公开(公告)号：US6075078A

公开(公告)日：2000-06-13

申请号：US172372

申请日：1998-10-14

Applicant: John W. Braud ,  Helen Grace Gilbreath

Inventor： John W. Braud ,  Helen Grace Gilbreath

IPC: B65D83/14 ,  C09J201/00 ,  C08K5/16 ,  C08K5/01 ,  C08L23/00

CPC classification number: B65D83/752 ,  C09J201/00

Abstract: A method for producing a fast drying high solids adhesive wherein a water based polymer emulsion (latex) is modified with unemulsified elasticizing oils and reinforcing-tackifying resins to produce a stable emulsion of polymer, oil and resin without the use of additional emulsifiers or volatile organic solvents. When packaged in pressurizable canisters along with a suitable propellant, the adhesive may be sprayed through a suitable nozzle and deposited in a thin layer to form an adhesive film which has excellent bonding characteristics for many laminates such as fabric or textiles, wood, plastics, metals and rubber, and for adhering flooring materials such as carpet, linoleum, tiles and artificial grass to a variety of substrates.

Abstract translation: 一种用于生产快干高固体粘合剂的方法，其中水基聚合物乳液（胶乳）用未乳化的弹性油和增强粘合树脂改性以产生聚合物，油和树脂的稳定乳液，而不使用另外的乳化剂或挥发性有机物 溶剂。 当与适当的推进剂一起包装在可加压的罐中时，粘合剂可以通过合适的喷嘴喷射并沉积在薄层中以形成粘合剂膜，其对于许多层压材料如织物或纺织品，木材，塑料，金属具有优异的粘合特性 和橡胶，并且用于将诸如地毯，油毡，瓷砖和人造草的地板材料粘合到各种基材上。

公开(公告)号：US6054007A

公开(公告)日：2000-04-25

申请号：US835681

申请日：1997-04-10

Applicant: Gary T. Boyd ,  Robert J. DeVoe ,  Ilya Gorodisher ,  David A. Ylitalo

Inventor： Gary T. Boyd ,  Robert J. DeVoe ,  Ilya Gorodisher ,  David A. Ylitalo

IPC: B41J2/135 ,  B41J2/16 ,  C08F2/50 ,  C09J5/00 ,  C09J201/00

CPC classification number: B41J2/16 ,  B41J2/162 ,  B41J2/1623 ,  B41J2/1637 ,  B41J2/164

Abstract: A shaped adhesive article is prepared by a method comprising the steps of shaping an adhesive mixture in a mold, said mold having one or more featured surfaces, said mixture including a first polymer precursor and a second polymer precursor, or a first polymer precursor and a thermoplastic polymer, polymerizing said first polymer precursor in said mold, to produce a shaped adhesive article having one or more featured surfaces, removing said shaped adhesive article from said mold, and adhering one or more of said featured surfaces to a substrate.

Abstract translation: 通过一种方法制备成型的粘合剂制品，所述方法包括以下步骤：在模具中成形粘合剂混合物，所述模具具有一个或多个特征表面，所述混合物包括第一聚合物前体和第二聚合物前体，或第一聚合物前体和 热塑性聚合物，在所述模具中聚合所述第一聚合物前体，以产生具有一个或多个特征表面的成形粘合剂制品，将所述成形的粘合剂制品从所述模具中移出，并将所述特征表面中的一个或多个粘附到基材上。

公开(公告)号：US6048660A

公开(公告)日：2000-04-11

申请号：US14555

申请日：1998-01-28

Applicant: David George Leppard ,  Manfred Kohler

Inventor： David George Leppard ,  Manfred Kohler

IPC: G03F7/027 ,  A61K8/00 ,  A61K8/37 ,  A61Q11/00 ,  C07C69/36 ,  C07C69/738 ,  C07C323/12 ,  C07C323/62 ,  C07D493/04 ,  C08F2/48 ,  C09D5/03 ,  C09D7/12 ,  C09D11/10 ,  C09D201/00 ,  C09J11/00 ,  C09J201/00 ,  G02B1/04 ,  G03F7/031 ,  G03H1/02 ,  G03C1/492 ,  C07D307/93 ,  C08F2/46 ,  C07C321/100

CPC classification number: G03F7/031 ,  C07C69/738

Abstract: Compounds of the formula I ##STR1## in which R.sub.1 and R.sub.2 independently of one another are, for example, a group of the formula II ##STR2## R.sub.3, R.sub.4, R.sub.5, R.sub.6 and R.sub.7 independently of one another are, for example, hydrogen, C.sub.1 -C.sub.12 alkyl, OR.sub.8, SR.sub.9, NR.sub.10 R.sub.11, halogen or phenyl; R.sub.8, R.sub.9, R.sub.10, R.sub.11 independently of one another are, for example, hydrogen or C.sub.1 -C.sub.12 alkyl; R.sub.12 is, for example, C.sub.1 -C.sub.8 alkyl; R.sub.13 is, for example, C.sub.1 -C.sub.12 alkyl; R.sub.14 is, for example, hydrogen; Y is C.sub.1 -C.sub.12 alkylene, C.sub.4 -C.sub.8 alkenylene, C.sub.4 -C.sub.8 alkynylene or cyclohexylene, or is phenylene or C.sub.4 -C.sub.40 alkylene interrupted one or more times by --O--, --S-- or --NR.sub.15 --, or Y is a group of the formula III, IV, V, VI, VII, VIII, IX, X or XI ##STR3## Y.sub.1 is as defined for Y with the exception of the formula V; R.sub.15 is hydrogen, C.sub.1 -C.sub.12 alkyl or phenyl; and R.sub.16 is hydrogen, CH.sub.2 OH or C.sub.1 -C.sub.4 alkyl; and mixtures of these compounds with further photoinitiators are suitable for photopolymerizing compounds having ethylenically unsaturated double bonds.

Abstract translation: 其中R1和R2彼此独立的式I化合物是例如式II的基团，R 3，R 4，R 5，R 6和R 7彼此独立地是例如氢，C 1 -C 12烷基，OR 8 ，SR9，NR10R11，卤素或苯基; R 8，R 9，R 10，R 11彼此独立地是例如氢或C 1 -C 12烷基; R 12是例如C 1 -C 8烷基; R 13是例如C 1 -C 12烷基; R14是例如氢; Y是C1-C12亚烷基，C4-C8亚烯基，C4-C8亚炔基或亚环己基，或亚苯基或C4-C40亚烷基被-O - ， - S-或-NR15-间隔一次或多次，或Y是式III的基团 ，IV，V，VI，VII，VIII，IX，X或XI Y1如对于Y定义，除了式V; R 15是氢，C 1 -C 12烷基或苯基; 和R 16是氢，CH 2 OH或C 1 -C 4烷基; 并且这些化合物与其它光引发剂的混合物适用于具有烯属不饱和双键的光聚合化合物。

公开(公告)号：US6020059A

公开(公告)日：2000-02-01

申请号：US121055

申请日：1998-07-23

Applicant: Yukio Yamada ,  Masao Saito ,  Junji Shinozaki ,  Motohide Takeichi

Inventor： Yukio Yamada ,  Masao Saito ,  Junji Shinozaki ,  Motohide Takeichi

IPC: C09J7/00 ,  C09J9/02 ,  C09J163/00 ,  C09J201/00 ,  H01B1/20 ,  H01L21/60 ,  H05K3/32 ,  B32B7/12

CPC classification number: H05K3/323 ,  C09J7/00 ,  C09J9/02 ,  H01L24/29 ,  C09J2201/134 ,  C09J2201/36 ,  H01L2924/07802 ,  H01L2924/07811 ,  H01L2924/14 ,  H05K2201/10674 ,  H05K2203/1189 ,  Y10S428/901 ,  Y10T428/256 ,  Y10T428/287 ,  Y10T428/2991

Abstract: A multilayer anisotropic electroconductive adhesive, comprises an anisotropic electroconductive adhesive layer and laminated to at least one side thereof an insulating adhesive layer. The anisotropic electroconductive adhesive layer comprises a film-forming resin and electroconductive particles and has a melt viscosity at 150.degree. C. of 100 poise or higher, and the insulating adhesive layer comprises a latent curing agent and a resin having a functional group and has a melt viscosity at 150.degree. C. of less than 100 poise.

Abstract translation: 多层各向异性导电粘合剂包括各向异性导电粘合剂层，并且在其至少一个侧面层压有绝缘粘合剂层。 各向异性导电粘合剂层包括成膜树脂和导电颗粒，并且在150℃下的熔体粘度为100泊或更高，并且绝缘粘合剂层包含潜在性固化剂和具有官能团的树脂，并且具有 在150℃下的熔融粘度小于100泊。

公开(公告)号：US5999619A

公开(公告)日：1999-12-07

申请号：US992351

申请日：1997-12-17

Applicant: Thomas Bingel

Inventor： Thomas Bingel

IPC: C09J7/02 ,  C09J109/00 ,  C09J125/00 ,  C09J131/00 ,  C09J133/08 ,  C09J133/18 ,  C09J167/00 ,  C09J175/00 ,  C09J201/00 ,  H04M1/738 ,  H04M1/00

CPC classification number: H04M1/738

Abstract: A method and apparatus for actively simulating an apparent termination input impedance to a current driven data communication equipment (DCE) device is disclosed. The DCE device utilizes several components to implement the apparent termination impedance. A first component is a current driver for providing a source of current within the DCE device. The current source is configured to actively drive an input-output signal line within a communication link. The current driven DCE also includes a mechanism for sensing an input-output signal line voltage, a mechanism for converting the sensed voltage to a feed back current and an active termination for simulating an apparent termination impedance. The converting mechanism is coupled to a summation node which sums current provided from the current driver and current from the converting mechanism to force the desired termination impedance in the DCE device, whilst performing DCE current drive function.

Abstract translation: 公开了一种用于主动模拟当前驱动数据通信设备（DCE）装置的视在终端输入阻抗的方法和装置。 DCE器件利用多个部件来实现视在端接阻抗。 第一组件是用于在DCE设备内提供电流源的当前驱动器。 电流源被配置为主动驱动通信链路内的输入 - 输出信号线。 电流驱动的DCE还包括用于感测输入 - 输出信号线电压的机构，用于将检测到的电压转换为反馈电流的机构以及用于模拟视在端接阻抗的有源终端。 转换机构耦合到求和节点，该求和节点与当前驱动器提供的电流和来自转换机构的电流相加，以在DCE设备中强制所需的终端阻抗，同时执行DCE电流驱动功能。

公开(公告)号：US5997994A

公开(公告)日：1999-12-07

申请号：US177967

申请日：1998-10-26

Applicant: Kojiro Matsushima

Inventor： Kojiro Matsushima

IPC: C09J7/02 ,  B41J29/36 ,  B41J31/09 ,  B43L19/00 ,  C09J11/04 ,  C09J133/00 ,  C09J201/00 ,  B32B3/00

CPC classification number: B41J31/09 ,  B41J29/36 ,  Y10T428/24802 ,  Y10T428/2495 ,  Y10T428/24959 ,  Y10T428/2848

Abstract: The object of the present invention is to provide a pressure-sensitive correction tape having concealing properties and improvements in deterioration with time in an adhesive layer while not causing any blocking phenomenon and being excellent transfer cutting properties. The present invention relates to a pressure-sensitive transfer correction tape comprising a correction concealing layer on one side of a sheet substrate and a pressure-sensitive adhesive layer provided thereon containing a concealing material wherein the thickness in total of the pressure-sensitive adhesive layer and the correction concealing layer is 50 .mu.m or less and the ratio in thickness of the pressure-sensitive adhesive layer and the correction concealing layer is in the range of 1:1 to 1:4.

Abstract translation: 本发明的目的是提供一种具有隐蔽性和粘合剂层中随时间劣化的改进的压敏校正带，而不会产生任何阻塞现象和优异的转印切割性能。 本发明涉及一种压敏转印校正带，其包括在片基材的一侧上的校正隐藏层和在其上设置的含有隐蔽材料的压敏粘合剂层，其中压敏粘合剂层和 校正隐藏层为50μm以下，粘合剂层和校正隐藏层的厚度比为1：1〜1：4。

公开(公告)号：US5997775A

公开(公告)日：1999-12-07

申请号：US975513

申请日：1997-11-21

Applicant: Takao Hayashi ,  Norihiro Sato ,  Manabu Hosoi ,  Nobuyoshi Kasahara ,  Clemens Aderhold ,  Wolf-Dieter Griebler ,  Jorg Hocken ,  Uwe Rosin ,  Gunther Rudolph

Inventor： Takao Hayashi ,  Norihiro Sato ,  Manabu Hosoi ,  Nobuyoshi Kasahara ,  Clemens Aderhold ,  Wolf-Dieter Griebler ,  Jorg Hocken ,  Uwe Rosin ,  Gunther Rudolph

IPC: C08K9/02 ,  C09C1/02 ,  C09C3/06 ,  C09D5/24 ,  C09J201/00 ,  H01B1/06 ,  H01B1/08 ,  H01B1/20 ,  H01R11/28 ,  H01B1/00

CPC classification number: H01R11/287 ,  C08K9/02 ,  C09C1/027 ,  C09C3/063 ,  C09D5/24 ,  C09J201/00 ,  H01B1/06 ,  H01B1/08 ,  H01B1/20 ,  C01P2002/54 ,  C01P2004/80 ,  C01P2006/12 ,  C01P2006/40 ,  C01P2006/90 ,  Y10S428/918 ,  Y10T428/2991

Abstract: The electrically conductive, barium sulfate-containing composition consists of BaSO.sub.4 particles having a surface area of from 0.1 to 150 m.sup.2 /g. The BaSO.sub.4 particles each are provided with a SnO.sub.2 coating having a thickness of 2 to 80 nm and containing from 1 to 15% by weight of the Sb.sub.2 O.sub.3. The electrically conductive, barium sulfate-containing composition is made by a method including the steps of adding a first acidic solution containing 1 to 95% by weight SnCl.sub.4 and a basic solution to an aqueous dispersion from 50 to 800 g/l of BaSO.sub.4 to make a basic mixture having a pH from 9 to 15; then adding an acid to the basic mixture to form an acidic mixture having a pH from 4 to 1; then adding a second acid solution containing 0.5 to 60% by weight of SbCl.sub.3 to the acidic mixture; separating the electrically conductive, barium sulfate-containing composition from the acidic mixture; and drying and igniting the separated electrically conductive, barium sulfate-containing composition at 300 to 800.degree. C.

Abstract translation: 导电的含硫酸钡的组合物由表面积为0.1至150m 2 / g的BaSO 4颗粒组成。 所述BaSO 4颗粒各自具有厚度为2至80nm并含有1至15重量％的Sb 2 O 3的SnO 2涂层。 导电的含硫酸钡的组合物通过包括以下步骤的方法制备：将含有1至95重量％SnCl 4的第一酸性溶液和碱性溶液加入到50至800g / l的BaSO 4水溶液中， pH为9〜15的碱性混合物; 然后向碱性混合物中加入酸形成pH为4至1的酸性混合物; 然后向酸性混合物中加入含有0.5〜60重量％SbCl 3的第二酸溶液; 从酸性混合物中分离导电的含硫酸钡的组合物; 并在300至800℃下干燥并点燃分离的导电的含硫酸钡组合物。

公开(公告)号：US5985074A

公开(公告)日：1999-11-16

申请号：US983158

申请日：1997-12-22

Applicant: Marcus Heemann ,  Eckhard Puerkner ,  Wolfgang Klingberg ,  Bernhard Herlfterkamp ,  Hermann Onusseit ,  Ralf Gossen

Inventor： Marcus Heemann ,  Eckhard Puerkner ,  Wolfgang Klingberg ,  Bernhard Herlfterkamp ,  Hermann Onusseit ,  Ralf Gossen

IPC: C09J5/00 ,  B65C9/20 ,  C09J7/02 ,  C09J7/04 ,  C09J11/06 ,  C09J123/00 ,  C09J123/02 ,  C09J129/02 ,  C09J133/02 ,  C09J133/04 ,  C09J167/00 ,  C09J167/02 ,  C09J191/06 ,  C09J201/00 ,  B65C1/00

CPC classification number: C09J123/02 ,  B65C9/20 ,  C09J167/00 ,  C09J7/0207 ,  C09J7/045 ,  Y10T156/1033 ,  Y10T156/1195 ,  Y10T428/15

Abstract: The invention is an adhesive system for applying wrap around labels to containers. The system comprises a hotmelt pick-up adhesive which is active at the temperature which the label is applied and loses its bonding ability after the adhesive sets and an overlap adhesive for bonding the label overlap. At its application temperature, the pick-up adhesive has significantly higher adhesiveness, measured at its application temperature than at its conventional storage temperature. In addition, the adhesive preferably has a greater affinity for the label than for the container bearing the label. Consequently, the label can be easily removed from the hollow body without leaving residues of adhesive. If, nevertheless, a residual adhesive should remain on the hollow body, it can be dissolved by an alkaline solution.

Abstract translation: PCT No.PCT / EP96 / 02753 Sec。 371 1997年12月22日第 102（e）日期1997年12月22日PCT Filed 1996年6月24日PCT公布。 公开号WO97 / 01483 日期1997年1月16日本发明是一种用于将标签包裹在容器上的粘合剂系统。 该系统包括热敏拾取粘合剂，其在施加标签的温度下有活性，并且在粘合剂组之后失去其粘合能力，并且用于粘合标签的重叠粘合剂重叠。 在其使用温度下，拾取粘合剂在其使用温度下比在其常规储存温度下测量的粘合性显着更高。 此外，粘合剂优选对标签的亲和力比承载标签的容器更大。 因此，可以容易地从中空体中去除标签，而不会留下粘合剂残留物。 然而，如果残留的粘合剂应该保留在中空体上，则它可以通过碱性溶液溶解。

公开(公告)号：US5972431A

公开(公告)日：1999-10-26

申请号：US124326

申请日：1998-07-29

Applicant: John Anthony Marsella ,  Kevin Rodney Lassila

Inventor： John Anthony Marsella ,  Kevin Rodney Lassila

IPC: A01N25/30 ,  B01F17/00 ,  C07D233/32 ,  C07D239/10 ,  C09D5/02 ,  C09D7/00 ,  C09D7/12 ,  C09D11/00 ,  C09D11/02 ,  C09D201/00 ,  C09J11/06 ,  C09J201/00 ,  B05D3/02

CPC classification number: C07D239/10 ,  B01F17/0042 ,  C07D233/32 ,  C09D11/03 ,  C09D5/027

Abstract: This invention provides water-based compositions, particularly coating, ink, and agricultural compositions, manifesting reduced equilibrium and dynamic surface tension by the incorporation of a surface tension reducing amount of certain cyclic urea compounds of the structure ##STR1## where R is a C6 to C12 alkyl group or R"O--(CH.sub.2).sub.m -, R' is hydrogen or methyl, R" is a C4 to C12 alkyl group, m is 2-4 and n is 1 or 2.

Abstract translation: 本发明提供水基组合物，特别是涂料，油墨和农业组合物，其表现出减少的平衡和动态表面张力，通过结合表面张力降低量的某些结构的环状脲化合物，其中R是C 6 -C 12烷基 或R“O-（CH 2）m - ，R'为氢或甲基，R”为C 4至C 12烷基，m为2-4，n为1或2。

公开(公告)号：US5960260A

公开(公告)日：1999-09-28

申请号：US835333

申请日：1997-04-07

Applicant: Norito Umehara ,  Masazumi Amagai

Inventor： Norito Umehara ,  Masazumi Amagai

IPC: C09J11/00 ,  C09J201/00 ,  H01L21/301 ,  H01L21/52 ,  H01L21/68 ,  H01L21/683 ,  H01L21/78 ,  H01L23/495 ,  H01L21/44 ,  H01L21/48 ,  H01L21/50

CPC classification number: H01L21/6836 ,  H01L21/78 ,  H01L23/49503 ,  H01L23/49513 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/83 ,  H01L2221/68327 ,  H01L2224/29007 ,  H01L2224/32014 ,  H01L2224/32055 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/78301 ,  H01L2224/83138 ,  H01L2224/83191 ,  H01L2224/83855 ,  H01L2224/85181 ,  H01L2224/92247 ,  H01L24/48 ,  H01L24/73 ,  H01L24/78 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/01077 ,  H01L2924/01082 ,  H01L2924/01088 ,  H01L2924/10253 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/3511 ,  Y10S438/928 ,  Y10S438/976

Abstract: Our semiconductor device is an IC chip 10 whose back surface is affixed to a mounting section 81 by means of a thermoplastic adhesive (for example, thermoplastic polyimide) 84. Package cracks are eliminated or markedly reduced and the problems with productivity for mounting curing and mounting alleviated. Even when a padless special lead frame or one with a small die pad is used, package cracks are eliminated or markedly reduced, and the lead frame can be mounted easily and with good reliability on top of the lead frame.

Abstract translation: 我们的半导体器件是IC芯片10，其背面通过热塑性粘合剂（例如热塑性聚酰亚胺）84固定在安装部分81上。消除或明显减少了封装裂纹，并且出现安装固化和安装的生产率问题 缓解 即使使用无衬垫的特殊引线框架或具有小芯片焊盘的引线框架，也可以消除或显着减小封装裂纹，并且可以在引线框架的顶部容易地安装引线框架并具有良好的可靠性。