公开(公告)号：US4833568A

公开(公告)日：1989-05-23

申请号：US150227

申请日：1988-01-29

Applicant: G. Mark Berhold

Inventor： G. Mark Berhold

IPC: H01R12/24 ,  H01L23/52 ,  H01L25/00 ,  H01R12/04 ,  H05K1/02 ,  H05K1/18 ,  H05K3/34 ,  H05K7/02

CPC classification number: H05K1/189 ,  H05K7/023 ,  H05K2201/046 ,  H05K2201/09018 ,  H05K2201/09418 ,  H05K2201/10515 ,  H05K3/3447

Abstract: A plurality of plate-like circuit component carrier packages having the same size and shape are stacked adjacent one to another with the flat faces thereof in contact to form a carrier package assembly in the form of a prismatic or cylindrically solid. Each carrier package houses one or more electrical circuit components and is provided at portions of the flat faces thereof with electrical contacts which cooperate with similarly located contacts on the flat faces of adjacent carrier packages to electrically interconnect the circuit components. The electrical contacts may take the form of a cooperating system of pins and apertures, serving also to align adjacent carrier packages. The carrier package assembly is useable in cooperation with a flexible, printed circuit board having on one side thereof an array of contact sites selectively interconnected by printed routing traces. Electrical contacts on the peripheral surfaces of the carrier packages are coupled with the circuit components housed therein and engage the contact sites on the circuit board when it is wrapped around the carrier package assembly. The ends of the carrier package assembly are fitted with connector blocks of a convenient shape which serve to support the carrier package assembly and to interconnect the electrical components therein with others exterior thereto. Several types of circuit boards and a variety of carrier package shapes are disclosed.

Abstract translation: 具有相同尺寸和形状的多个板状电路部件载体封装彼此相邻堆叠，其平坦表面接触形成棱柱形或圆柱形固体形式的载体封装组件。 每个载体封装容纳一个或多个电路部件，并且在其平坦表面的部分处设置有电触点，电触点与相邻载体封装的平坦表面上类似定位的触点配合以电连接电路部件。 电触点可以采取销和孔的配合系统的形式，也用于对准相邻的载体封装。 载体封装组件可与柔性印刷电路板协同工作，该电路板的一侧上具有通过印刷布线迹线选择性互连的接触位置阵列。 载体封装的外围表面上的电触点与容纳在其中的电路部件耦合，并且当电路板缠绕在载体封装组件上时与电路板上的接触部位接合。 载体包装组件的端部装配有方便形状的连接器块，其用于支撑载体包装组件并将其中的电气部件与外部的电气部件互连。 公开了几种类型的电路板和各种载体封装形状。

公开(公告)号：US3427715A

公开(公告)日：1969-02-18

申请号：US3427715D

申请日：1966-06-13

Applicant: MOTOROLA INC

Inventor： MIKA ABRAHAM

IPC: H05K1/00 ,  H05K1/18 ,  H05K3/00 ,  H05K3/06 ,  H05K3/34 ,  H05K3/30 ,  H02B1/04 ,  H05K1/16

CPC classification number: H05K1/0278 ,  H05K1/189 ,  H05K3/0014 ,  H05K3/06 ,  H05K3/3447 ,  H05K3/3468 ,  H05K2201/0129 ,  H05K2201/046 ,  H05K2201/057 ,  H05K2201/09036 ,  H05K2201/0999 ,  H05K2203/1105 ,  H05K2203/302 ,  Y10T29/4913 ,  Y10T29/49155 ,  Y10T156/1026