公开(公告)号：US20100206621A1

公开(公告)日：2010-08-19

申请号：US12680979

申请日：2008-10-06

Applicant: Yoshiyuki Wada

Inventor： Yoshiyuki Wada

IPC: H05K1/02 ,  B23K37/00

CPC classification number: H05K1/186 ,  H01L2224/16225 ,  H01L2924/00011 ,  H01L2924/00014 ,  H05K3/3436 ,  H05K3/3452 ,  H05K3/4652 ,  H05K2201/10674 ,  H05K2201/10977 ,  Y10T29/41 ,  Y10T29/49 ,  Y10T29/49002 ,  Y10T29/49117 ,  Y10T29/4913 ,  Y10T29/49146 ,  H01L2224/0401

Abstract: A wiring board with a built-in component includes an insulating board, a first wiring pattern on an upper surface of the insulating board, plural electrodes on the upper surface of the insulating board, a solder resist on the upper surface of the insulating board, plural solders on the electrodes, respectively, an electronic component joined to the electrodes with the solders, a sealing resin provided between the insulating board and the electronic component, a component-fixing layer provided on the upper surface of the insulating board and the first wiring pattern and having an insulating property, a second wiring pattern on the component-fixing layer, and an interlayer wiring connecting the first wiring pattern to the second wiring pattern. The solder resist surrounds the electrodes. The sealing resin entirely covers the solders and the solder resist. This wiring board can be efficiently manufactured by simple processes.

Abstract translation: 具有内置部件的布线板包括绝缘板，绝缘板的上表面上的第一布线图案，绝缘板的上表面上的多个电极，绝缘板的上表面上的阻焊剂， 电极上的多个焊料分别是与焊料接合到电极的电子部件，设置在绝缘板和电子部件之间的密封树脂，设置在绝缘板的上表面上的部件固定层和第一布线 图案并且具有绝缘性能，在部件固定层上的第二布线图案和将第一布线图案连接到第二布线图案的层间布线。 阻焊剂包围电极。 密封树脂完全覆盖焊料和阻焊剂。 该接线板可以通过简单的工艺有效地制造。

公开(公告)号：US07771559B2

公开(公告)日：2010-08-10

申请号：US11494709

申请日：2006-07-28

Applicant: Isao Tsukagoshi ,  Yasushi Gotou ,  Masami Yusa ,  Yasuo Miyadera

Inventor： Isao Tsukagoshi ,  Yasushi Gotou ,  Masami Yusa ,  Yasuo Miyadera

IPC: C09J5/00

CPC classification number: H05K3/323 ,  B32B7/12 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/83851 ,  H05K3/305 ,  H05K3/321 ,  H05K3/325 ,  H05K2201/0329 ,  H05K2201/10977 ,  H05K2203/0278 ,  H05K2203/1189 ,  Y10T428/12569 ,  Y10T428/2852 ,  Y10T428/287 ,  Y10T428/2891

Abstract: The present invention relates to a method for connecting electrodes comprising: interposing the polyphthalide represented by the formula (I): wherein R represents a divalent aromatic hydrocarbon group or a divalent heteroring-containing aromatic group, R1 represents an alkyl group, a fluorinated alkyl group, an alkoxy group or a halogen atom, where the number of R1 is 0 to 4, X represents O or N—R3, provided that R3 represents one of the following groups, Y represents SO2 or Co and n represents a number of repeating units in the polymer, as a pressure-sensitive conductive polymer at least partially between electrodes opposed to each other; and applying a pressure to fix the both electrodes, a surface-treated wiring board comprising polyphthalide represented by the formula (I) formed on at least part of the surface of the electrode part, an adhesive film comprising an adhesive and polyphthalide represented by the formula (I), and an electrode-connected structure using the same.

Abstract translation: 本发明涉及一种电极连接方法，其特征在于，包括：插入由式（I）表示的多苯酞：其中R表示二价芳族烃基或含二价杂芳基的芳族基团，R 1表示烷基，氟化烷基 R 1为0〜4的烷氧基或卤素原子，X表示O或N-R 3，条件是R 3表示以下基团之中，Y表示SO 2或Co，n表示重复单元数 在聚合物中，作为至少部分地彼此相对的电极之间的压敏导电聚合物; 并且施加压力以固定两个电极，包括形成在电极部分的至少一部分表面上的由式（I）表示的多苯酞的表面处理的布线板，包含由式（I）表示的粘合剂和多苯酞的粘合剂膜 （I），以及使用其的电极连接结构。

公开(公告)号：US07766458B2

公开(公告)日：2010-08-03

申请号：US11710561

申请日：2007-02-26

Applicant: Yuji Shinkai

Inventor： Yuji Shinkai

IPC: B41J2/05 ,  B41J2/14 ,  B41J2/045 ,  H01L41/22 ,  B23P17/00

CPC classification number: H05K3/363 ,  B41J2/14209 ,  B41J2/1609 ,  B41J2/1623 ,  B41J2002/14217 ,  B41J2002/14225 ,  B41J2002/14306 ,  B41J2002/14459 ,  B41J2002/14491 ,  B41J2202/20 ,  H05K3/3452 ,  H05K2201/0367 ,  H05K2201/09909 ,  H05K2201/10977 ,  H05K2201/2036 ,  Y10T29/42 ,  Y10T29/49144 ,  Y10T29/49149 ,  Y10T29/49179 ,  Y10T29/49401

Abstract: An inkjet head includes an ink passage unit, an actuator unit; a printed circuit board; a metallic bond for electrically connecting a land to a terminal, the metallic bond being disposed in at least one of a region between the land and the terminal and a region extending over the land and the terminal along the peripheries of the land and the terminal; and a protrusion disposed on the connecting portion between a main electrode portion and the land.

Abstract translation: 喷墨头包括墨水通道单元，致动器单元; 印刷电路板; 用于将焊盘和端子电连接的金属接合体，所述金属焊接处置在所述焊盘和所述终端之间的区域中的至少一个区域中，以及沿所述焊盘和所述终端的周边延伸越过所述焊盘和所述终端的区域; 以及设置在主电极部分和焊盘之间的连接部分上的突起。

公开(公告)号：US07759162B2

公开(公告)日：2010-07-20

申请号：US11662286

申请日：2005-09-07

Applicant: Seiji Karashima ,  Yoshihisa Yamashita ,  Satoru Tomekawa ,  Takashi Kitae ,  Seiichi Nakatani

Inventor： Seiji Karashima ,  Yoshihisa Yamashita ,  Satoru Tomekawa ,  Takashi Kitae ,  Seiichi Nakatani

IPC: H01L21/00

CPC classification number: H01L21/563 ,  H01L21/6835 ,  H01L24/11 ,  H01L24/13 ,  H01L24/29 ,  H01L24/81 ,  H01L24/83 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/11003 ,  H01L2224/1152 ,  H01L2224/131 ,  H01L2224/1329 ,  H01L2224/133 ,  H01L2224/1601 ,  H01L2224/16145 ,  H01L2224/16238 ,  H01L2224/29011 ,  H01L2224/29035 ,  H01L2224/29101 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/293 ,  H01L2224/32052 ,  H01L2224/32145 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/81193 ,  H01L2224/818 ,  H01L2224/83102 ,  H01L2224/83191 ,  H01L2224/83203 ,  H01L2224/83886 ,  H01L2224/92125 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01009 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01056 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/0133 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/14 ,  H01L2924/181 ,  H05K3/323 ,  H05K3/3436 ,  H05K3/3484 ,  H05K2201/10977 ,  H05K2203/0278 ,  H05K2203/0425 ,  Y10S428/901 ,  Y10T428/24917 ,  Y10T428/254 ,  Y10T428/31681 ,  H01L2924/00 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2924/01083 ,  H01L2924/00012 ,  H01L2224/05599

Abstract: A flip chip mounting process includes the steps of supplying a resin (13) containing solder powder and a convection additive (12) onto a wiring substrate (10) having a plurality of electrode terminals (11), then bringing a semiconductor chip (20) having a plurality of connecting terminals (11) into contact with a surface of the supplied resin (13), and then heating the wiring substrate (10) to a temperature that enables the solder powder to melt. The heating step is carried out at a temperature that is higher than the boiling point of the convection additive (12) to allow the boiling convection additive (12) to move within the resin (12). During this heating step, the melted solder powder is allowed to self-assemble into the region between each electrode terminal (11) of the wiring substrate (10) and each connecting terminal (21) of the semiconductor chip to form an electrical connection between each electrode terminal (11) and each connecting terminal (21). Finally, the resin is cured so as to secure the semiconductor chip (20) to the wiring substrate (10).

Abstract translation: 倒装芯片安装方法包括以下步骤：将含有焊料粉末的树脂（13）和对流添加剂（12）提供到具有多个电极端子（11）的布线基板（10）上，然后将半导体芯片（20） 具有与供给的树脂（13）的表面接触的多个连接端子（11），然后将布线基板（10）加热到使焊料粉末熔化的温度。 加热步骤在高于对流添加剂（12）的沸点的温度下进行，以允许沸腾对流添加剂（12）在树脂（12）内移动。 在该加热步骤中，使熔融的焊料粉末自组装到布线基板（10）的每个电极端子（11）与半导体芯片的每个连接端子（21）之间的区域中，以形成每个 电极端子（11）和每个连接端子（21）。 最后，树脂被固化，以将半导体芯片（20）固定到布线基板（10）上。

公开(公告)号：US07754535B2

公开(公告)日：2010-07-13

申请号：US12123673

申请日：2008-05-20

Applicant: Toshio Kobayashi

Inventor： Toshio Kobayashi

IPC: H01L23/488

CPC classification number: H05K1/144 ,  H01L24/16 ,  H01L24/45 ,  H01L24/48 ,  H01L25/105 ,  H01L25/16 ,  H01L25/50 ,  H01L2224/16 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2225/1023 ,  H01L2225/1041 ,  H01L2225/1058 ,  H01L2924/00011 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19105 ,  H05K3/284 ,  H05K3/3436 ,  H05K2201/10234 ,  H05K2201/10977 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/01005 ,  H01L2924/01033

Abstract: There are provided the steps of connecting a chip component 13 to a first substrate 10 through wire bonding, providing, on a second substrate 20, an electrode 21 having a solder coat 23 with a copper core 22, polishing a portion of the electrode 21 which is to be bonded to the connecting pad 12, thereby exposing the copper core 22 from the solder coat 23, bonding the exposed portion of the copper core 22 to the bump connecting pad 12 by using a flux non-containing conductive paste 30, thereby bonding the substrates 10 and 20 to each other, and filling a sealing resin 40 in a clearance portion between the substrates 10 and 20.

Abstract translation: 提供了通过引线接合将芯片部件13连接到第一基板10的步骤，在第二基板20上提供具有铜芯22的具有焊料涂层23的电极21，抛光电极21的一部分 要连接到连接焊盘12，从而将铜芯22从焊料涂层23暴露出来，通过使用焊剂不含导电浆料30将铜芯22的露出部分接合到焊盘连接焊盘12上，从而结合 基板10和20彼此之间，并且将密封树脂40填充在基板10和20之间的间隙部分中。

公开(公告)号：US20100148376A1

公开(公告)日：2010-06-17

申请号：US12717433

申请日：2010-03-04

Applicant: Seiji Karashima ,  Yoshihisa Yamashita ,  Satoru Tomekawa ,  Takashi Kitae ,  Seiichi Nakatani

Inventor： Seiji Karashima ,  Yoshihisa Yamashita ,  Satoru Tomekawa ,  Takashi Kitae ,  Seiichi Nakatani

IPC: H01L23/488 ,  H01L21/60

CPC classification number: H01L21/563 ,  H01L21/6835 ,  H01L24/11 ,  H01L24/13 ,  H01L24/29 ,  H01L24/81 ,  H01L24/83 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/11003 ,  H01L2224/1152 ,  H01L2224/131 ,  H01L2224/1329 ,  H01L2224/133 ,  H01L2224/1601 ,  H01L2224/16145 ,  H01L2224/16238 ,  H01L2224/29011 ,  H01L2224/29035 ,  H01L2224/29101 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/293 ,  H01L2224/32052 ,  H01L2224/32145 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/81193 ,  H01L2224/818 ,  H01L2224/83102 ,  H01L2224/83191 ,  H01L2224/83203 ,  H01L2224/83886 ,  H01L2224/92125 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01009 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01056 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/0133 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/14 ,  H01L2924/181 ,  H05K3/323 ,  H05K3/3436 ,  H05K3/3484 ,  H05K2201/10977 ,  H05K2203/0278 ,  H05K2203/0425 ,  Y10S428/901 ,  Y10T428/24917 ,  Y10T428/254 ,  Y10T428/31681 ,  H01L2924/00 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2924/01083 ,  H01L2924/00012 ,  H01L2224/05599

Abstract: A flip chip mounting process includes the steps of supplying a resin (13) containing solder powder and a convection additive (12) onto a wiring substrate (10) having a plurality of electrode terminals (11), then bringing a semiconductor chip (20) having a plurality of connecting terminals (11) into contact with a surface of the supplied resin (13), and then heating the wiring substrate (10) to a temperature that enables the solder powder to melt. The heating step is carried out at a temperature that is higher than the boiling point of the convection additive (12) to allow the boiling convection additive (12) to move within the resin (12). During this heating step, the melted solder powder is allowed to self-assemble into the region between each electrode terminal (11) of the wiring substrate (10) and each connecting terminal (21) of the semiconductor chip to form an electrical connection between each electrode terminal (11) and each connecting terminal (21). Finally, the resin is cured so as to secure the semiconductor chip (20) to the wiring substrate (10).

Abstract translation: 倒装芯片安装方法包括以下步骤：将含有焊料粉末的树脂（13）和对流添加剂（12）提供到具有多个电极端子（11）的布线基板（10）上，然后将半导体芯片（20） 具有与供给的树脂（13）的表面接触的多个连接端子（11），然后将布线基板（10）加热到使焊料粉末熔化的温度。 加热步骤在高于对流添加剂（12）的沸点的温度下进行，以允许沸腾对流添加剂（12）在树脂（12）内移动。 在该加热步骤中，使熔融的焊料粉末自组装到布线基板（10）的每个电极端子（11）与半导体芯片的每个连接端子（21）之间的区域中，以形成每个 电极端子（11）和每个连接端子（21）。 最后，树脂被固化，以将半导体芯片（20）固定到布线基板（10）上。

公开(公告)号：US07737552B2

公开(公告)日：2010-06-15

申请号：US12126766

申请日：2008-05-23

Applicant: Eric Beyne

Inventor： Eric Beyne

IPC: H01L23/34 ,  H01L21/00 ,  H01R12/16

CPC classification number: H01L23/3128 ,  H01L21/561 ,  H01L21/563 ,  H01L23/5225 ,  H01L23/5227 ,  H01L23/552 ,  H01L23/66 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/17 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L24/94 ,  H01L24/97 ,  H01L25/0657 ,  H01L25/105 ,  H01L25/50 ,  H01L2223/6677 ,  H01L2224/11005 ,  H01L2224/11312 ,  H01L2224/1132 ,  H01L2224/11334 ,  H01L2224/1191 ,  H01L2224/13022 ,  H01L2224/13082 ,  H01L2224/131 ,  H01L2224/16145 ,  H01L2224/16227 ,  H01L2224/17181 ,  H01L2224/2919 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48145 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/81193 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2224/9211 ,  H01L2224/92125 ,  H01L2224/92222 ,  H01L2224/94 ,  H01L2224/97 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2225/1088 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/1433 ,  H01L2924/15331 ,  H01L2924/1627 ,  H01L2924/181 ,  H01L2924/3025 ,  H05K3/3436 ,  H05K2201/0379 ,  H05K2201/10977 ,  Y02P70/613 ,  H01L2924/3512 ,  H01L2924/00 ,  H01L2924/014 ,  H01L2224/11 ,  H01L2224/81 ,  H01L2924/0665 ,  H01L2224/45099 ,  H01L2224/83 ,  H01L2924/00012

Abstract: A device and a method for bonding elements are described. A first solder ball is produced on a main surface of a first element. A second solder ball is produced on a main surface of a second element. Contact is provided between the first solder ball and the second solder ball. The first and second elements are bonded by applying a reflow act whereby the solder balls melt and form a joined solder ball structure. Prior to the bonding, the first solder ball is laterally embedded in a first layer of non-conductive material and the second solder ball is laterally embedded in a second layer of non-conductive material, such that the upper part of the first solder ball and upper part of the second solder ball are not covered by the non-conductive material. A third solder volume is applied on one or both of the embedded first or second solder balls, prior to the bonding.

Abstract translation: 描述用于结合元件的装置和方法。 在第一元件的主表面上产生第一焊球。 在第二元件的主表面上产生第二焊球。 在第一焊球和第二焊球之间提供接触。 第一和第二元件通过施加回流作用而结合，由此焊球熔化并形成接合的焊球结构。 在接合之前，第一焊球侧向嵌入在第一非导电材料层中，并且第二焊球侧向嵌入第二非导电材料层中，使得第一焊球的上部和 第二焊球的上部不被非导电材料覆盖。 在接合之前，在嵌入的第一或第二焊球的一个或两个上施加第三焊料体积。

公开(公告)号：US07726545B2

公开(公告)日：2010-06-01

申请号：US11886311

申请日：2006-03-13

Applicant: Takashi Ichiryu ,  Seiichi Nakatani ,  Seiji Karashima ,  Yoshihiro Tomita ,  Koichi Hirano ,  Toshio Fujii

Inventor： Takashi Ichiryu ,  Seiichi Nakatani ,  Seiji Karashima ,  Yoshihiro Tomita ,  Koichi Hirano ,  Toshio Fujii

IPC: B23K31/02 ,  B23K31/00 ,  H01L21/44

CPC classification number: H05K3/3436 ,  H01L21/4853 ,  H01L21/6835 ,  H01L24/11 ,  H01L24/12 ,  H01L24/16 ,  H01L24/81 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/11003 ,  H01L2224/11005 ,  H01L2224/1152 ,  H01L2224/11524 ,  H01L2224/16 ,  H01L2224/73104 ,  H01L2224/73204 ,  H01L2224/81801 ,  H01L2224/83192 ,  H01L2224/83886 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01009 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01056 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/19043 ,  H05K3/323 ,  H05K3/3484 ,  H05K2201/10977 ,  H05K2203/083 ,  H05K2203/087 ,  Y02P70/613 ,  Y10T29/49126 ,  H01L2224/13099 ,  H01L2224/29099 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

Abstract: A flip chip mounting process or a bump-forming process according to the present invention is characterized in that electrically-conductive particles are fixed on electrodes formed on an electronic component. A composition comprising solder powder, a convection additive and a resin component is supplied onto a surface of the electronic component, the surface is provided with the electrodes. The supplied composition is heated up to a temperature enabling the solder powder to melt. As a result, the convection additive boils or is decomposed so as to generate a gas. The generated gas produces a convection phenomenon within the supplied composition. Since the convection phenomenon promotes the movement of the solder powder, the solder powder can move freely within the composition. The electrically-conductive particles serve as nuclei for the solder powder to self-assemble and grow. As a result, the molten solder powder is allowed to self-assemble and grow in the vicinity of the electrically-conductive particles, which leads to a formation of connections or bumps.

Abstract translation: 根据本发明的倒装芯片安装工艺或凸块形成工艺的特征在于，导电颗粒固定在形成在电子部件上的电极上。 将包含焊料粉末，对流添加剂和树脂组分的组合物供应到电子部件的表面上，该表面设置有电极。 将所提供的组合物加热到使焊料粉末熔化的温度。 结果，对流添加剂沸腾或分解以产生气体。 所产生的气体在所提供的组合物内产生对流现象。 由于对流现象促使焊料粉末的移动，焊料粉末可以在组合物内自由移动。 导电颗粒用作焊料粉末的自组装和生长的核。 结果，允许熔融焊料粉末在导电颗粒附近自组装和生长，这导致连接或凸块的形成。

公开(公告)号：US20100116534A1

公开(公告)日：2010-05-13

申请号：US12379759

申请日：2009-02-27

Applicant: Jin Won Choi ,  Seung Wan Kim

Inventor： Jin Won Choi ,  Seung Wan Kim

IPC: H05K1/16 ,  H05K3/34

CPC classification number: H05K3/305 ,  H01L21/563 ,  H01L23/49816 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/81192 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01079 ,  H05K3/3452 ,  H05K3/3484 ,  H05K2201/10674 ,  H05K2201/10977 ,  H05K2203/043 ,  H05K2203/0505 ,  H05K2203/0568 ,  H05K2203/0588 ,  Y02P70/613 ,  Y10T29/49142 ,  Y10T29/49144 ,  Y10T29/49155 ,  H01L2924/00 ,  H01L2224/0401

Abstract: Disclosed is a printed circuit board having a flow preventing dam and a manufacturing method thereof The printed circuit board includes a base substrate having a solder pad, a solder bump formed on the solder pad of the base substrate, and a flow preventing dam formed on a peripheral area of the base substrate using a dry film resist. The flow preventing dam can prevent the outflow of an underfill solution and can be simply formed.

Abstract translation: 本发明公开了一种具有流阻防止堤坝的印刷电路板及其制造方法。印刷电路板包括：具有焊盘的基底基板，形成在基底基板的焊盘上的焊料凸块， 使用干膜抗蚀剂的基底基板的周边区域。 防流动水坝可以防止底部填充溶液的流出，并且可以简单地形成。

公开(公告)号：US07714444B2

公开(公告)日：2010-05-11

申请号：US12424867

申请日：2009-04-16

Applicant: Seiichi Nakatani ,  Seiji Karashima ,  Takashi Kitae ,  Susumu Sawada

Inventor： Seiichi Nakatani ,  Seiji Karashima ,  Takashi Kitae ,  Susumu Sawada

IPC: H01L23/52

CPC classification number: H05K3/3484 ,  B23K1/0016 ,  B23K35/025 ,  B23K35/262 ,  B23K35/264 ,  B23K35/268 ,  B23K35/3613 ,  C22C11/00 ,  C22C12/00 ,  C22C13/00 ,  H01L24/11 ,  H01L24/27 ,  H01L24/29 ,  H01L24/83 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/056 ,  H01L2224/16227 ,  H01L2224/29101 ,  H01L2224/29111 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/29386 ,  H01L2224/29499 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/83192 ,  H01L2224/83801 ,  H01L2224/83855 ,  H01L2224/8388 ,  H01L2224/83886 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/0133 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/14 ,  H01L2924/351 ,  H05K3/323 ,  H05K2201/10674 ,  H05K2201/10977 ,  H01L2924/00 ,  H01L2924/01083 ,  H01L2224/29311 ,  H01L2924/00014 ,  H01L2224/1319 ,  H01L2224/133 ,  H01L2924/05442 ,  H01L2924/05432 ,  H01L2224/16225

Abstract: The present invention provides a conductive resin composition for connecting electrodes electrically, in which metal particles are dispersed in a flowing medium, wherein the flowing medium includes a first flowing medium that has relatively high wettability with the metal particles and a second flowing medium that has relatively low wettability with the metal particles, and the first flowing medium and the second flowing medium are dispersed in a state of being incompatible with each other. Thereby, a flip chip packaging method that can be applied to flip chip packaging of LSI and has high productivity and high reliability is provided.

Abstract translation: 本发明提供一种导电树脂组合物，用于电连接电极，其中金属颗粒分散在流动介质中，其中流动介质包括与金属颗粒相比具有较高润湿性的第一流动介质和具有相对较高的第二流动介质 与金属颗粒的低润湿性，以及第一流动介质和第二流动介质在彼此不相容的状态下分散。 因此，提供了可以应用于LSI的倒装芯片封装并且具有高生产率和高可靠性的倒装芯片封装方法。