公开(公告)号：US09967676B2

公开(公告)日：2018-05-08

申请号：US15117516

申请日：2014-11-29

Applicant: KYOCERA Corporation

Inventor： Tohru Matsuoka

IPC: H04R17/00 ,  H04M1/03 ,  H04R1/02

CPC classification number: H04R17/00 ,  H04M1/035 ,  H04R1/028 ,  H04R17/005 ,  H04R2201/003 ,  H04R2499/15

Abstract: There are provided an acoustic generator, an acoustic generation apparatus, a portable terminal and an electronic apparatus, which have an improved sound quality. An acoustic generator includes a piezoelectric element having a piezoelectric body; and a vibration plate joined to the piezoelectric body via a joining material, distances between the vibration plate and the piezoelectric body being different. Since this configuration achieves a clear and sharp sound quality, and has an effect of increasing sound pressure, the acoustic generator having an improved sound quality can be achieved.

公开(公告)号：US20180124534A1

公开(公告)日：2018-05-03

申请号：US15342325

申请日：2016-11-03

Applicant: Robert Bosch GmbH

Inventor： Andrew J. Doller ,  David Pravlik

IPC: H04R29/00

CPC classification number: H04R29/004 ,  H04R29/005 ,  H04R2201/003

Abstract: A system and a method are provided for testing a MEMS microphone during manufacture by using a film to obstruct the acoustic ports of the microphone. The microphone testing is performed while the microphones are still in an array and mounted on a film frame. By performing the testing while the acoustic ports of the microphone are covered with film, unwanted, external noise is attenuated.

公开(公告)号：US09961451B2

公开(公告)日：2018-05-01

申请号：US14858997

申请日：2015-09-18

Applicant: STMicroelectronics S.r.l.

Inventor： Germano Nicollini ,  Silvia Adorno ,  Andrea Barbieri ,  Federica Barbieri ,  Sebastiano Conti ,  Edoardo Marino ,  Sergio Pernici

IPC: H04R3/00 ,  H04R19/00 ,  H04R19/04 ,  H04R19/02 ,  H04R25/00

CPC classification number: H04R19/005 ,  H04R19/02 ,  H04R19/04 ,  H04R2201/003 ,  H04R2499/11 ,  H04R2499/15

Abstract: A MEMS acoustic transducer has: a detection structure, which generates an electrical detection quantity as a function of a detected acoustic signal; and an electronic interface circuit, which is operatively coupled to the detection structure and generates an electrical output quantity as a function of the electrical detection quantity. The detection structure has a first micromechanical structure of a capacitive type and a second micromechanical structure of a capacitive type, each including a membrane that faces and is capacitively coupled to a rigid electrode and defines a respective first detection capacitor and second detection capacitor; the electronic interface circuit defines an electrical connection in series of the first detection capacitor and second detection capacitor between a biasing line and a reference line, and further has a first single-output amplifier and a second single-output amplifier, which are coupled to a respective one of the first detection capacitor and the second detection capacitor and have a respective first output terminal and second output terminal, between which the electrical output quantity is present.

公开(公告)号：US09961427B2

公开(公告)日：2018-05-01

申请号：US15519898

申请日：2016-02-03

Applicant: BOE Technology Group Co., Ltd. ,  Beijing BOE Optoelectronics Technology Co., Ltd.

Inventor： Jiuxia Yang ,  Yun Qiu ,  Zhidong Wang

IPC: H04R1/02 ,  G02F1/1368 ,  G02F1/1362 ,  G06F3/16 ,  H03G3/32 ,  H04R31/00 ,  H04R23/00 ,  H01L27/32 ,  H01L27/12 ,  H01L29/786 ,  G08B21/18

CPC classification number: H04R1/028 ,  G01H3/00 ,  G02F1/13338 ,  G02F1/136227 ,  G02F1/136277 ,  G02F1/1368 ,  G06F3/165 ,  G08B21/0423 ,  G08B21/182 ,  G09F9/33 ,  G09F9/35 ,  H01L27/1222 ,  H01L27/127 ,  H01L27/3225 ,  H01L27/3262 ,  H01L29/78669 ,  H01L29/78678 ,  H03G3/3005 ,  H03G3/32 ,  H03G7/002 ,  H04R19/04 ,  H04R23/006 ,  H04R31/00 ,  H04R2201/003 ,  H04R2499/15

Abstract: A display panel and manufacturing method thereof, and a display device and health monitoring method thereof. The display panel includes a base substrate and a sonic sensor disposed on the base substrate. The sonic sensor is configured to monitor a sonic wave.

公开(公告)号：US09955269B2

公开(公告)日：2018-04-24

申请号：US15620387

申请日：2017-06-12

Applicant: Robert Bosch GmbH

Inventor： Andrew J. Doller ,  Sucheendran Sridharan

IPC: H04R25/00 ,  H04R19/00 ,  H01L29/84

CPC classification number: H04R19/005 ,  H04R2201/003

Abstract: Systems for controlling parameters of a MEMS microphone. In one embodiment, the microphone system includes a MEMS microphone and a controller. The MEMS microphone includes a movable electrode, a stationary electrode, and a driven electrode. The movable electrode is configured such that acoustic pressure acting on the movable electrode causes movement of the movable electrode. The stationary electrode and the driven electrode are positioned on a first side of the movable electrode. The driven electrode is configured to alter a parameter of the MEMS microphone based on a control signal. The controller is coupled to the stationary electrode and the driven electrode. The controller is configured to determine a voltage difference between the movable electrode and the stationary electrode. The controller is also configured to generate the control signal based on the voltage difference.

公开(公告)号：US20180109892A1

公开(公告)日：2018-04-19

申请号：US15843915

申请日：2017-12-15

Applicant: Infineon Technologies AG

Inventor： Andreas Wiesbauer ,  Christian Jenkner ,  Ulrich Krumbein ,  Marc Füldner

IPC: H04R29/00

CPC classification number: H04R29/004 ,  H04R2201/003

Abstract: According to an embodiment, a transducer system includes a transducing element and a symmetry detection circuit. The transducing element includes a signal plate, a first sensing plate, and a second sensing plate. The symmetry detection circuit is coupled to a differential output of the transducer element and is configured to output an error signal based on asymmetry in the differential output.

公开(公告)号：US20180103323A1

公开(公告)日：2018-04-12

申请号：US15722211

申请日：2017-10-02

Applicant: Research & Business Foundation Sungkyunkwan University ,  BSE Co., Ltd.

Inventor： Sang Woo KIM ,  Chang Won KIM ,  Yong Kook KIM ,  Sung Kyun KIM ,  Tae Yun KIM ,  Tae Ho KIM ,  Han KIM ,  Minki KANG ,  Seung CHOI

IPC: H04R17/02 ,  H04R1/08 ,  H01L41/047

CPC classification number: H04R17/02 ,  H01L41/047 ,  H04R1/083 ,  H04R7/10 ,  H04R17/10 ,  H04R31/003 ,  H04R2201/003

Abstract: There is provided a microphone device comprising: a substrate having top and bottom portions, wherein the substrate has a cavity defined therein, wherein the cavity is open at the bottom portion of the substrate; a two-dimensional piezoelectric layer disposed on the top portion of the substrate, wherein the two-dimensional piezoelectric layer blocks a top of the cavity; and first and second electrode layers respectively arranged on both lateral end portions of the two-dimensional piezoelectric layer, wherein the first and second spaced electrode layers are spaced apart and electrically insulated from each other, wherein an electric potential energy is generated between the first and second electrode layers via piezoelectricity of the two-dimensional piezoelectric layer when the two-dimensional piezoelectric layer vibrates by sound energy applied thereto, wherein the piezoelectricity is generated in a parallel direction to a plane of the two-dimensional piezoelectric layer.

公开(公告)号：US09938140B2

公开(公告)日：2018-04-10

申请号：US15206836

申请日：2016-07-11

Applicant: Infineon Technologies AG

Inventor： Alfons Dehe ,  Stephan Pindl ,  Bernhard Knott ,  Carsten Ahrens

IPC: B81C1/00 ,  H04R19/04 ,  H04R19/00 ,  H04R31/00

CPC classification number: B81C1/00825 ,  B81B2201/0235 ,  B81B2201/0257 ,  B81B2201/0264 ,  B81C1/00873 ,  B81C2201/017 ,  B81C2201/053 ,  H04R19/005 ,  H04R19/04 ,  H04R31/00 ,  H04R2201/003

Abstract: A method for manufacturing a MEMS device is disclosed. Moreover a MEMS device and a module including a MEMS device are disclosed. An embodiment includes a method for manufacturing MEMS devices includes forming a MEMS stack on a first main surface of a substrate, forming a polymer layer on a second main surface of the substrate and forming a first opening in the polymer layer and the substrate such that the first opening abuts the MEMS stack.

公开(公告)号：US09936298B2

公开(公告)日：2018-04-03

申请号：US15211137

申请日：2016-07-15

Applicant: Robert Bosch GmbH

Inventor： Thomas Buck ,  Fabian Purkl ,  Michael Stumber ,  Ricardo Ehrenpfordt ,  Rolf Scheben ,  Benedikt Stein ,  Christoph Schelling

IPC: H04R19/04 ,  H04R7/14 ,  H04R7/18 ,  H04R19/00 ,  H04R31/00 ,  B81B3/00 ,  H04R23/00 ,  H04R17/02

CPC classification number: H04R7/14 ,  B81B3/0072 ,  H04R7/18 ,  H04R17/02 ,  H04R19/005 ,  H04R19/04 ,  H04R23/006 ,  H04R31/006 ,  H04R2201/003

Abstract: For a MEMS component, in the layer structure of which at least one sound-pressure-sensitive diaphragm element is formed, which spans an opening or cavity in the layer structure and the deflections of which are detected with the aid of at least one piezosensitive circuit element in the attachment area of the diaphragm element, design measures are provided, by which the stress distribution over the diaphragm surface may be influenced intentionally in the event of deflection of the diaphragm element. In particular, measures are provided, by which the mechanical stresses are intentionally introduced into predefined areas of the diaphragm element, to thus amplify the measuring signal. For this purpose, the diaphragm element includes at least one designated bending area, which is defined by the structuring of the diaphragm element and is more strongly deformed in the event of sound action than the adjoining diaphragm sections.

公开(公告)号：US09936289B2

公开(公告)日：2018-04-03

申请号：US14553296

申请日：2014-11-25

Applicant: INVENSENSE, INC.

Inventor： Omid Oliaei

IPC: H04R3/00 ,  H03G5/00 ,  H04R1/40 ,  H03F3/183 ,  H04R29/00

CPC classification number: H04R1/406 ,  H03F3/183 ,  H03F2200/03 ,  H04R3/005 ,  H04R29/005 ,  H04R2201/003 ,  H04R2499/11 ,  H04R2499/15

Abstract: Microelectromechanical systems (MEMS) acoustic sensors are implemented with dedicated preamplifiers. Provided implementations can comprise an array of MEMS acoustic sensor elements each having a dedicated preamplifier. A summation node can add outputs of each preamplifier and an analog to digital converter (ADC) can receive the summed outputs. Other implementations can comprise an array of MEMS acoustic sensors each having dedicated preamplifiers. Some of the preamplifiers receive an invert signal and an ADC can subtract inverted signals from non-inverted signals.