mole % 3,3′,4,4′-biphenyl tetracarboxylic dianhydride, 20 to 90 mole % 2,2′-bis(trifluoromethyl)benzidine, and 10 to 80 mole % 4,4′-oxydianiline.
Abstract translation: 本公开涉及具有第一聚酰亚胺覆盖层，第一成像金属层，第一电绝缘层，第二成像金属层，聚酰亚胺接合层，第三成像金属层，第二电绝缘层， 第四成像金属层和第二聚酰亚胺覆盖层。 第一聚酰亚胺覆盖物，聚酰亚胺粘合剂和第二聚酰亚胺覆盖物衍生自100摩尔％3,3'，4,4'-联苯四羧酸二酐，20至90摩尔％2,2'-双（三氟甲基）联苯胺，和 10〜80摩尔％4,4'-氧二苯胺。
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104.发明申请WIRING SUBSTRATE, SEMICONDUCTOR DEVICE, AND METHOD FOR MANUFACTURING WIRING SUBSTRATE 有权配线基板，半导体装置及制造布线基板的方法公开(公告)号：US20150357276A1
公开(公告)日：2015-12-10
申请号：US14730743
申请日：2015-06-04
Applicant: SHINKO ELECTRIC INDUSTRIES CO., LTD.
Inventor： Noriyoshi SHIMIZU , Kiyoshi OI , Yuichiro SHIMIZU
CPC classification number: H01L23/49838 , H01L21/4857 , H01L21/486 , H01L23/49822 , H01L23/49827 , H01L23/49833 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2924/15174 , H01L2924/15311 , H05K1/0306 , H05K1/0326 , H05K1/0346 , H05K1/09 , H05K1/181 , H05K3/0023 , H05K3/0055 , H05K3/0094 , H05K3/4644 , H05K3/4688 , H05K2201/0141 , H05K2201/0154 , H05K2203/061 , Y10T29/49167 , H01L2924/00
Abstract: A wiring substrate includes a first wiring structure and a second wiring structure stacked thereon. The first wiring structure includes a first insulation layer and a via wiring extending through the first insulation layer. The second wiring structure includes a first wiring layer formed on the first insulation layer and the via wiring, and a first plane layer stacked on the first insulation layer and at least partially grid-shaped in a plan view to define second through holes. A second insulation layer is stacked on the first insulation layer to fill the second through holes and cover the first plane layer and the first wiring layer. The second wiring structure has a higher wiring density than the first wiring structure. The second through holes each include a lower open end and an upper open end having a smaller open width than the lower open end.
Abstract translation: 布线基板包括堆叠在其上的第一布线结构和第二布线结构。 第一布线结构包括延伸穿过第一绝缘层的第一绝缘层和通孔布线。 第二布线结构包括形成在第一绝缘层和通孔布线上的第一布线层和堆叠在第一绝缘层上并且在平面图中至少部分网格形状以限定第二通孔的第一平面层。 第二绝缘层堆叠在第一绝缘层上以填充第二通孔并覆盖第一平面层和第一布线层。 第二布线结构具有比第一布线结构更高的布线密度。 第二通孔各自包括下开口端和具有比下开口端小的开口宽度的上开口端。
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公开(公告)号：US09204528B2
公开(公告)日：2015-12-01
申请号：US14113773
申请日：2012-04-26
Applicant: Masayoshi Kido , Yoshihide Sekito
Inventor： Masayoshi Kido , Yoshihide Sekito
CPC classification number: H05K1/02 , C09J9/00 , H05K1/0281 , H05K1/189 , H05K3/0064 , H05K2201/0154 , H05K2201/0209 , H05K2201/2009
Abstract: A stiffener-integrated flexible printed circuit board includes: (A) a stiffener; (B) a thermosetting adhesive; (C) an insulator film; and (D) a wiring-pattern-equipped film, the stiffener (A), the thermosetting adhesive (B), the insulator film (C), and the wiring-pattern-equipped film (D) being laminated in this order, the insulator film (C) containing at least (a) a binder polymer and (b) spherical organic beads. This provides a stiffener-integrated FPC which is excellent in adhesion between a thermosetting adhesive of a stiffener and an insulator film and which is small in warpage.
Abstract translation: 一种加强件集成的柔性印刷电路板包括：（A）加强件; （B）热固性粘合剂; （C）绝缘膜; 和（D）配线图案的膜，加强件（A），热固性粘合剂（B），绝缘体膜（C）和布线图案的膜（D）按顺序层叠， 至少含有（a）粘合剂聚合物的绝缘体膜（C）和（b）球形有机珠粒。 这提供了一种加强件一体化的FPC，其在加强件的热固性粘合剂和绝缘膜之间的粘合性优异并且翘曲小。
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Patent Agency Ranking
公开(公告)号：US20150336354A1
公开(公告)日：2015-11-26
申请号：US14410115
申请日：2013-06-21
Applicant: E.I.DU PONT DE NEMOURS AND COMPANY
Inventor： Sidney G. Cox , Christopher Dennis Simone
CPC classification number: H05K1/056 , B32B7/12 , B32B15/08 , B32B15/20 , B32B27/20 , B32B27/281 , B32B2307/204 , B32B2307/206 , B32B2307/302 , B32B2307/4026 , B32B2457/00 , B32B2457/08 , C08G73/1039 , C08G73/1042 , C08G73/105 , C08G73/1067 , C08G73/1071 , H01B3/306 , H05K1/0271 , H05K1/0298 , H05K1/0346 , H05K1/036 , H05K1/0373 , H05K1/09 , H05K3/022 , H05K3/281 , H05K2201/0154 , H05K2201/0323 , Y10T428/24851 , Y10T428/263 , Y10T428/264 , Y10T428/266 , Y10T428/31681
Abstract: The present disclosure is directed to a polyimide metal clad laminate. The metal clad laminate has a metal foil and a polyimide layer. The polyimide layer having a polyimide derived from 100 mole % 3,3′,4,4′-biphenyl tetracarboxylic dianhydride, 20 to 90 mole % 2,2′-bis(trifluoromethyl)benzidine, and 10 to 80 mole % 4,4′-oxydianiline. The polyimide metal clad laminate does not have an adhesive layer between the metal foil and the polyimide layer.
Abstract translation: 本公开涉及聚酰亚胺金属包覆层压板。 金属箔层压板具有金属箔和聚酰亚胺层。 聚酰亚胺层具有由100摩尔％3,3'，4,4'-联苯四羧酸二酐，20-90摩尔％2,2'-双（三氟甲基）联苯胺和10-80摩尔％4,4'-二 '氧基苯胺。 聚酰亚胺金属包覆层压板在金属箔和聚酰亚胺层之间不具有粘合剂层。
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107.发明授权Method of preparing a flexible substrate assembly and flexible substrate assembly therefrom 有权从其制备柔性基底组件和柔性基底组件的方法公开(公告)号：US09155190B2
公开(公告)日：2015-10-06
申请号：US13913141
申请日：2013-06-07
Applicant: Jesmin Haq , Scott Ageno , Douglas E. Loy , Shawn O'Rourke , Robert Naujokaitis
Inventor： Jesmin Haq , Scott Ageno , Douglas E. Loy , Shawn O'Rourke , Robert Naujokaitis
CPC classification number: H05K1/0271 , H05K1/0277 , H05K1/0393 , H05K1/181 , H05K3/00 , H05K3/007 , H05K3/281 , H05K2201/0145 , H05K2201/0154 , H05K2201/068 , H05K2203/0152 , H05K2203/016 , H05K2203/0191 , H05K2203/1383 , Y10T156/10 , Y10T428/14 , Y10T428/1476 , Y10T428/23914 , Y10T428/24355 , Y10T428/24942 , Y10T428/26 , Y10T428/2848 , Y10T428/31515
Abstract: Some embodiments include a method of preparing a flexible substrate assembly. Other embodiments of related methods and structures are also disclosed.
Abstract translation: 一些实施例包括制备柔性基底组件的方法。 还公开了相关方法和结构的其它实施方案。
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公开(公告)号：US09125310B2
公开(公告)日：2015-09-01
申请号：US13328468
申请日：2011-12-16
Applicant: Mohammad Moniruzzaman
Inventor： Mohammad Moniruzzaman
CPC classification number: H05K1/0366 , H01B1/24 , H01L23/295 , H01L2924/0002 , H05K1/0259 , H05K9/0079 , H05K2201/0154 , H05K2201/0293 , H01L2924/00
Abstract: The present disclosure relates to thermoplastic electrostatic dissipative (ESD) composites. The disclosed composites comprise a thermoplastic resin phase and a plurality of intermediate modulus carbon fibers dispersed within the thermoplastic resin phase. Also disclosed herein are methods for the manufacture and/or use of the disclosed ESD composites as well as articles formed from such composites.
Abstract translation: 本公开涉及热塑性静电耗散（ESD）复合材料。 所公开的复合材料包括分散在热塑性树脂相内的热塑性树脂相和多个中等模量的碳纤维。 本文还公开了用于制造和/或使用所公开的ESD复合材料以及由这种复合材料形成的制品的方法。
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公开(公告)号：US20150245479A1
公开(公告)日：2015-08-27
申请号：US14708016
申请日：2015-05-08
Applicant: FUJIFILM Corporation
Inventor： Yoshihisa USAMI , Hiroshi OHTA
CPC classification number: H05K1/092 , H05K1/0346 , H05K3/0091 , H05K3/105 , H05K2201/0154 , H05K2201/0338 , H05K2203/013 , H05K2203/107 , H05K2203/1157 , Y10T428/24909
Abstract: The process for manufacturing a conductive film, said process being capable of achieving efficient progress of reduction of a metal oxide into a metal and yielding a conductive film which exhibits excellent adhesion to a substrate; and a printed wiring board. This process includes: a step for applying a dispersion which contains metal oxide particles to a substrate to form a precursor film which contains the particles; and a step for irradiating the precursor film with a continuous-wave laser beam while scanning the laser beam relatively, and thereby reducing the metal oxide in an irradiated area to form a metal-containing conductive film. In the process, the scanning speed is 1.0 m/s or more, the laser power of the continuous-wave laser beam is 6.0 W or more, and the irradiation time per point on the surface of the precursor film is 1.0 μs or more.
Abstract translation: 制造导电膜的方法，所述方法能够实现将金属氧化物还原成金属并产生对衬底具有优异粘附性的导电膜的有效进展; 和印刷线路板。 该方法包括：将含有金属氧化物颗粒的分散体施加到基材上以形成含有颗粒的前体膜的步骤; 以及在相对地扫描激光束的同时用连续波激光束照射前体膜的步骤，从而在照射区域中还原金属氧化物以形成含金属的导电膜。 在该过程中，扫描速度为1.0m / s以上，连续波激光的激光功率为6.0W以上，前体膜表面的每点的照射时间为1.0μs以上。
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110.发明申请公开(公告)号：US20150245470A1
公开(公告)日：2015-08-27
申请号：US14627913
申请日：2015-02-20
Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
Inventor： Chun-Wei SU , Chyi-Ming LEU , Yu-Ju KUO , Hong-Ching LIN , Chun-An LU , Chiung-Hsiung CHEN
CPC classification number: B29C39/02 , B29C35/02 , B29C39/003 , B29K2027/16 , B29K2079/08 , B29K2505/00 , B29K2995/0005 , B29L2031/3425 , H05K3/207 , H05K2201/0154 , H05K2201/2072 , H05K2203/1131
Abstract: A flexible substrate embedded with wires is provided. The flexible substrate embedded with wires includes a flexible substrate constituted by a polymer material, and a continuous wire pattern containing a plurality of pores embedded in the flexible substrate, wherein the polymer material fills the pores. A method for fabricating a flexible substrate embedded with wires is also provided.
Abstract translation: 提供了嵌入电线的柔性基板。 嵌入电线的柔性基板包括由聚合物材料构成的柔性基板和包含嵌入柔性基板中的多个孔的连续的线图案，其中聚合物材料填充孔。 还提供了一种制造嵌有电线的柔性基板的方法。
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