公开(公告)号：US20160043480A1

公开(公告)日：2016-02-11

申请号：US14918648

申请日：2015-10-21

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Kosuke Nakano ,  Hidekiyo Takaoka

IPC: H01R4/02 ,  H01R4/58

CPC classification number: H01R4/02 ,  B23K1/00 ,  B23K1/0016 ,  B23K1/19 ,  B23K35/0238 ,  B23K35/0244 ,  B23K35/262 ,  B23K2101/42 ,  C22C9/05 ,  C22C9/06 ,  C22C13/00 ,  C22C13/02 ,  H01R4/58 ,  H05K3/3463 ,  H05K2201/0272 ,  Y10T403/479

Abstract: A joint structure that includes a first metal member, a second metal member, and a joint portion sandwiched between the first metal member and the second metal member. At least a Cu-M-Sn intermetallic compound is dispersed in the joint portion, M is at least one of Ni and Mn, and neither a Cu3Sn layer nor a Cu6Sn5 layer is present on at least one of interfaces between the joint portion and the first metal member and the second metal member.

Abstract translation: 一种接头结构，包括第一金属构件，第二金属构件和夹在第一金属构件和第二金属构件之间的接合部。 至少一种Cu-M-Sn金属间化合物分散在接头部分中，M是Ni和Mn中的至少一种，并且Cu 3 Sn层和Cu 6 Sn 5层不存在于接合部和 第一金属构件和第二金属构件。

公开(公告)号：US09247652B2

公开(公告)日：2016-01-26

申请号：US12680923

申请日：2008-10-02

Applicant: Kaoru Konno ,  Hiroki Hayashi ,  Takashi Kawamori

Inventor： Kaoru Konno ,  Hiroki Hayashi ,  Takashi Kawamori

IPC: B32B15/02 ,  H01B1/02 ,  H01B1/22 ,  H05K3/32 ,  B22F1/00 ,  B23K35/02 ,  B23K35/26 ,  B23K35/30 ,  B23K35/36 ,  B23K35/362 ,  B23K35/365 ,  C09J9/02 ,  C09J11/04 ,  H01L23/00 ,  C08K3/00 ,  C08K3/08 ,  H05K1/14

CPC classification number: H01L24/16 ,  B22F1/0059 ,  B22F2001/0066 ,  B23K35/0244 ,  B23K35/025 ,  B23K35/262 ,  B23K35/264 ,  B23K35/302 ,  B23K35/3613 ,  B23K35/3618 ,  B23K35/362 ,  B23K35/365 ,  C08K3/017 ,  C08K3/08 ,  C09J9/02 ,  C09J11/04 ,  H01B1/22 ,  H01L24/12 ,  H01L2224/05568 ,  H01L2224/13099 ,  H01L2224/1329 ,  H01L2224/13347 ,  H01L2224/13439 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/16265 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01009 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01057 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/12042 ,  H01L2924/15747 ,  H01L2924/19043 ,  H01L2924/20107 ,  H05K1/141 ,  H05K3/321 ,  H05K2201/0272 ,  H05K2203/0425 ,  Y10T428/31511 ,  Y10T428/31678 ,  H01L2924/00 ,  H01L2224/05599

Abstract: There are provided are an adhesive composition that keeps storage stability and further gives a cured product wherein metallic bonds are formed in the state that the cured product wets its components and is satisfactorily spread between the components (or parts), thereby turning excellent in adhesive property, electroconductivity, and reliability for mounting such as TCT resistance or high-temperature standing resistance; an electronic-component-mounted substrate using the same; and a semiconductor device. The adhesive composition comprises electroconductive particles (A) and a binder component (B), wherein the electroconductive particles (A) include a metal (a1) having a melting point equal to or higher than the reflow temperature and containing no lead, and a metal (a2) having a melting point lower than the reflow temperature and containing no lead, and the binder component (B) includes a thermosetting resin composition (b1) and an aliphatic dihydroxycarboxylic acid (b2).

Abstract translation: 提供了一种粘合剂组合物，其保持储存稳定性，并进一步得到固化产物，其中在固化产物润湿其组分并令人满意地在组分（或部分）之间铺展的状态下形成金属粘合剂，由此转变粘合性能优异 ，导电性和安装的可靠性，如TCT电阻或耐高温电阻; 使用该基板的电子元件安装基板; 和半导体器件。 粘合剂组合物包括导电颗粒（A）和粘合剂组分（B），其中导电颗粒（A）包括熔点等于或高于回流温度并且不含铅的金属（a1）和金属 （a2），其熔点低于回流温度，不含铅，粘合剂成分（B）含有热固性树脂组合物（b1）和脂肪族二羟基羧酸（b2）。

公开(公告)号：US20150223325A1

公开(公告)日：2015-08-06

申请号：US14612638

申请日：2015-02-03

Applicant: Seiko Epson Corporation

Inventor： Tetsuro MIYAO ,  Hideki ISHIGAMI ,  Yukihiko SHIOHARA ,  Tetsuya OTSUKI ,  Hidefumi NAKAMURA

IPC: H05K1/02 ,  H05K3/40 ,  H05K1/11 ,  H05K1/18 ,  H05K1/03 ,  H05K1/09

CPC classification number: H05K1/0271 ,  H01L21/486 ,  H01L23/15 ,  H01L23/498 ,  H01L23/49827 ,  H01L24/13 ,  H01L24/16 ,  H01L24/81 ,  H01L2224/0401 ,  H01L2224/1319 ,  H01L2224/16235 ,  H01L2224/81439 ,  H01L2224/81447 ,  H01L2224/81471 ,  H01L2224/8148 ,  H01L2224/81484 ,  H01L2224/8185 ,  H01L2924/14 ,  H01L2924/15313 ,  H01L2924/15787 ,  H01L2924/16251 ,  H01L2924/164 ,  H05K1/0306 ,  H05K1/09 ,  H05K1/092 ,  H05K1/115 ,  H05K1/184 ,  H05K3/1291 ,  H05K3/4061 ,  H05K2201/0269 ,  H05K2201/0272 ,  H05K2201/10083 ,  H05K2201/1056 ,  H05K2203/1126 ,  H05K2203/1131 ,  H05K2203/1194

Abstract: A base substrate includes a ceramic sintered substrate having through holes, first and second metal wirings which are integrally disposed so as to be connected to the surface of the ceramic sintered substrate and the inside of the through holes, and first and second active metal layers which are disposed between the ceramic sintered substrate and the first and second metal wirings.

Abstract translation: 基底基板包括具有通孔的陶瓷烧结基板，一体地设置成连接到陶瓷烧结基板的表面和通孔内部的第一和第二金属布线以及第一和第二有源金属层， 设置在陶瓷烧结基板和第一和第二金属布线之间。

公开(公告)号：US08961709B1

公开(公告)日：2015-02-24

申请号：US10588647

申请日：2004-03-09

Applicant: Kunihito Takaura ,  Kaichi Tsuruta ,  Hiroshi Kawanakago ,  Hiroshi Takahashi

Inventor： Kunihito Takaura ,  Kaichi Tsuruta ,  Hiroshi Kawanakago ,  Hiroshi Takahashi

IPC: B23K35/34

CPC classification number: H05K3/3484 ,  B23K35/0244 ,  B23K35/025 ,  B23K35/262 ,  C22C13/00 ,  H05K3/3463 ,  H05K2201/0272

Abstract: A solder paste using a Sn—Ag base, Sn—Cu base, or similar alloy powder has a high melting point, so it causes thermal damage to electronic devices. Sn—Ag—In base lead-free solder alloys having a low melting temperature have been studied, but they are difficult to use because they cause much occurrence of chips standing up during reflow.The present invention forms a solder paste by separating a Sn—Ag—In base lead-free solder into first and second solder alloy powders for which the difference in their peak temperatures measured by differential thermal analysis is at least 10° C. and blends the mixed powders with a flux.

Abstract translation: 使用Sn-Ag基底，Sn-Cu基底或类似合金粉末的焊膏具有高熔点，因此对电子器件造成热损伤。 已经研究了具有低熔融温度的Sn-Ag-In基底无铅焊料合金，但是由于它们在回流期间引起大量的芯片堆积而难以使用。 本发明通过将Sn-Ag-In基底无铅焊料分离成通过差示热分析测量的其峰值温度差异至少为10℃的第一和第二焊料合金粉末形成焊膏，并将 混合粉末与助焊剂。

公开(公告)号：US20140332734A1

公开(公告)日：2014-11-13

申请号：US14360361

申请日：2012-11-26

Applicant: SHOWA DENKO K.K.

Inventor： Hiroshi Uchida

IPC: H05K3/12 ,  C09D5/24

CPC classification number: H05K3/1283 ,  C08K2003/0806 ,  C08K2003/085 ,  C08K2201/002 ,  C08K2201/014 ,  C09D5/24 ,  C09D7/62 ,  C09D7/70 ,  H01B1/22 ,  H05K1/095 ,  H05K2201/0245 ,  H05K2201/0257 ,  H05K2201/0272 ,  H05K2203/10 ,  H05K2203/102

Abstract: To provide a conductive pattern formation method capable of improving conductivity of a conductive pattern and a composition for forming a conductive pattern by means of photo irradiation or microwave heating. A composition for forming a conductive pattern that contains copper particles each having a copper oxide thin film formed on the entire or a part of a surface thereof, plate-like silver particles each being 10 to 200 nm thickness, and a binder resin is prepared. The composition for forming a conductive pattern is printed in a pattern having a desired shape on a substrate. Photo irradiation or microwave heating is applied to the printed pattern to thereby produce a copper/silver sintered body, to form a conductive film.

Abstract translation: 提供能够通过光照射或微波加热提高导电图案的导电性和用于形成导电图案的组合物的导电图案形成方法。 制备含有形成在其整个或一部分表面上的氧化铜薄膜的铜颗粒的导电图案的组合物，厚度为10至200nm的板状银颗粒和粘合剂树脂。 用于形成导电图案的组合物以基板上具有所需形状的图案印刷。 对印刷图案施加照射照射或微波加热，从而制造铜/银烧结体，以形成导电膜。

公开(公告)号：US20140239504A1

公开(公告)日：2014-08-28

申请号：US13779917

申请日：2013-02-28

Applicant: Hwei-Ling Yau ,  David Paul Trauernicht ,  John Andrew Lebens ,  Yongcai Wang ,  Ronald Steven Cok

Inventor： Hwei-Ling Yau ,  David Paul Trauernicht ,  John Andrew Lebens ,  Yongcai Wang ,  Ronald Steven Cok

IPC: H01L33/42

CPC classification number: G01N27/126 ,  G01N27/07 ,  G02F1/13439 ,  G06F3/044 ,  G06F2203/04103 ,  H05K3/0014 ,  H05K3/1258 ,  H05K2201/0108 ,  H05K2201/0112 ,  H05K2201/0257 ,  H05K2201/0269 ,  H05K2201/0272 ,  H05K2201/0338 ,  H05K2201/0376 ,  H05K2201/2054 ,  H05K2203/0108 ,  H05K2203/1131 ,  H05K2203/1476

Abstract: A multi-layer micro-wire structure includes a substrate having a surface. A plurality of micro-channels is formed in the substrate. A first material composition is located in a first layer only in each micro-channel and not on the substrate surface. A second material composition different from the first material composition is located in a second layer different from the first layer only in each micro-channel and not on the substrate surface. The first material composition in the first layer and the second material composition in the second layer form an electrically conductive multi-layer micro-wire in each micro-channel.

Abstract translation: 多层微线结构包括具有表面的基板。 在基板上形成多个微通道。 第一材料组合物仅位于每个微通道中的第一层中，而不位于基底表面上。 不同于第一材料组合物的第二材料组合物仅位于每个微通道而不是在基板表面上的不同于第一层的第二层中。 第一层中的第一材料组合物和第二层中的第二材料组合物在每个微通道中形成导电多层微线。

公开(公告)号：US08501299B2

公开(公告)日：2013-08-06

申请号：US12161848

申请日：2007-01-23

Applicant: Hatsuo Ikeda ,  Koji Ichikawa

Inventor： Hatsuo Ikeda ,  Koji Ichikawa

IPC: B32B3/24 ,  B32B5/16 ,  B32B37/24

CPC classification number: H05K1/092 ,  H05K3/4061 ,  H05K3/4611 ,  H05K3/4629 ,  H05K2201/0272 ,  Y10T428/24273 ,  Y10T428/24322 ,  Y10T428/24331 ,  Y10T428/24339 ,  Y10T428/24347 ,  Y10T428/24893 ,  Y10T428/24909

Abstract: A conductive paste comprising 88-94% by mass of Ag powder having an average particle size of 3 μm or less and 0.1-3% by mass of Pd powder, the total amount of the Ag powder and the Pd powder being 88.1-95% by mass. A multilayer ceramic substrate obtained by laminating and sintering pluralities of ceramic green sheets, and having conductor patterns and via-conductors inside, the via-conductors being formed in via-holes having diameters of 150 μm or less after sintering, containing Ag crystal particles having a particle size of 25 μm or more, and having a porosity of 10% or less.

Abstract translation: 一种包含平均粒径为3μm以下的Ag粉末88〜94质量％，Pd粉末为0.1〜3质量％的导电性糊剂，Ag粉末和Pd粉末的总量为88.1〜95质量％ 的质量。 一种多层陶瓷基板，其通过在多个陶瓷生片层叠并烧结多个陶瓷生片，并且在其内部具有导体图案和通孔导体，所述通孔导体形成在烧结后的直径为150μm以下的通孔中，所述通孔导体包含具有 粒径为25μm以上，孔隙率为10％以下。

公开(公告)号：US20130068513A1

公开(公告)日：2013-03-21

申请号：US13700999

申请日：2011-12-19

Applicant: Shogo Hirai ,  Tsuyoshi Himori ,  Hiroyuki Ishitomi ,  Takayuki Higuchi ,  Satoru Tomekawa ,  Yutaka Nakayama

Inventor： Shogo Hirai ,  Tsuyoshi Himori ,  Hiroyuki Ishitomi ,  Takayuki Higuchi ,  Satoru Tomekawa ,  Yutaka Nakayama

IPC: H01B1/02 ,  H05K3/10 ,  H05K1/09

CPC classification number: H01B1/02 ,  H05K1/09 ,  H05K1/095 ,  H05K3/10 ,  H05K3/4069 ,  H05K3/4652 ,  H05K2201/0272 ,  H05K2203/0425 ,  Y10T29/49155

Abstract: Disclosed is a multilayer wiring board having via-hole conductors, the via-hole conductor including a metal portion and a resin portion. The metal portion includes a first metal region which includes a link of copper particles forming a path electrically connecting a first wiring and a second wiring; a second metal region mainly composed of a metal selected from the group consisting of tin, a tin-copper alloy, and a tin-copper intermetallic compound; a third metal region mainly composed of bismuth; and a fourth metal region composed of tin-bismuth solder particles. The link has plane-to-plane contact portions where the copper particles are in plane-to-plane contact with one another. At least a part of the second metal region is in contact with the first metal region. The tin-bismuth solder particles, each surrounded by the resin portion, are interspersed in the via-hole conductor.

Abstract translation: 公开了一种具有通孔导体的多层布线板，该通孔导体包括金属部分和树脂部分。 金属部分包括第一金属区域，其包括形成电连接第一布线和第二布线的路径的铜颗粒的连接; 主要由选自锡，锡 - 铜合金和锡 - 铜金属间化合物的金属组成的第二金属区域; 主要由铋组成的第三金属区域; 以及由锡 - 铋焊料颗粒组成的第四金属区域。 该连接件具有平面至平面的接触部分，其中铜颗粒彼此面对面地接触。 第二金属区域的至少一部分与第一金属区域接触。 由树脂部分包围的锡 - 铋焊料颗粒散布在通孔导体中。

公开(公告)号：US20130008698A1

公开(公告)日：2013-01-10

申请号：US13636055

申请日：2011-12-06

Applicant: Tsuyoshi Himori ,  Shogo Hirai ,  Takayuki Higuchi ,  Satoru Tomekawa ,  Yutaka Nakayama

Inventor： Tsuyoshi Himori ,  Shogo Hirai ,  Takayuki Higuchi ,  Satoru Tomekawa ,  Yutaka Nakayama

IPC: H05K1/09 ,  B23K35/24 ,  H05K3/46

CPC classification number: H01B1/22 ,  H05K1/095 ,  H05K3/4069 ,  H05K3/4652 ,  H05K2201/0272 ,  H05K2203/0425

Abstract: A multilayer wiring board having via-hole conductors which electrically connects a plurality of wirings arranged in a manner such that an insulating resin layer is placed between the wirings, wherein: the via-hole conductors each include copper, tin, and bismuth, namely, a first metal region including a link of copper particles in plane-to-plane contact with one another, the link electrically connecting the wirings, a second metal region mainly composed of one or more of tin, a tin-copper alloy, and a tin-copper intermetallic compound, and a third metal region mainly composed of bismuth; at least a part of the second metal region is in contact with the surface of the copper particles, the surface excluding the area of the plane-to-plane contact portion of the link; and the Cu, Sn, and Bi in the metal portion are of a composition having a specific weight ratio (Cu:Sn:Bi).

Abstract translation: 一种多孔布线基板，其具有导通导体，该多孔布线基板以布线的方式电连接多个布线，使得绝缘树脂层位于布线之间，其中：所述通孔导体各自包括铜，锡和铋， 第一金属区域，包括铜颗粒彼此平面接触的连接部，所述连接部电连接布线，主要由锡，锡 - 铜合金和锡中的一种或多种构成的第二金属区域 - 金属间化合物和主要由铋组成的第三金属区域; 所述第二金属区域的至少一部分与所述铜粒子的表面接触，所述表面除了所述连接体的所述平面对接触部分的面积; 并且金属部分中的Cu，Sn和Bi具有比重（Cu：Sn：Bi）的组成。

公开(公告)号：US08221518B2

公开(公告)日：2012-07-17

申请号：US12751030

申请日：2010-03-31

Applicant: Catherine Shearer ,  Kenneth C. Holcomb ,  G. Delbert Friesen ,  Michael C. Matthews

Inventor： Catherine Shearer ,  Kenneth C. Holcomb ,  G. Delbert Friesen ,  Michael C. Matthews

IPC: B22F1/00 ,  B23K31/00

CPC classification number: B22F1/0003 ,  B22F1/0059 ,  B22F7/064 ,  H05K3/321 ,  H05K2201/0221 ,  H05K2201/0272

Abstract: The present invention provides electrically and thermally conductive compositions for forming interconnections between electronic elements. Invention compositions comprise three or more metal or metal alloy particle types and an organic vehicle comprising a flux that is application specific. The first particle type includes a reactive high melting point metal that reacts with a reactive low melting point metal(s) in the other particles to form intermetallic species. The reactive low melting point metal(s) of the invention are provided in two distinct particle forms. The first reactive low melting point metal particle includes a carrier that facilitates the reaction with the reactive high melting point metal. The second reactive low melting point metal particle acts primarily as a source of the reactive low melting point metal. Combination of the three particle types provides several advantages including reduction of the undesirable characteristics of the carrier metal while preserving and, in some embodiments, enhancing, the advantageous facilitation of the metallic reaction.

Abstract translation: 本发明提供用于形成电子元件之间的互连的导电和导热组合物。 本发明组合物包含三种或更多种金属或金属合金颗粒类型和包含特异性应用的助熔剂的有机载体。 第一颗粒型包括与其它颗粒中的反应性低熔点金属反应以形成金属间物质的反应性高熔点金属。 本发明的反应性低熔点金属以两种不同的颗粒形式提供。 第一反应性低熔点金属颗粒包括促进与反应性高熔点金属反应的载体。 第二反应性低熔点金属颗粒主要作为反应性低熔点金属的来源。 三种颗粒类型的组合提供了几个优点，包括减少载体金属的不期望的特性，同时保留并且在一些实施方案中增强对金属反应的有利促进。