公开(公告)号：US07198735B2

公开(公告)日：2007-04-03

申请号：US11060274

申请日：2005-02-17

Applicant: Thomas Aisenbrey

Inventor： Thomas Aisenbrey

IPC: H01B1/22 ,  D06N7/04 ,  G21F3/00

CPC classification number: H05K3/101 ,  B29C45/0001 ,  B29C45/0013 ,  B29K2995/0005 ,  B29L2031/3456 ,  H05K1/095 ,  H05K3/107 ,  H05K2201/0281 ,  H05K2201/09118 ,  H05K2203/0113 ,  Y10T428/24405

Abstract: Conductive roofing materials are formed of a conductive loaded resin-based material. The conductive loaded resin-based material comprises micron conductive powder(s), conductive fiber(s), or a combination of conductive powder and conductive fibers in a base resin host. The percentage by weight of the conductive powder(s), conductive fiber(s), or a combination thereof is between about 20% and 50% of the weight of the conductive loaded resin-based material. The micron conductive powders are formed from non-metals, such as carbon, graphite, that may also be metallic plated, or the like, or from metals such as stainless steel, nickel, copper, silver, that may also be metallic plated, or the like, or from a combination of non-metal, plated, or in combination with, metal powders. The micron conductor fibers preferably are of nickel plated carbon fiber, stainless steel fiber, copper fiber, silver fiber, aluminum fiber, or the like.

Abstract translation: 导电屋顶材料由导电负载的树脂基材料形成。 导电负载树脂基材料在基础树脂主体中包括微米导电粉末，导电纤维或导电粉末和导电纤维的组合。 导电粉末，导电纤维或其组合的重量百分数为导电负载树脂基材料重量的约20％至50％。 微米导电粉末由非金属形成，例如碳，石墨，也可以是金属电镀等，或由金属，如不锈钢，镍，铜，银，也可以是金属镀，或 或者由非金属，电镀或与金属粉末组合的组合。 微米导体纤维优选为镀镍碳纤维，不锈钢纤维，铜纤维，银纤维，铝纤维等。

公开(公告)号：US07171746B2

公开(公告)日：2007-02-06

申请号：US10758715

申请日：2004-01-16

Applicant: Frank Reil ,  Stefan Diel

Inventor： Frank Reil ,  Stefan Diel

IPC: H01K3/22

CPC classification number: H05K1/0373 ,  H05K3/027 ,  H05K3/04 ,  H05K3/043 ,  H05K2201/0116 ,  H05K2201/0215 ,  H05K2201/0281 ,  H05K2201/0323 ,  H05K2203/025 ,  H05K2203/0746 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49158 ,  Y10T29/49163

Abstract: A process is described in which surfaces of foamed plastics are provided with electrical conductor tracks, with the aid of selectively ablating processes.The process permits low-cost production of moldings from plastic with conductor tracks integrated on the surface.The products of the process may be used in the electrical and electronics industries, for example.

Abstract translation: 描述了一种方法，其中泡沫塑料的表面设置有电导体轨迹，借助于选择性的烧蚀过程。 该工艺允许从导体轨迹集成在表面上的塑料模制品的低成本生产。 例如，该工艺的产品可用于电气和电子工业。

公开(公告)号：US07144830B2

公开(公告)日：2006-12-05

申请号：US10431763

申请日：2003-05-08

Applicant: Ian Gregory Hill ,  Seth Trotz ,  George Herbert Needham Riddle ,  David Stuart Brookstein ,  Muthu Govindaraj

Inventor： Ian Gregory Hill ,  Seth Trotz ,  George Herbert Needham Riddle ,  David Stuart Brookstein ,  Muthu Govindaraj

IPC: D03D11/00

CPC classification number: D03D11/00 ,  D03D1/0088 ,  D03D13/006 ,  D10B2401/16 ,  H01H2203/0085 ,  H05K1/038 ,  H05K1/141 ,  H05K1/189 ,  H05K2201/0278 ,  H05K2201/0281 ,  H05K2201/029 ,  H05K2201/10106 ,  Y10T442/2475 ,  Y10T442/30 ,  Y10T442/3195 ,  Y10T442/3203 ,  Y10T442/3211 ,  Y10T442/3472 ,  Y10T442/3976

Abstract: A woven article having plural weave layers comprises a plurality of electrically insulating and/or electrically conductive yarn in the warp and a plurality of electrically insulating and/or electrically conductive yarn in the weft interwoven with the yarn in the warp. An electrical function is provided by one or more circuit carriers disposed in cavities in the plural layer woven article and/or one or more functional yarn in the warp and/or the weft, wherein the circuit carrier and/or functional yarn include an electrical contact for connecting to the electrically conductive yarn in the warp and/or weft.

公开(公告)号：US20060254811A1

公开(公告)日：2006-11-16

申请号：US11432093

申请日：2006-05-11

Applicant: Tunde Kirstein ,  Ivo Locher ,  Christoph Maurer

Inventor： Tunde Kirstein ,  Ivo Locher ,  Christoph Maurer

IPC: H05K1/09 ,  H05K1/03

CPC classification number: H05K1/038 ,  H05K1/0289 ,  H05K1/0393 ,  H05K2201/0281 ,  H05K2201/029

Abstract: The invention relates to a circuit board and a method for its production. The highly flexible circuit board includes electrically non-conductive threads and electrically conductive threads. These threads form a fabric with a regular mesh structure. In the latter at least electrically conductive threads are used as warp threads and weft threads.

公开(公告)号：US20060231198A1

公开(公告)日：2006-10-19

申请号：US11376806

申请日：2006-03-15

Applicant: Kalu Vasoya

Inventor： Kalu Vasoya

IPC: B32B37/00

CPC classification number: H05K3/4641 ,  H05K1/0269 ,  H05K3/0008 ,  H05K3/0047 ,  H05K3/0082 ,  H05K3/064 ,  H05K3/4638 ,  H05K2201/0281 ,  H05K2201/029 ,  H05K2201/0323 ,  H05K2201/068 ,  H05K2201/09063 ,  H05K2201/0969 ,  H05K2201/09718 ,  H05K2203/056 ,  H05K2203/166 ,  H05K2203/167 ,  Y10T156/1062

Abstract: Processes for manufacturing printed wiring boards including electrically conductive constraining cores are disclosed. Several of the processes enable precise alignment of tooling holes used by tools to perform processes with respect to various panels and subassemblies used to form finished printed wiring boards. Modifications to Gerber files that can increase manufacturing yield and provide the ability to detect faulty printed wiring boards in a panelized array of printed wiring boards are also discussed. One embodiment of the invention includes aligning the weave of a woven panel of electrically conductive material relative to a tool surface using at least a pair of references and forming tooling holes in the panel of electrically conductive material.

Abstract translation: 公开了用于制造包括导电约束芯的印刷线路板的工艺。 几个过程使得工具使用的工具孔能够精确地对准用于对用于形成成品印刷线路板的各种面板和子组件进行处理。 还讨论了对Gerber文件的修改，其可以提高制造产量并且提供检测印刷线路板的面板阵列中的有缺陷的印刷线路板的能力。 本发明的一个实施例包括使用至少一对参考物并使导电材料面板中的工具孔对准编织的导电材料编织板相对于工具表面的织物。

公开(公告)号：US07097788B2

公开(公告)日：2006-08-29

申请号：US10610363

申请日：2003-06-30

Applicant: Ewa Stanislawa Kirkor ,  April Dawn Schricker ,  Alexander Scheeline

Inventor： Ewa Stanislawa Kirkor ,  April Dawn Schricker ,  Alexander Scheeline

IPC: H01B1/24

CPC classification number: B82Y30/00 ,  B82Y10/00 ,  C09D11/30 ,  C09D11/52 ,  C12Q1/004 ,  H05K1/095 ,  H05K3/12 ,  H05K2201/0281 ,  H05K2201/0323 ,  H05K2201/0329 ,  H05K2203/0271 ,  H05K2203/105

Abstract: A method of increasing conductivity of an ink, comprises orienting particles in the ink. The ink comprises the particles and solvent, and the particles are conductive anisotropic particles.

Abstract translation: 提高墨水导电性的方法包括使墨中的颗粒定向。 油墨包括颗粒和溶剂，并且颗粒是导电各向异性颗粒。

公开(公告)号：US20050230867A1

公开(公告)日：2005-10-20

申请号：US11148064

申请日：2005-06-08

Applicant: Thomas Aisenbrey

Inventor： Thomas Aisenbrey

IPC: A47B81/06 ,  B29C45/00 ,  H01B1/22 ,  H01B1/24 ,  H01C1/00 ,  H01Q1/32

CPC classification number: B29C45/0013 ,  B29C45/0001 ,  B29K2995/0005 ,  B29L2031/3456 ,  G06K19/07749 ,  H01B1/22 ,  H01B1/24 ,  H01Q1/1271 ,  H01Q1/3291 ,  H01Q1/36 ,  H01Q1/38 ,  H01Q1/40 ,  H01Q9/0407 ,  H01Q9/16 ,  H01Q9/30 ,  H05K1/095 ,  H05K3/101 ,  H05K3/107 ,  H05K2201/0281 ,  H05K2201/09118 ,  H05K2203/0113

Abstract: Vehicle electrical and electronic components are formed of a conductive loaded resin-based material. The conductive loaded resin-based material comprises micron conductive powder(s), conductive fiber(s), or a combination of conductive powder and conductive fibers in a base resin host. The percentage by weight of the conductive powder(s), conductive fiber(s), or a combination thereof is between about 20% and 50% of the weight of the conductive loaded resin-based material. The micron conductive powders are metals or conductive non-metals or metal plated non-metals. The micron conductive fibers may be metal fiber or metal plated fiber. Further, the metal plated fiber may be formed by plating metal onto a metal fiber or by plating metal onto a non-metal fiber. Any platable fiber may be used as the core for a non-metal fiber. Superconductor metals may also be used as micron conductive fibers and/or as metal plating onto fibers in the present invention.

公开(公告)号：US20050208251A1

公开(公告)日：2005-09-22

申请号：US11083467

申请日：2005-03-18

Applicant: Thomas Aisenbrey

Inventor： Thomas Aisenbrey

IPC: B29C45/00 ,  G06K19/077 ,  H01Q1/12 ,  H01Q1/24 ,  H01Q1/32 ,  H01Q1/36 ,  H01Q1/38 ,  H01Q1/40 ,  H01Q9/04 ,  H01Q9/16 ,  H01Q9/30 ,  H01Q21/00 ,  H05K1/09 ,  H05K3/10 ,  B32B9/00

CPC classification number: H05K3/101 ,  B29C45/0001 ,  B29C45/0013 ,  B29K2995/0005 ,  B29L2031/3456 ,  G06K19/07749 ,  H05K1/095 ,  H05K3/107 ,  H05K2201/0281 ,  H05K2201/09118 ,  H05K2203/0113 ,  Y10T428/14

Abstract: Electrically conductive tapes and films are formed of a conductive loaded resin-based material. The conductive loaded resin-based material comprises micron conductive powder(s), conductive fiber(s), or a combination of conductive powder and conductive fibers in a base resin host. The percentage by weight of the conductive powder(s), conductive fiber(s), or a combination thereof is between about 20% and 50% of the weight of the conductive loaded resin-based material. The micron conductive powders are formed from non-metals, such as carbon, graphite, that may also be metallic plated, or the like, or from metals such as stainless steel, nickel, copper, silver, that may also be metallic plated, or the like, or from a combination of non-metal, plated, or in combination with, metal powders. The micron conductor fibers preferably are of nickel plated carbon fiber, stainless steel fiber, copper fiber, silver fiber, aluminum fiber, or the like.

Abstract translation: 导电带和膜由导电负载的树脂基材料形成。 导电负载的树脂基材料包括微米导电粉末，导电纤维或基础树脂主体中的导电粉末和导电纤维的组合。 导电粉末，导电纤维或其组合的重量百分数为导电负载树脂基材料重量的约20％至50％。 微米导电粉末由非金属形成，例如碳，石墨，也可以是金属电镀等，或由金属，如不锈钢，镍，铜，银，也可以是金属镀，或 或者由非金属，电镀或与金属粉末组合的组合。 微米导体纤维优选为镀镍碳纤维，不锈钢纤维，铜纤维，银纤维，铝纤维等。

公开(公告)号：US20050206491A1

公开(公告)日：2005-09-22

申请号：US11121362

申请日：2005-05-04

Applicant: Thomas Aisenbrey

Inventor： Thomas Aisenbrey

IPC: H01H85/02 ,  H01H85/06 ,  H01H85/143

CPC classification number: H01H85/06 ,  B29C45/0001 ,  B29C45/0013 ,  B29K2995/0005 ,  B29L2031/3456 ,  G06K19/07749 ,  H01H85/0417 ,  H01Q1/1271 ,  H01Q1/36 ,  H01Q1/38 ,  H01Q1/40 ,  H01Q9/0407 ,  H01Q9/16 ,  H01Q9/30 ,  H05K1/095 ,  H05K3/101 ,  H05K3/107 ,  H05K2201/0281 ,  H05K2201/09118 ,  H05K2203/0113

Abstract: Electrical fuse devices are formed of a conductive loaded resin-based material. The conductive loaded resin-based material comprises micron conductive powder(s), conductive fiber(s), or a combination of conductive powder and conductive fibers in a base resin host. The percentage by weight of the conductive powder(s), conductive fiber(s), or a combination thereof is between about 20% and 50% of the weight of the conductive loaded resin-based material. The micron conductive powders are formed from non-metals, such as carbon, graphite, that may also be metallic plated, or the like, or from metals such as stainless steel, nickel, copper, silver, that may also be metallic plated, or the like, or from a combination of non-metal, plated, or in combination with, metal powders. The micron conductor fibers preferably are of nickel plated carbon fiber, stainless steel fiber, copper fiber, silver fiber, aluminum fiber, or the like.

Abstract translation: 电熔丝装置由导电负载的树脂基材料形成。 导电负载树脂基材料在基础树脂主体中包括微米导电粉末，导电纤维或导电粉末和导电纤维的组合。 导电粉末，导电纤维或其组合的重量百分数为导电负载树脂基材料重量的约20％至50％。 微米导电粉末由非金属形成，例如碳，石墨，也可以是金属电镀等，或由金属，如不锈钢，镍，铜，银，也可以是金属镀，或 或者由非金属，电镀或与金属粉末组合的组合。 微米导体纤维优选为镀镍碳纤维，不锈钢纤维，铜纤维，银纤维，铝纤维等。

公开(公告)号：US20050206028A1

公开(公告)日：2005-09-22

申请号：US11127573

申请日：2005-05-12

Applicant: Thomas Aisenbrey

Inventor： Thomas Aisenbrey

IPC: B27N3/00 ,  B32B3/26 ,  B32B5/02 ,  B32B27/04 ,  B32B27/12 ,  E04F13/18 ,  E04F15/10 ,  H01L21/44

CPC classification number: E04F13/18 ,  B29C45/0001 ,  B29C45/0013 ,  B29K2995/0005 ,  B29L2031/3456 ,  E04F15/10 ,  E04F2290/048 ,  G06K19/07749 ,  H01Q1/1271 ,  H01Q1/36 ,  H01Q1/38 ,  H01Q1/40 ,  H01Q9/0407 ,  H01Q9/16 ,  H01Q9/30 ,  H05K1/095 ,  H05K3/101 ,  H05K3/107 ,  H05K2201/0281 ,  H05K2201/09118 ,  H05K2203/0113

Abstract: Electrically conductive flooring is formed of a conductive loaded resin-based material. The conductive loaded resin-based material comprises micron conductive powder(s), conductive fiber(s), or a combination of conductive powder and conductive fibers in a base resin host. The percentage by weight of the conductive powder(s), conductive fiber(s), or a combination thereof is between about 20% and 50% of the weight of the conductive loaded resin-based material. The micron conductive powders are metals or conductive non-metals or metal plated non-metals. The micron conductive fibers may be metal fiber or metal plated fiber. Further, the metal plated fiber may be formed by plating metal onto a metal fiber or by plating metal onto a non-metal fiber. Any platable fiber may be used as the core for a non-metal fiber. Superconductor metals may also be used as micron conductive fibers and/or as metal plating onto fibers in the present invention.