Abstract:
A method for forming a film pattern, comprises: disposing a first bank forming material to a substrate so as to form a first bank layer; disposing a second bank forming material on the first bank layer so as to form a second bank layer; and pattering the first bank layer and the second bank layer so as to form a bank including a pattern forming region having a first pattern forming region and a second pattern forming region, the second pattern forming region having a width larger than a width of the first pattern forming region, and being continuously formed from the first pattern forming region, wherein the first bank layer has a sidewall facing the pattern forming region and a first contact angle of less than 50 degrees with respect to a functional liquid containing H2O on the sidewall, and the second bank layer has a second contact angle larger than the first contact angle with respect to the functional liquid.
Abstract:
A flex circuit comprises a base film, a first adhesive layer coupled with the base film, at least two signal traces coupled with the first adhesive layer, and at least one dummy trace positioned between the two signal traces and coupled with the first adhesive layer. The flex circuit comprises a second adhesive layer coupled with the signal traces, the dummy trace, and the first adhesive layer, and a cover film coupled with the second adhesive layer.
Abstract:
A flexible circuit board uses a specific structure to alleviate mechanical stress thereof. The flexible circuit board has a flexible film, a plurality of inner leads, a plurality of outer leads, and a plurality of connection portion. Each of the connection portions a corresponding one of the inner leads with a corresponding one of the outer leads. A first width of the inner leads is greater than a second width of the outer leads. Due to rounded concave sections and rounded convex sections of the connection portions, if the flexible circuit board is bent, the mechanical stress around corners of joint portions of the connection portions with the inner leads and the outer leads could be alleviated.
Abstract:
An obfuscated radio frequency circuit may include a metallization layer, and a dielectric layer under the metallization layer. The dielectric layer may be made up of a plurality of dielectric substrates having differing dielectric constants to obfuscate functions of the circuit.
Abstract:
A metal pattern for a high frequency signal is patterned on a flexile substrate, and the flexile substrate is bent in such a way as to form a substantially right angle at a spot corresponding to an end of the metal pattern for the signal. And an end of the metal pattern is fixedly attached to a lead pin for signaling, attached to a stem, for electrical continuity, so as to be in a posture horizontal with each other. Meanwhile, a part of the lead pins attached to the stem, being in such a state as penetrated through respective holes provided in the flexible substrate, is fixedly attached to a part of metal patterns provided on the flexible substrate so as to ensure electrical continuity therebetween.
Abstract:
A TAB tape for a tape carrier package may have at least one opening formed in a connection portion. The at least one opening may be provided in the connection portion and a portion of the corresponding second lead. The at least one opening may be arranged near a boundary between the corresponding first lead and the connection portion. The at least one opening may be sized to reduce the change of the lead width from the first lead to the second lead.
Abstract:
Integrated circuit transmission lines are designed to match elements at opposing ends of the transmission line over a frequency range of interest. By modifying characteristics of the transmission line over the length of the transmission line, from a first end coupled to a first external element to a second end coupled to a second external element, return loss is improved. In various embodiments one or more of the width of the conductors and the distance between adjacent edges of the conductors are modified across the length of the transmission line. In an alternative embodiment, the conductors of the transmission line are segmented with each segment having a length and a width across the segment.
Abstract:
An array substrate for a liquid crystal display device includes a substrate including a display area and a non-display area, the non-display area having a link area and a pad area, array elements in the display area on the substrate, first to nth pads in the pad area (n is a natural number), first to nth link lines in the link area and connected to the first to nth pads, respectively, wherein the first to (n/2−1)th link lines are symmetrical with the nth to (n/2+1)th link lines with respect to (n/2)th link line, the first to (n/2−1)th link lines have inclined portions, and the inclined portions of the first to kth link lines have decreasing widths and decreasing lengths toward the kth link line from the first link line, wherein k is larger than 1 and smaller than (n/2).
Abstract:
An integrated circuit package having a multi-segment transmission line transformer for impedance matching a packaged integrated circuit, such as a driver or receiver, to a printed circuit board (PCB) transmission line to which the packaged chip is attached by, for example, solder balls. In one exemplary embodiment, a three-segment transmission line transformer provides improved broadband performance with the advantage of having a middle segment with a flexible length for easier routing. The length of each end segment of the three-segment transformer is adjusted to provide at least partial cancellation of reflections between the PCB and the transformer, and between the transformer and a circuit on the integrated circuit, respectively. Further, the inductive reactance of the solder balls and via wiring may be cancelled out by the transformed chip impedance to provide a non-inductive termination to the PCB transmission line at approximately one-half the highest data rate of the channel.
Abstract:
A motherboard includes a printed circuit board (10), and at least a power/ground trace (20) formed on the printed circuit board. The trace includes a pair of main lines (14, 24) and at least a protection line (12, 22) connected between the main lines. A width of the main lines is constant and wider than of the protection line. Wherein when a current flowing through the power/ground trace exceeds a maximum current the protection line can endure, the protection line is burnt and disconnected from the main lines, thereby generating less smoke and protecting components connected with the trace of the motherboard from damage due to excess current.