公开(公告)号：US692103A

公开(公告)日：1902-01-28

申请号：US1901063256

申请日：1901-06-05

Applicant: BAILEY EDWARD L

Inventor： BAILEY EDWARD L

CPC classification number: B05C11/1042

公开(公告)号：US119002A

公开(公告)日：1871-09-19

申请号：US119002D

CPC classification number: B05C11/1042

公开(公告)号：US20240337516A1

公开(公告)日：2024-10-10

申请号：US18748784

申请日：2024-06-20

Applicant: NORDSON CORPORATION

Inventor： Wesley C. Fort ,  Ronald Ramspeck ,  Enes Ramosevac

IPC: G01F1/56 ,  B05B12/00 ,  B05C5/02 ,  B05C11/10 ,  C09J5/00 ,  G01F3/10 ,  G01F15/18 ,  G05D16/06

CPC classification number: G01F1/56 ,  B05B12/00 ,  B05C11/1007 ,  B05C11/1013 ,  B05C11/1021 ,  B05C11/1042 ,  C09J5/00 ,  G01F3/10 ,  G01F15/185 ,  B05C5/02 ,  B05C5/027 ,  B05C11/1044 ,  G05D16/06

Abstract: A hot melt adhesive system includes an adhesive supply for receiving solid or semi-solid hot melt adhesive, and a heater associated with the adhesive supply for melting the solid or semi-solid hot melt adhesive into liquid hot melt adhesive. An adhesive tracking system monitors an output of the liquid hot melt adhesive, and includes a flow meter having a flow inlet and a flow outlet. The flow meter measures an amount of the adhesive flowing out of the flow outlet. A product detector may be used to sense a presence of a product to which the adhesive is applied. A controller then determines the total amount of the liquid adhesive dispensed and the average amount of liquid adhesive dispensed per product.

公开(公告)号：US20240293840A1

公开(公告)日：2024-09-05

申请号：US18593085

申请日：2024-03-01

Applicant: Robatech AG

Inventor： Michael Hürlimann ,  Claudio Hofer

IPC: B05C11/10 ,  H01F7/02

CPC classification number: B05C11/1042 ,  B05C11/1026 ,  H01F7/0252

Abstract: A fastening system for fastening an article to a heating hose, a corresponding heating hose and an application system having a corresponding fastening system. The fastening system is provided for a holder of the fastening system to be fastened magnetically to an end cap of the heating hose.

公开(公告)号：US11938505B2

公开(公告)日：2024-03-26

申请号：US17809389

申请日：2022-06-28

Applicant: NORDSON CORPORATION

Inventor： Charles P. Ganzer ,  Leslie J. Varga

IPC: B05B11/10 ,  B05C11/10 ,  D06N3/00

CPC classification number: B05C11/1042 ,  D06N3/0011

Abstract: A melt system that includes a melt unit. The melt unit includes a reservoir and a melter. The melter is configured to expose solid adhesive to a temperature sufficient to form a molten adhesive, which is deposited into the reservoir. The melt unit includes a hopper disposed above the melter and for holding a supply of the solid adhesive. The hopper has an access door disposed on a wall of the hopper that is movable between a closed position where the hopper is closed and an open position where an internal chamber of the hopper is accessible to receive the solid adhesive. The hopper and the solid adhesive in the hopper are thermally isolated from the reservoir.

公开(公告)号：US11860542B2

公开(公告)日：2024-01-02

申请号：US18098572

申请日：2023-01-18

Applicant: TOKYO ELECTRON LIMITED

Inventor： Takashi Yamauchi ,  Daiki Shibata ,  Kohei Kawakami

IPC: G03F7/16 ,  H01L21/67 ,  B05C11/10 ,  B05B9/00 ,  H01L21/687 ,  H01L21/027

CPC classification number: G03F7/162 ,  B05B9/002 ,  B05C11/1042 ,  H01L21/6715 ,  H01L21/67017 ,  H01L21/67248 ,  H01L21/68764 ,  H01L21/0273

Abstract: A liquid treatment apparatus includes: a substrate holder for holding a substrate; a discharge nozzle for discharging a treatment liquid onto the substrate; a liquid supply pipe for supplying the treatment liquid from a treatment liquid storage source to the discharge nozzle; a gas pipe that encompasses the liquid supply pipe and through which an inert gas for adjusting the temperature of the treatment liquid flows in a space between the gas pipe and the liquid supply pipe; a processing container in which the substrate holder, the discharge nozzle, the liquid supply pipe, and the gas pipe are provided; and an atmosphere gas supply part for supplying an atmosphere gas into the processing container. The gas pipe is provided so that an extension portion between an upstream end inside the processing container and an encompassing portion is folded back inside the processing container in a plan view.

公开(公告)号：US11766694B2

公开(公告)日：2023-09-26

申请号：US17475776

申请日：2021-09-15

Applicant: NORDSON CORPORATION

Inventor： Joel E. Saine

IPC: B05C5/02 ,  B05B15/65 ,  B05C11/02 ,  B05C11/10 ,  B05B11/10 ,  B05C19/00 ,  F04C2/18 ,  F04C11/00 ,  B01F25/54 ,  B01F25/62 ,  F04B49/20 ,  F04D15/00 ,  B05B9/04 ,  B05C5/00 ,  B32B37/12 ,  F04C14/08

CPC classification number: B05C11/1007 ,  B05B11/1049 ,  B05B15/65 ,  B05C5/02 ,  B05C5/0225 ,  B05C5/0279 ,  B05C11/025 ,  B05C11/1026 ,  B05C11/1042 ,  B05C11/1044 ,  B05C19/008 ,  B01F25/54 ,  B01F25/62 ,  B05B9/0403 ,  B05C5/001 ,  B05C5/027 ,  B05C5/0258 ,  B05C11/1002 ,  B05C11/1039 ,  B32B37/1284 ,  F04B49/20 ,  F04C2/18 ,  F04C11/001 ,  F04C14/08 ,  F04D15/0066

Abstract: An adhesive dispensing system for applying liquid adhesive to a substrate using different nozzles with the same manifold is disclosed. The adhesive dispensing system includes a manifold having a body, a first clamp configured to engage the body of the manifold, a second clamp configured to engage the body of the manifold, and a nozzle. The first and second clamps secure the nozzle to the body of the manifold. The body of the manifold has a first contact surface that engages the first clamp and a second contact surface that engages the second clamp and the nozzle, where the second contact surface is angularly offset from the first contact surface.

公开(公告)号：US20230286013A1

公开(公告)日：2023-09-14

申请号：US18119401

申请日：2023-03-09

Applicant: SHIBAURA MECHATRONICS CORPORATION

Inventor： Masaaki FURUYA ,  Hiroaki KOBAYASHI ,  Hideki MORI

IPC: B05C11/10

CPC classification number: B05C11/1007 ,  B05C11/1036 ,  B05C11/1042 ,  B05C11/1047

Abstract: According to one embodiment, a processing liquid supply device includes a plurality of tanks, a supply path that supplies a processing liquid to a processing device, a heating unit that heats the processing liquid, a dilution unit that dilutes the processing liquid, a new-liquid supply unit that supplies a new liquid, a common flow path through which the processing liquid of the plurality of tanks passes, a switching unit that switches between the plurality of tanks so that at least a tank is selected from which the processing liquid passes to the common flow path, a densitometer provided in the common flow path, and a control device that controls at least one of the heating unit, the dilution unit, and the new-liquid supply unit so that the concentration reaches a target value set in advance.

公开(公告)号：US20230234091A1

公开(公告)日：2023-07-27

申请号：US18129150

申请日：2023-03-31

Applicant: Tokyo Electron Limited

Inventor： Chikara NOBUKUNI ,  Tomoaki OJIMA ,  Takuya ITAHASHI ,  Ryoichi HORIGUCHI ,  Shota WAKAYAMA

IPC: B05C3/02 ,  B05C11/10

CPC classification number: B05C3/02 ,  B05C11/1026 ,  B05C11/1015 ,  B05C11/1039 ,  B05C11/1042 ,  H01L21/67023

Abstract: A liquid processing apparatus includes: a tank configured to store a processing liquid supplied from a processing liquid supply source; a circulation passage connected to the tank; a pump installed at the circulation passage; a plurality of liquid processors configured to perform liquid processing on a substrate; and a plurality of supply passages configured to supply the processing liquid to the plurality of liquid processors respectively, wherein the circulation passage includes a main passage portion provided with the pump, and a first branch passage portion and a second branch passage portion branching from the main passage portion, and the processing liquid flowing out from the tank passes through the main passage portion, then flows into the first branch passage portion and the second branch passage portion, and then returns to the tank through the first branch passage portion and the second branch passage portion.

公开(公告)号：US20180326448A1

公开(公告)日：2018-11-15

申请号：US16045743

申请日：2018-07-26

Applicant: NORDSON CORPORATION

Inventor： Joel E. Saine

IPC: B05C11/10 ,  B05C11/02 ,  B05C19/00 ,  B05B11/00 ,  B05C5/02 ,  B05B15/65 ,  B01F5/10 ,  B01F5/14 ,  B05B9/04 ,  B05C5/00 ,  B32B37/12 ,  F04B49/20 ,  F04D15/00 ,  F04C14/08

CPC classification number: B05C11/1007 ,  B01F5/108 ,  B01F5/14 ,  B05B9/0403 ,  B05B11/3049 ,  B05B15/65 ,  B05C5/001 ,  B05C5/02 ,  B05C5/0225 ,  B05C5/0258 ,  B05C5/027 ,  B05C5/0279 ,  B05C11/025 ,  B05C11/1002 ,  B05C11/1026 ,  B05C11/1039 ,  B05C11/1042 ,  B05C11/1044 ,  B05C19/008 ,  B32B37/1284 ,  F04B49/20 ,  F04C14/08 ,  F04D15/0066

Abstract: An applicator for dispensing multiple adhesives on a substrate is disclosed. The applicator includes a manifold that includes a first dispensing module and a second dispensing module. The first dispensing module has a first inlet and a first nozzle. The first inlet receives a first adhesive and the first nozzle applies the first adhesive to the substrate. The second dispensing module is adjacent the first dispensing module and has a second inlet and a second nozzle. The second inlet receives a second adhesive that is different from the first adhesive. The second nozzle applies the second adhesive to the substrate.