中科微点-全球专利检索

  1. Login
  2. Sign Up

Search Results

792 records (took 0.03 seconds)

    Noise shield type multi-layered substrate
    101.
    发明授权
    Noise shield type multi-layered substrate 失效
    隔音型多层基板

    公开(公告)号：US07023073B2

    公开(公告)日：2006-04-04

    申请号：US10447347

    申请日：2003-05-28

    Applicant: Yasuhiko Mano

    Inventor： Yasuhiko Mano

    IPC: H04L23/552 ,  H01Q11/10

    CPC classification number: H01L23/552 ,  H01L21/4857 ,  H01L23/49822 ,  H01L2224/16225 ,  H01L2924/00014 ,  H01L2924/15311 ,  H01L2924/1617 ,  H01L2924/19105 ,  H01L2924/3011 ,  H05K1/0233 ,  H05K2201/086 ,  H01L2224/0401

    Abstract: Disclosed is a noise shield type multi-layered substrate which is advantageous in terms of shielding leaked magnetic flux and cross-talk by disposing a magnetic material onto at least one of circuit patterns, passive components and active components, thus blocking noise generated from the circuit patterns, passive components and active components. Thus, malfunctions of neighboring circuit patterns and various parts due to leaked magnetic flux are prevented. A method of manufacturing the noise shield type multi-layered substrate is also provided.

    Abstract translation: 公开了一种噪声屏蔽型多层基板，其通过将磁性材料设置在电路图案，无源部件和有源部件中的至少一个上而有效地屏蔽泄漏的磁通量和串扰，从而阻止从电路产生的噪声 图案，无源元件和有源元件。 因此，防止由于泄漏的磁通而导致的相邻电路图案和各种部件的故障。 还提供了制造噪声屏蔽型多层基板的方法。

    Low noise full integrated multilayers magnetic for power converters
    103.
    发明授权
    Low noise full integrated multilayers magnetic for power converters 有权
    低噪声全集成多层电磁转换器

    公开(公告)号：US06980074B1

    公开(公告)日：2005-12-27

    申请号：US09434985

    申请日：1999-11-05

    Applicant: Ionel Jitaru

    Inventor： Ionel Jitaru

    IPC: H01F27/28 ,  H05K1/00 ,  H05K1/16 ,  H01F5/00

    CPC classification number: H05K1/165 ,  H01F27/2804 ,  H05K1/0298 ,  H05K2201/086 ,  H05K2201/09063 ,  H05K2201/10166

    Abstract: A multilayer structure in which all the magnetic elements have the windings edged in the inner layers and the magnetic core which surrounds the winding has the legs penetrating through the multilayer structure. The interconnection between the magnetic elements and the rest of electronic components is done through the layers of the multilayer board, horizontally and vertically through via. For higher power components special cuts are performed in the multilayer board to accommodate the body of the components which may be connected to an external heatsink. The winding arrangement in the transformer is done in a such way to minimize and even eliminate the common mode noise injected through the capacitance between primary and secondary winding. The input filter is constructed to exhibit a differential and a common mode impedance. Supplementary capacitors are incorporated in the multilayers structure to offer a low impedance to the noise to short it to the source, or for injecting currents of opposite polarity to cancel the common mode current transferred through the transformer's inter winding capacitance and through the parasitic capacitance of the switching elements to the secondary. The insulation between winding can be in accordance with the safety agency requirements, allowing much shorter creapage distances inside of the multilayer PCB structure than in the air due to the compliance with coating environment.

    Abstract translation: 其中所有磁性元件具有在内层中缠绕的绕组和围绕绕组的磁芯的多层结构具有贯穿多层结构的脚。 磁性元件和其余电子部件之间的互连通过多层板的层，通过通孔水平和垂直地完成。 对于较高功率组件，在多层板中执行特殊切割以容纳可连接到外部散热器的部件的主体。 变压器中的绕组布置以最小化甚至消除通过初级绕组和次级绕组之间的电容注入的共模噪声的方式完成。 输入滤波器被构造为呈现差分和共模阻抗。 辅助电容器被并入多层结构中，以提供低噪声阻抗以将其短路到源极，或者用于注入相反极性的电流以消除通过变压器的互绕电容传输的共模电流，并通过变压器的互绕电容 开关元件到次级。 绕组之间的绝缘可以根据安全机构的要求，由于符合涂层环境，允许多层PCB结构内的折叠距离比空气中短。

    Module incorporating a capacitor, method for manufacturing the same, and capacitor used therefor
    106.
    发明申请
    Module incorporating a capacitor, method for manufacturing the same, and capacitor used therefor 有权
    包含电容器的模块及其制造方法以及用于其的电容器

    公开(公告)号：US20050073818A1

    公开(公告)日：2005-04-07

    申请号：US10944311

    申请日：2004-09-17

    Applicant: Koichi Hirano ,  Tsunenori Yoshida ,  Seiichi Nakatani

    Inventor： Koichi Hirano ,  Tsunenori Yoshida ,  Seiichi Nakatani

    IPC: H01G4/40 ,  H05K1/16 ,  H05K1/18 ,  H05K3/46 ,  H05K7/06 ,  H05K1/11 ,  H05K3/30

    CPC classification number: H05K1/186 ,  H01G4/40 ,  H05K1/165 ,  H05K3/4614 ,  H05K2201/086 ,  H05K2201/10015 ,  H05K2201/10636 ,  Y02P70/611 ,  Y10T29/4913 ,  Y10T29/49155

    Abstract: A module incorporating a capacitor, the module including a circuit board and a layer incorporating a capacitor, wherein the circuit board includes a wiring layer and a via contact for providing electrical conductivity to a cathode and an anode of the capacitor. The layer incorporating the capacitor includes a ferromagnetic layer integrated with at least a portion of a surface of the capacitor, and in the circuit board or the layer incorporating the capacitor, a coil is wound around the capacitor, or an inductor component is disposed in parallel with the capacitor. Accordingly, a module incorporating a capacitor in which miniaturization, a higher density and a reduced thickness have been achieved, as well as a method for producing the module and a capacitor used for the module, are provided.

    Abstract translation: 一种包含电容器的模块，所述模块包括电路板和包含电容器的层，其中所述电路板包括用于向所述电容器的阴极和阳极提供导电性的布线层和通孔接触。 包含电容器的层包括与电容器的表面的至少一部分集成的铁磁层，并且在电路板或包含电容器的层中，线圈缠绕在电容器周围，或者电感器部件并联设置 与电容器。 因此，提供了一种包括其中实现了小型化，更高密度和更小厚度的电容器的模块以及用于该模块的模块和电容器的制造方法。

    Switching power supply
    107.
    发明申请
    Switching power supply 失效
    开关电源

    公开(公告)号：US20050052888A1

    公开(公告)日：2005-03-10

    申请号：US10922230

    申请日：2004-08-20

    Applicant: Yoshihiro Takeshima ,  Koji Yoshida ,  Satoshi Ikeda ,  Mitsuhiro Matsuo

    Inventor： Yoshihiro Takeshima ,  Koji Yoshida ,  Satoshi Ikeda ,  Mitsuhiro Matsuo

    IPC: H02M7/00 ,  H05K1/00 ,  H05K1/14 ,  H05K1/16 ,  H05K3/20 ,  H02M3/24

    CPC classification number: H02M7/003 ,  H05K1/0298 ,  H05K1/141 ,  H05K1/144 ,  H05K1/165 ,  H05K3/202 ,  H05K2201/086 ,  H05K2201/09063

    Abstract: A switching power supply device of the invention includes: a switching circuit for interrupting direct current to generate a pulse voltage; a transformer including a primary winding, a secondary winding, and a core for magnetically coupling the primary winding and the secondary winding; a multi-layer wiring board having wiring lines constituting the primary winding and the secondary winding; a rectifier circuit for rectifying an alternating current; a smoothing circuit for suppressing ripple; and a control circuit for controlling an output voltage from the smoothing circuit. The multi-layer wiring board is provided with at least the switching circuit and the rectifier circuit and is arranged on a main wiring board, and the control circuit is arranged on the main wiring board.

    Abstract translation: 本发明的开关电源装置包括：用于中断直流以产生脉冲电压的开关电路; 包括初级绕组，次级绕组和用于磁耦合初级绕组和次级绕组的磁芯的变压器; 具有构成初级绕组和次级绕组的布线的多层布线板; 用于整流交流电流的整流电路; 用于抑制纹波的平滑电路; 以及用于控制来自平滑电路的输出电压的控制电路。 多层布线板至少设置有开关电路和整流电路，并且布置在主布线板上，并且控制电路布置在主布线板上。

    Power supply packaging system
    108.
    发明申请
    Power supply packaging system 有权
    电源包装系统

    公开(公告)号：US20050024838A1

    公开(公告)日：2005-02-03

    申请号：US10925792

    申请日：2004-08-24

    Applicant: John Maxwell

    Inventor： John Maxwell

    IPC: H01L23/538 ,  H01L25/11 ,  H05K1/02 ,  H05K1/14 ,  H05K1/16 ,  H05K7/06 ,  H05K7/20

    CPC classification number: H01L23/5385 ,  H01L25/115 ,  H01L2224/16225 ,  H01L2224/73253 ,  H01L2924/1305 ,  H05K1/0203 ,  H05K1/145 ,  H05K1/165 ,  H05K2201/086 ,  H05K2201/09063 ,  H05K2201/1056 ,  H05K2201/10674 ,  H01L2924/00

    Abstract: A packaging system for a high current, low voltage power supply. The power supply uses bare die power FETs which are directly mounted to a thermally conductive substrate by a solder attachment made to the drain electrode metallization on the back side of the FETs. The source electrode and gate electrode of each FET are coupled to the circuitry on an overhanging printed circuit board, using CSP solder balls affixed to the front side of the FET die. The heat generated by the FETs is effectively dissipated by the close coupling of the FETs to the thermally conductive underlying substrate. High interconnect densities are achieved through the use of a multilayer printed circuit board. This high interconnect density, with the addition of a magnetic core element, allows the power supply packaging system to incorporate transformer windings for an isolation transformer or an inductor.

    Abstract translation: 用于大电流，低压电源的封装系统。 电源使用裸芯片功率FET，其通过在FET的背面上与漏电极金属化形成的焊接附件直接安装到导热基板。 每个FET的源电极和栅极电极使用固定在FET裸片正面的CSP焊球与偶数印刷电路板上的电路相连。 由FET产生的热量通过FET与导热底层基板的紧密耦合而被有效消散。 通过使用多层印刷电路板实现高互连密度。 这种高互连密度，通过添加磁芯元件，允许电源封装系统将用于隔离变压器或电感器的变压器绕组。

Patent Agency Ranking