公开(公告)号：US20140069692A1

公开(公告)日：2014-03-13

申请号：US13688290

申请日：2012-11-29

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Jang Ho Park ,  Seul Gi Kim ,  Jin UK Lee ,  In Hyun Jang ,  Nam Keun Oh

IPC: H05K1/09

CPC classification number: H05K1/09 ,  G06F3/041 ,  G06F2203/04103 ,  H05K2201/0108 ,  H05K2201/09681

Abstract: Disclosed herein is a touch panel including a transparent substrate and an electrode formed on the transparent substrate and an electrode having light transmittance of 5 to 50%, wherein as the electrode has high light transmittance, such that it is possible to solve a defective problem of visibility of the touch panel due to the opacity and specular phenomenon of the electrode.

Abstract translation: 这里公开了一种触摸面板，其包括透明基板和形成在透明基板上的电极和透光率为5〜50％的电极，其中，由于电极具有高透光率，使得可以解决有缺陷的问题 由于电极的不透明度和镜面现象引起的触摸屏的可视性。

公开(公告)号：US20140030484A1

公开(公告)日：2014-01-30

申请号：US14046036

申请日：2013-10-04

Applicant: NITTO DENKO CORPORATION

Inventor： Naoki Tsuno ,  Hiroyuki Takao ,  Katsunori Takada ,  Kazuhiro Ikai

IPC: H05K1/03

CPC classification number: H05K1/0313 ,  G06F3/041 ,  H05K1/0274 ,  H05K1/119 ,  H05K2201/0108 ,  Y10T428/24364

Abstract: A transparent conductive film which comprises: a substrate composed of a non-crystalline polymer film;a first hard coating layer; a first transparent conductor layer; a first metal layer; a second hard coating layer; a second transparent conductor layer; and a second metal layer. The first hard coating layer includes a binder resin and a plurality of sphere-shaped particles having a diameter of 1 μm to 5 μm. The first metal layer has a plurality of projections having a maximum height Rz of 0.5 μm to 2.5 μm resulting from the plurality of particles included in the first hard coating layer on a surface thereof.

Abstract translation: 一种透明导电膜，包括：由非结晶聚合物膜构成的基底; 第一硬涂层; 第一透明导体层; 第一金属层; 第二硬涂层; 第二透明导体层; 和第二金属层。 第一硬涂层包括粘合剂树脂和多个直径为1μm至5μm的球形颗粒。 第一金属层具有由其表面上的第一硬涂层中包含的多个颗粒得到的多个突起，其具有0.5μm至2.5μm的最大高度Rz。

公开(公告)号：US20140027044A1

公开(公告)日：2014-01-30

申请号：US13951511

申请日：2013-07-26

Applicant: E INK CORPORATION

Inventor： Matthew Joseph Kayal ,  Stephen Joseph Battista ,  Richard J. Paolini, JR. ,  Shyamala A. Subramanian, JR.

IPC: B29D11/00

CPC classification number: G02F1/167 ,  B29D11/0073 ,  B32B37/12 ,  B32B38/0004 ,  B32B38/04 ,  B32B2307/202 ,  B32B2307/412 ,  B32B2310/0843 ,  B32B2457/20 ,  C09D11/52 ,  G02F1/133377 ,  G02F1/13439 ,  G02F1/1533 ,  G02F1/155 ,  G02F2201/42 ,  G02F2202/16 ,  G02F2202/28 ,  H05K1/0274 ,  H05K1/095 ,  H05K3/321 ,  H05K3/4053 ,  H05K3/4084 ,  H05K2201/0108 ,  H05K2201/091 ,  H05K2203/0455 ,  H05K2203/063

Abstract: Electrical connection between the backplane and the front electrode of an electro-optic display is provided by forming a front plane laminate (100) comprising, in order, a light-transmissive electrically-conductive layer (104), a layer of electro-optic material (106), and a layer of lamination adhesive (108); forming an aperture (114) through all three layers of the front plane laminate (100); and introducing a flowable, electrically-conductive material (118) into the aperture (114), the flowable, electrically-conductive material being in electrical contact with the light-transmissive electrically-conductive layer (104) and extending through the adhesive layer (108).

Abstract translation: 电光显示器的背板和前电极之间的电连接通过形成前平面层压板（100）而提供，前平面层压板（100）依次包括透光导电层（104），电光材料层 （106）和层压粘合剂层（108）; 通过所述前平面层压板（100）的所有三层形成孔（114）; 以及将可流动的导电材料（118）引入所述孔（114）中，所述可流动的导电材料与所述透光导电层（104）电接触并延伸穿过所述粘合剂层（108） ）。

公开(公告)号：US20140004320A1

公开(公告)日：2014-01-02

申请号：US14004716

申请日：2012-02-27

Applicant: Philip Gareth Bentley ,  David Stephen Thomas

Inventor： Philip Gareth Bentley ,  David Stephen Thomas

IPC: G03F7/095 ,  G03F7/30 ,  G03F7/20

CPC classification number: G03F7/0957 ,  G03F7/20 ,  G03F7/30 ,  G03F7/40 ,  G06F3/041 ,  G06F2203/04103 ,  H05K3/185 ,  H05K2201/0108 ,  H05K2201/0236 ,  Y10T428/24802

Abstract: A photopatternable structure (10) comprises an optically transparent substrate (12) having first and second faces (14, 16), coated respectively with first and second photosensitive materials (18, 20), the coated substrate being opaque to electromagnetic radiation of one or more wavelengths to which the photosensitive materials are sensitive. In use, the faces (14, 16) are exposed (sequentially or simultaneously) to curing radiation to which the photosensitive materials are sensitive and to which the coated substrate is opaque, resulting in two sided photopatterning without through -cure occurring.

Abstract translation: 光可图案化结构（10）包括具有分别涂覆有第一和第二感光材料（18,20）的第一和第二面（14,16）的光学透明基底（12），所述涂覆的基底对于电磁辐射是不透明的， 感光材料敏感的更多波长。 在使用中，面（14,16）暴露（顺序地或同时地）固化感光材料敏感的辐射，并且涂覆的基底不透明，导致双侧光图案化而不会发生固化。

公开(公告)号：US20130327562A1

公开(公告)日：2013-12-12

申请号：US13908888

申请日：2013-06-03

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Chung Mo Yang ,  Jung Ryoul Yim ,  Sang Su Hong

IPC: H05K1/09

CPC classification number: H05K1/09 ,  G06F3/0412 ,  G06F3/044 ,  G06F2203/04103 ,  H05K2201/0108

Abstract: Disclosed herein is a touch panel. A touch panel 100 according to a preferred embodiment of the present invention is configured to include a transparent substrate 110 and an electrode 120 formed of conductive non-oxide ceramics on the transparent substrate 110. The electrode 120 is formed of conductive non-oxide ceramics (Ti3SiC2) and an additional black oxide treatment is not required, thereby improving productivity of the touch panel 100.

Abstract translation: 这里公开了触摸面板。 根据本发明的优选实施例的触摸面板100被配置为在透明基板110上包括透明基板110和由导电非氧化物陶瓷形成的电极120.电极120由导电非氧化物陶瓷（ Ti 3 SiC 2），并且不需要另外的黑色氧化物处理，从而提高触摸面板100的生产率。

公开(公告)号：US20130306359A1

公开(公告)日：2013-11-21

申请号：US13979722

申请日：2012-02-01

Applicant: Matthew H. Frey ,  Stephen P. Maki

Inventor： Matthew H. Frey ,  Stephen P. Maki

IPC: H05K1/02 ,  H05K3/46

CPC classification number: H05K1/0274 ,  B82Y20/00 ,  B82Y30/00 ,  B82Y99/00 ,  G02B1/116 ,  G02B27/142 ,  G06F3/041 ,  H03K17/962 ,  H05K1/0306 ,  H05K1/09 ,  H05K3/061 ,  H05K3/4644 ,  H05K9/0086 ,  H05K9/0096 ,  H05K2201/0108 ,  H05K2201/09681 ,  Y10S977/755

Abstract: The present disclosure provides an article having a substrate having opposing first and second surfaces. A conductor micropattern disposed on the first surface of the substrate. The conductor micropattern has a plurality of traces defining a plurality of cells. The conductor micropattern has an open area fraction greater than 80% and a uniform distribution of trace orientation. Each of the traces has a trace width from 0.5 to 10 micrometer. The conductor micropattern is a tri-layer material comprising in sequence a semi-reflective metal, a transparent layer, and a reflective layer disposed on the transparent layer. The articles are useful in devices such as displays, in particular, touch screen displays useful for mobile hand held devices, tablets and computers. They also find use in antennas and for EMI shields.

Abstract translation: 本公开提供了一种具有基底的制品，该基底具有相对的第一和第二表面。 布置在基板的第一表面上的导体微图案。 导体微图案具有限定多个单元的多个迹线。 导体微图案具有大于80％的开口面积分数和均匀分布的迹线取向。 每个迹线的迹线宽度为0.5至10微米。 导体微图案是三层材料，其依次包括半反射金属，透明层和设置在透明层上的反射层。 这些文章在诸如显示器的设备中是有用的，特别是对于移动手持设备，平板电脑和计算机有用的触摸屏显示器。 它们也可用于天线和EMI屏蔽。

公开(公告)号：US20130280440A1

公开(公告)日：2013-10-24

申请号：US13453518

申请日：2012-04-23

Applicant: Jie Zhang

Inventor： Jie Zhang

IPC: B05D3/06

CPC classification number: H05K3/02 ,  H01L31/022466 ,  H01L31/1884 ,  H05K3/1283 ,  H05K2201/0108 ,  H05K2201/0326 ,  H05K2203/0776 ,  H05K2203/107 ,  H05K2203/1581 ,  Y02E10/50

Abstract: A coating material containing metal oxide is applied to one side of a substrate, both coating and substrate being transparent to visible light. An absorber material is placed in heat transfer proximity to the coating and a laser beam is transmitted through the substrate and through the coating to strike the absorber material at the interface between coating and absorber. The absorber material absorbs optical energy from the laser beam causing the material to heat. Heat from the absorber propagates to the coating to heat a localized region, causing the coating material to anneal. If desired, the coating material can include a doping material that fuses into the coating during annealing.

Abstract translation: 将含有金属氧化物的涂料施加到基材的一侧，涂层和基材对可见光都是透明的。 将吸收材料置于热传递附近的涂层上，并且激光束透射穿过基底并穿过涂层以在涂层和吸收体之间的界面处撞击吸收体材料。 吸收材料从激光束吸收光能使材料发热。 来自吸收器的热量传播到涂层以加热局部区域，导致涂层材料退火。 如果需要，涂层材料可以包括在退火期间熔化到涂层中的掺杂材料。

公开(公告)号：US20130209027A1

公开(公告)日：2013-08-15

申请号：US13763782

申请日：2013-02-11

Applicant: HITACHI CABLE, LTD.

Inventor： Juhyun YU ,  Hiroki YASUDA ,  Kouki HIRANO ,  Hiroshi ISHIKAWA

IPC: G02B6/12

CPC classification number: G02B6/12 ,  G02B6/4202 ,  G02B6/4214 ,  G02B6/4239 ,  G02B6/4245 ,  G02B6/428 ,  G02B6/43 ,  G02B6/4416 ,  H05K1/118 ,  H05K2201/0108 ,  H05K2201/10121

Abstract: A photoelectric composite wiring module includes a flexible first substrate including a conductive line and an optical fiber mounted thereon along a longitudinal direction thereof, a second substrate including a recessed portion formed thereon to receive the conductive line and the optical fiber that protrude from an end portion of the first substrate, and an optical device mounted on the second substrate and optically coupled to the optical fiber. The recessed portion includes an opening on a mounting surface side of the second substrate to mount the optical device.

Abstract translation: 一种光电复合布线模块包括：柔性第一基板，包括导线和沿其长度方向安装在其上的光纤;第二基板，包括形成在其上的凹部，用于接收导线和从端部突出的光纤 以及安装在第二基板上并光学耦合到光纤的光学装置。 凹部包括在第二基板的安装表面侧上的开口以安装光学装置。

公开(公告)号：US08484837B2

公开(公告)日：2013-07-16

申请号：US13273154

申请日：2011-10-13

Applicant: Andreas Nickut ,  Bernd Albrecht ,  Peter Kracht

Inventor： Andreas Nickut ,  Bernd Albrecht ,  Peter Kracht

IPC: H05K3/34 ,  H01R9/00 ,  H05K3/00

CPC classification number: H05K3/3494 ,  B23K1/0016 ,  B23K1/005 ,  B23K26/361 ,  B23K26/364 ,  B23K26/40 ,  B23K35/268 ,  B23K35/3602 ,  B23K2101/42 ,  B23K2103/172 ,  B23K2103/18 ,  B23K2103/50 ,  B23K2103/52 ,  B23K2103/54 ,  H01L24/81 ,  H01L2224/81192 ,  H01L2224/81224 ,  H01L2224/97 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/15788 ,  H05K1/0306 ,  H05K3/341 ,  H05K2201/0108 ,  H05K2201/0112 ,  H05K2201/0326 ,  H05K2201/10106 ,  H05K2203/107 ,  Y10T29/49142 ,  Y10T29/49144 ,  Y10T29/49149 ,  H01L2224/81 ,  H01L2924/00

Abstract: The invention relates to a method to conductively connect an electrical component with at least one conductive layer, whereby the conductive layer is applied to a substrate which is essentially transparent in the visible wavelength zone of light, comprising the following steps: the electrical component or the conductive layer is provided with a soldering material in the area where the component is to be connected to the conductive layer; the soldering material is provided with energy supplied by an energy source, such that the soldering material melts and a non-detachable, material-bonded conductive connection between the electrical component and the conductive layer is established.

Abstract translation: 本发明涉及一种用于将电气部件与至少一个导电层导电连接的方法，由此将导电层施加到在可见光波长区域中基本上是透明的基底，包括以下步骤：电气部件或 导电层在组件要连接到导电层的区域中设置有焊接材料; 焊接材料设置有由能量源提供的能量，使得焊接材料熔化，并且建立电气部件和导电层之间的不可拆卸的材料键合的导电连接。

公开(公告)号：US20130154130A1

公开(公告)日：2013-06-20

申请号：US13819983

申请日：2011-08-29

Applicant: Michael Peil ,  Florin Oswald ,  Harald Maiweg

Inventor： Michael Peil ,  Florin Oswald ,  Harald Maiweg

IPC: H01L33/54 ,  H01L31/0203

CPC classification number: H01L33/54 ,  F21K9/90 ,  F21Y2115/10 ,  H01L21/56 ,  H01L23/24 ,  H01L23/3121 ,  H01L27/1446 ,  H01L27/15 ,  H01L31/0203 ,  H01L31/02325 ,  H01L33/56 ,  H01L2924/0002 ,  H01L2933/005 ,  H05K1/0274 ,  H05K3/284 ,  H05K2201/0108 ,  H05K2201/0162 ,  H05K2201/0175 ,  H05K2201/09909 ,  H05K2201/10106 ,  H05K2201/10121 ,  H05K2201/10151 ,  H05K2203/0126 ,  H01L2924/00

Abstract: A method is provided for coating an optoelectronic chip-on-board module, including a flat substrate populated with one or more optoelectronic components, having a transparent, UV-resistant, and temperature-resistant coating made of one or more silicones. A corresponding optoelectronic chip-on-board module and a system having multiple optoelectronic chip-on-board modules are also provided. The method includes the following steps: a) preheating the substrate to be coated to a first temperature; b) applying on the preheated substrate a dam that encloses a surface area or partial area of the substrate to be coated, the dam being made of a first, heat-curable, highly reactive silicone that cures at the first temperature; c) filling the surface area or partial area of the substrate enclosed by the dam with a liquid second silicone; and d) curing the second silicone.

Abstract translation: 提供了一种用于涂覆光电芯片模块的方法，其包括具有一个或多个光电子部件的平坦基板，其具有由一个或多个硅氧烷构成的透明的耐紫外线和耐温涂层。 还提供了相应的光电芯片组模块和具有多个光电芯片模块的系统。 该方法包括以下步骤：a）将待涂覆的基材预热至第一温度; b）在预热的基底上施加包围待涂覆的基底的表面积或部分区域的坝，所述坝由在第一温度下固化的第一可热固化的高反应性硅树脂制成; c）用液体第二硅胶填充由大坝封闭的基板的表面积或部分区域; 和d）固化第二硅氧烷。