公开(公告)号：US20120175147A1

公开(公告)日：2012-07-12

申请号：US13496550

申请日：2010-09-13

Applicant: Hideo Nakako ,  Kazunori Yamamoto ,  Yasushi Kumashiro ,  Shunya Yokosawa ,  Katsuyuki Masuda ,  Yoshinori Ejiri ,  Maki Inada ,  Kyoko Kuroda

Inventor： Hideo Nakako ,  Kazunori Yamamoto ,  Yasushi Kumashiro ,  Shunya Yokosawa ,  Katsuyuki Masuda ,  Yoshinori Ejiri ,  Maki Inada ,  Kyoko Kuroda

IPC: H01B5/00 ,  B05D3/10 ,  B05D1/12 ,  C09D11/02 ,  B32B37/00 ,  B32B15/01 ,  B32B15/00 ,  B05D3/00 ,  B05D3/06

CPC classification number: B22F9/26 ,  B22F1/02 ,  B22F9/22 ,  B22F9/24 ,  B22F2201/01 ,  B22F2301/10 ,  B22F2302/25 ,  B22F2999/00 ,  B32B15/01 ,  C22C5/04 ,  C22C9/00 ,  H01B1/026 ,  H05K1/097 ,  H05K3/105 ,  H05K3/1283 ,  H05K2201/0224 ,  H05K2201/0272 ,  H05K2203/0315 ,  H05K2203/1131 ,  H05K2203/1157 ,  Y10T156/10 ,  Y10T428/12903 ,  B22F2201/013 ,  B22F2202/13

Abstract: Disclosed are: a copper metal film which has good adhesion to a substrate, low volume resistivity, and good deep-part metal properties; and a method for producing a copper metal film, wherein the copper metal film can be produced by reducing a substrate to a deep part thereof without damaging the substrate. Specifically disclosed is a copper metal film obtained by treating a copper-based particle deposition layer containing both copper oxides and a metallic transition metal or alloy, or a transition metal complex containing a metal element, with gaseous formic acid and/or formaldehyde heated to 120° C. or higher. The copper oxide is preferably copper (I) oxide and/or copper (II) oxide. The transition metal, alloy or metal complex are preferably a metal selected from the group consisting of Cu, Pd, Pt, Ni, Ag, Au and Rh, an alloy containing the metal, or a complex containing the metal element, respectively.

Abstract translation: 公开了一种对基板具有良好粘合性的铜金属膜，体积电阻率小，以及良好的深部金属性质; 以及铜金属膜的制造方法，其中可以通过将基板还原到其深部而不损坏基板来制造铜金属膜。 具体公开了通过将含有氧化铜和金属过渡金属或合金的铜基颗粒沉积层或含有金属元素的过渡金属络合物与加热至120℃的气态甲酸和/或甲醛处理而获得的铜金属膜 ℃以上。 氧化铜优选为氧化铜（I）和/或氧化铜（II）。 过渡金属，合金或金属络合物优选为分别选自Cu，Pd，Pt，Ni，Ag，Au和Rh的金属，含金属的合金或含金属元素的复合物。

公开(公告)号：US20120156512A1

公开(公告)日：2012-06-21

申请号：US13404395

申请日：2012-02-24

Applicant: Kosuke Nakano ,  Hidekiyo Takaoka

Inventor： Kosuke Nakano ,  Hidekiyo Takaoka

IPC: B32B15/04 ,  B23K1/20 ,  B23K35/24

CPC classification number: B23K35/025 ,  B23K1/00 ,  B23K1/0016 ,  B23K35/262 ,  B23K35/3613 ,  B23K35/362 ,  B23K2101/40 ,  C22C9/05 ,  C22C9/06 ,  C22C13/00 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/81 ,  H01L24/83 ,  H01L2224/0401 ,  H01L2224/04026 ,  H01L2224/05155 ,  H01L2224/05644 ,  H01L2224/1132 ,  H01L2224/1329 ,  H01L2224/13294 ,  H01L2224/13311 ,  H01L2224/13347 ,  H01L2224/16503 ,  H01L2224/16507 ,  H01L2224/2732 ,  H01L2224/29101 ,  H01L2224/29109 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29294 ,  H01L2224/29311 ,  H01L2224/29347 ,  H01L2224/32503 ,  H01L2224/32507 ,  H01L2224/81192 ,  H01L2224/81211 ,  H01L2224/81447 ,  H01L2224/81815 ,  H01L2224/83192 ,  H01L2224/83211 ,  H01L2224/83447 ,  H01L2224/83815 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01025 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01038 ,  H01L2924/0104 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01052 ,  H01L2924/01057 ,  H01L2924/01059 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/0133 ,  H01L2924/014 ,  H01L2924/0665 ,  H05K3/3484 ,  H05K2201/0215 ,  H05K2201/0272 ,  Y10T403/479 ,  Y10T428/31678 ,  H01L2924/01028 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01026 ,  H01L2924/01027 ,  H01L2924/01046 ,  H01L2924/01083 ,  H01L2924/00015 ,  H01L2924/00012

Abstract: A solder paste including a metal component consisting of a first metal powder and a second metal powder having a melting point higher than that of the first metal, and a flux component. The first metal is Sn or an alloy containing Sn, and the second metal is a metal or alloy which forms an intermetallic compound having a melting point of 310° C. or higher with the first metal and has a lattice constant difference, i.e. a difference in between the lattice constant of the intermetallic compound and the lattice constant of the second metal component, of 50% or greater.

Abstract translation: 包括由第一金属粉末和熔点高于第一金属的第二金属粉末组成的金属成分的焊膏和焊剂成分。 第一金属是Sn或含有Sn的合金，第二金属是与第一金属形成熔点为310℃以上的金属间化合物的金属或合金，并且具有晶格常数差，即差 金属间化合物的晶格常数和第二金属成分的晶格常数之间的比例为50％以上。

公开(公告)号：US08071887B2

公开(公告)日：2011-12-06

申请号：US12253869

申请日：2008-10-17

Applicant: Shing-Tza Liou ,  Yao-Wen Bai ,  Cheng-Hsien Lin

Inventor： Shing-Tza Liou ,  Yao-Wen Bai ,  Cheng-Hsien Lin

IPC: H05K1/03

CPC classification number: H05K1/097 ,  B82Y10/00 ,  H05K3/125 ,  H05K3/246 ,  H05K2201/026 ,  H05K2201/0272 ,  H05K2201/0323 ,  H05K2201/0347 ,  H05K2203/013 ,  Y10T29/49155 ,  Y10T428/2462 ,  Y10T428/30 ,  Y10T428/32

Abstract: A printed circuit board includes a substrate having a surface, a circuit layer having a plurality of electrical traces formed on the surface, and an electrically conductive metal layer formed on the circuit layer. The circuit layer is comprised of a composite of carbon nano-tubes and metallic nano-particles.

Abstract translation: 印刷电路板包括具有表面的基板，具有形成在表面上的多个电迹线的电路层和形成在电路层上的导电金属层。 电路层由碳纳米管和金属纳米颗粒组成。

公开(公告)号：US20110247866A1

公开(公告)日：2011-10-13

申请号：US13155341

申请日：2011-06-07

Applicant: Yoon-Jin Kim ,  Chang-Mo Ko ,  Ho-Souk Cho

Inventor： Yoon-Jin Kim ,  Chang-Mo Ko ,  Ho-Souk Cho

IPC: H05K1/09 ,  H01B1/02 ,  B82Y30/00

CPC classification number: H01B1/22 ,  B82Y30/00 ,  B82Y40/00 ,  C01B32/174 ,  C01B2202/06 ,  C01B2202/28 ,  C01B2202/34 ,  C01B2202/36 ,  C08K3/04 ,  C08K3/08 ,  C08K9/02 ,  C09D7/62 ,  C09D7/67 ,  C09D7/68 ,  C09D7/70 ,  C09D17/004 ,  H01B1/24 ,  H05K1/097 ,  H05K2201/0221 ,  H05K2201/026 ,  H05K2201/0272 ,  Y10T428/24612

Abstract: A conductive paste composition is provided. The conductive paste composition includes 20 to 70 weight % of silver nanoparticles having an average particle size of 1 nm to 250 nm based on a total weight of the conductive paste composition, and 0.01 to 2 weight % of silver-decorated carbon nanotubes based on the total weight of the conductive paste composition.

Abstract translation: 提供导电糊组合物。 导电性糊剂组合物包含20〜70重量％的平均粒径为1nm〜250nm的导电糊剂组合物的银纳米粒子，以及0.01〜2重量％的银装饰碳纳米管 导电糊组合物的总重量。

公开(公告)号：US08029701B2

公开(公告)日：2011-10-04

申请号：US12872838

申请日：2010-08-31

Applicant: Hideji Kuwajima

Inventor： Hideji Kuwajima

IPC: H01B1/20 ,  H01B1/00

CPC classification number: H05K1/095 ,  H01B1/02 ,  H01B1/026 ,  H01B1/22 ,  H05K2201/0245 ,  H05K2201/0272 ,  Y10T428/12049 ,  Y10T428/2982 ,  Y10T428/31678

Abstract: There are disclosed a highly packed, mixed conductive powder with a relative packing density of at least 68%, a process for producing the same, a conductive paste using the mixed conductive powder and a process for producing the same, as well as a sheet and a sheet with attached film using the mixed conductive powder. This mixed conductive powder comprises substantially monodispersed conductive scale-like particles (A1) and conductive substantially spherical particles (B1). Or, this mixed conductive powder comprises substantially monodispersed, conductive, substantially spherical particles (A2) and conductive substantially spherical particles (B2) with a smaller particle diameter than that of the substantially spherical particles (A2).

Abstract translation: 公开了相对填充密度为68％以上的高填充性混合导电性粉末，其制造方法，使用该混合导电性粉末的导电性糊剂及其制造方法，以及片材和 具有使用混合导电粉末的附着膜的片材。 这种混合导电粉末包含基本上单分散的导电鳞片状颗粒（A1）和导电的基本上为球形的颗粒（B1）。 或者，该混合导电粉末包含基本上单分散的，导电的，基本上为球形的颗粒（A2）和具有比基本上球形的颗粒（A2）的粒径更小的导电的基本上为球形的颗粒（B2）。

公开(公告)号：US07976956B2

公开(公告)日：2011-07-12

申请号：US11594134

申请日：2006-11-08

Applicant: Yuuji Suzuki ,  Yuuki Kikuchi ,  Satoru Zama

Inventor： Yuuji Suzuki ,  Yuuki Kikuchi ,  Satoru Zama

IPC: B32B3/00

CPC classification number: H05K3/384 ,  B32B15/08 ,  B32B15/20 ,  H05K3/4069 ,  H05K2201/0272 ,  H05K2201/0355 ,  H05K2203/0307 ,  H05K2203/0425 ,  H05K2203/0723 ,  H05K2203/1461 ,  Y10T29/49124 ,  Y10T29/49128 ,  Y10T428/12438 ,  Y10T428/12451 ,  Y10T428/24917

Abstract: A through-hole type laminated circuit board is given with high reliability of electrical connection using copper foil and conductive paste containing low melting point metal without generating harmful void and crack at boundary between the copper foil and conductive paste metal. The laminated circuit board is made by laminating a multiple number of resin boards with roughening treated copper foils at least on their one surface sides with roughening projection deposition of less than 150 mg/dm2 to make surface roughness Rz of 0.3 to 10 μm and height of the projection to be 0.3 to 10 μm. Surface roughness of the original foil is 0.1 to 5 μm and the amount of copper metal atoms of roughening treated layer is set at 4 times or less than the amount of diffusible conductive paste metal atoms containing low melting point metal into the roughening treated layer on the foil surface.

Abstract translation: 通过使用铜箔和含有低熔点金属的导电膏，电连接的可靠性高，而不会在铜箔和导电膏金属之间的边界处产生有害的空隙和裂纹。 层压电路板是通过使至少在其一个表面侧至少具有粗糙化处理的铜箔的多个树脂板层叠多个树脂板而形成的，其粗化投影沉积小于150mg / dm 2，使得表面粗糙度Rz为0.3〜10μm，高度为 投影为0.3〜10μm。 原始箔的表面粗糙度为0.1〜5μm，粗化处理层的铜金属原子的量设定为含有低熔点金属的扩散性导电性糊状金属原子的量的4倍以下， 箔表面。

公开(公告)号：US07968014B2

公开(公告)日：2011-06-28

申请号：US12703674

申请日：2010-02-10

Applicant: Lex Kosowsky ,  Robert Fleming

Inventor： Lex Kosowsky ,  Robert Fleming

IPC: H01B1/06 ,  H01B1/02 ,  H01B1/12 ,  H02H9/00 ,  H01C7/12 ,  H01C7/10

CPC classification number: H01C7/1006 ,  B82Y10/00 ,  H01B1/22 ,  H01B1/24 ,  H01C7/105 ,  H01C17/0652 ,  H05K1/0257 ,  H05K1/0259 ,  H05K1/0373 ,  H05K1/167 ,  H05K3/188 ,  H05K2201/0248 ,  H05K2201/0257 ,  H05K2201/026 ,  H05K2201/0272 ,  H05K2201/0738 ,  H05K2203/0723 ,  H05K2203/105 ,  Y10S977/742 ,  Y10S977/779 ,  Y10T428/30 ,  Y10T428/31678

Abstract: One or more embodiments provide for a device that utilizes voltage switchable dielectric material having semi-conductive or conductive materials that have a relatively high aspect ratio for purpose of enhancing mechanical and electrical characteristics of the VSD material on the device.

Abstract translation: 一个或多个实施例提供了一种使用具有半导体或导电材料的电压可切换介电材料的器件，该器件具有相对较高的纵横比，以便增强器件上的VSD材料的机械和电学特性。

公开(公告)号：US20110100690A1

公开(公告)日：2011-05-05

申请号：US12915786

申请日：2010-10-29

Applicant: Hideaki Yoshimura ,  Kenji Fukuzono ,  Takashi Kanda ,  Tomohisa Yagi ,  Hiroki Ikeda ,  Katsu Yanagimoto

Inventor： Hideaki Yoshimura ,  Kenji Fukuzono ,  Takashi Kanda ,  Tomohisa Yagi ,  Hiroki Ikeda ,  Katsu Yanagimoto

IPC: H05K1/02 ,  B32B15/08 ,  B23K35/12 ,  H01B1/02 ,  B23K31/02

CPC classification number: H05K3/4614 ,  H01B1/02 ,  H01B1/026 ,  H01L2224/16225 ,  H01L2924/01322 ,  H01L2924/01327 ,  H05K1/186 ,  H05K3/1216 ,  H05K3/3463 ,  H05K3/3484 ,  H05K3/4069 ,  H05K3/4647 ,  H05K2201/0272 ,  H05K2201/09036 ,  H05K2201/10992 ,  Y10T428/31678 ,  H01L2924/00

Abstract: An electrically conductive body includes: a first electrically conductive material; a second electrically conductive material; and a bonding material bonding the first electrically conductive material to the second electrically conductive material at least for electric conduction. The bonding material is made of a metallic structure containing copper-tin based intermetallic compound phases and tin-bismuth phases, the copper-tin based intermetallic compound phases being continuous between the first electrically conductive material and the second electrically conductive material, the tin-bismuth phases being surrounded by the copper-tin based intermetallic compound phases.

Abstract translation: 导电体包括：第一导电材料; 第二导电材料; 以及至少用于导电的将第一导电材料接合到第二导电材料的接合材料。 接合材料由含有铜 - 锡基金属间化合物相和锡 - 铋相的金属结构制成，铜 - 锡基金属间化合物相在第一导电材料和第二导电材料之间连续，锡 - 铋 相被铜 - 锡基金属间化合物相包围。

公开(公告)号：US07888411B2

公开(公告)日：2011-02-15

申请号：US12071280

申请日：2008-02-19

Applicant: Matthew Wrosch ,  Miguel Albert Capote ,  Janet Fox, legal representative ,  Alan Grieve

Inventor： Matthew Wrosch ,  Miguel Albert Capote ,  Alan Grieve

IPC: C08K3/08 ,  C08L63/02

CPC classification number: C08F220/26 ,  C08F222/1006 ,  C08K3/08 ,  C08L63/00 ,  C09J4/00 ,  C09J9/00 ,  C09J11/04 ,  H05K3/321 ,  H05K2201/0272 ,  H05K2203/0425 ,  Y10T428/31529

Abstract: A thermally conductive adhesive composition includes a powder of a high melting point metal or metal alloy, a powder of a low melting point metal or metal alloy, and a polymerizable fluxing polymer matrix composition having a polyepoxide polymer resin and a low-melting solid or liquid acid-anhydride and a polymer diluent or diluents with carbon carbon double bonds and/or functional hydroxyl groups. The ratio by weight of the low melting point powder to high melting point powder ranges from about 0.50 to about 0.80, and may range from about 0.64 to about 0.75, and may be 0.665. Heretofore unpredicted substantially higher thermal conductivity improvements in performance have been found using these ratios of low melting point powder to high melting point powder.

Abstract translation: 导热粘合剂组合物包括高熔点金属或金属合金的粉末，低熔点金属或金属合金的粉末，以及具有聚环氧化物聚合物树脂和低熔点固体或液体的可聚合助熔聚合物基质组合物 酸酐和聚合物稀释剂或具有碳碳双键和/或官能羟基的稀释剂。 低熔点粉末与高熔点粉末的重量比为约0.50至约0.80，并且可以为约0.64至约0.75，并且可为0.665。 迄今为止，已经发现使用这些低熔点粉末与高熔点粉末的比例，实质上更高的导热性能改善。

公开(公告)号：US07686982B2

公开(公告)日：2010-03-30

申请号：US12306859

申请日：2007-06-26

Applicant: Norihito Tanaka ,  Tsuyoshi Shiratori

Inventor： Norihito Tanaka ,  Tsuyoshi Shiratori

IPC: H01B1/02 ,  H01B1/22

CPC classification number: H05K3/3484 ,  B23K35/262 ,  B23K35/30 ,  C22C13/02 ,  H05K2201/0272

Abstract: Disclosed is a conductive filler which can be fusion-bonded under lower temperature conditions (with the peak temperature of not less than 181° C.) than the reflow heat treatment conditions for an Sn-37Pb eutectic solder. This conductive filler is applicable to heat-resistant uses similar to those of the Sn-37Pb eutectic solder. The conductive filler is a mixture of first metal particles composed of an alloy having a chemical composition including 25-40% by mass of Ag, 2-8% by mass of Bi, 5-15% by mass of Cu, 2-8% by mass of In and 29-66% by mass of Sn, and second metal particles composed of an alloy having a chemical composition including 5-20% by mass of Ag, 10-20% by mass of Bi, 1-15% by mass of Cu and 50-80% by mass of Sn. In the mixture, 20-10,000 parts by mass of the second metal particles are contained per 100 parts by mass of the first metal particles.

Abstract translation: 公开了一种导电填料，其可以在比Sn-37Pb共晶焊料的回流热处理条件更低的温度条件（峰值温度不低于181℃）下进行熔融粘结。 该导电填料适用于与Sn-37Pb共晶焊料类似的耐热用途。 导电性填料是由Ag，25〜40质量％，Bi：2-8质量％，Cu：5〜15质量％，Cu：2-8质量％ 的In和29-66质量％的Sn，第二金属粒子由化学成分含有5〜20质量％的Ag，10〜20质量％的Bi，1-15质量％ Cu的质量和Sn的50〜80质量％。 在该混合物中，每100质量份的第一金属粒子含有20〜10000质量份的第二金属粒子。