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公开(公告)号：US5180513A
公开(公告)日：1993-01-19
申请号：US472634
申请日：1990-01-30
Applicant: David Durand
Inventor： David Durand
CPC classification number: H05K3/1283 , C09D11/101 , C09D11/52 , H01B1/22 , H01F41/16 , H05K1/095 , H05K3/10 , H05K3/245 , H01L2224/83101 , H05K2201/083 , H05K2203/104 , Y10S428/913 , Y10T428/23 , Y10T428/239 , Y10T428/25 , Y10T428/256 , Y10T428/263 , Y10T428/265 , Y10T428/2991 , Y10T428/31511
Abstract: A shielded plastic enclosure for housing electronic equipment is provided, on at least one interior surface thereof, with a layer of shielding composition which is a suspension of silver-coated magnetite particles in a U.V. cured cycloaliphatic epoxy resin. The layer of this shielding composition has a thickness sufficient to effectively shield against electromagnetic interference, radio frequency interference and electrostatic discharge.
Abstract translation: 在其至少一个内表面上提供用于容纳电子设备的屏蔽塑料外壳，其中一层屏蔽组合物是镀银磁铁矿颗粒悬浮于紫外线中。 固化脂环族环氧树脂。 该屏蔽组合物的层具有足以有效地屏蔽电磁干扰，射频干扰和静电放电的厚度。
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公开(公告)号：US5036128A
公开(公告)日：1991-07-30
申请号：US472192
申请日：1990-01-30
Applicant: David Durand
Inventor： David Durand
CPC classification number: H05K3/1283 , C09D11/101 , C09D11/52 , H01B1/22 , H01F41/16 , H05K1/095 , H05K3/10 , H05K3/245 , H05K2201/083 , H05K2203/104 , Y10S428/901 , Y10T428/25 , Y10T428/256
Abstract: A method for producing a circuit board involves printing a U.V. curable ink onto a substrate in a desired circuit pattern and curing the ink by exposing it to a pulsed U.V. source or subjecting the circuit pattern prepared from a U.V. curable ink containing magnetite particles to a magnetic field to move the magnetite particles to the upper surface of the U.V. curable ink. Other embodiments include circuit boards made in accordance with these methods and the use of the U.V. curable ink as a shielding composition for enclosures housing electronic equipment.
Abstract translation: 制造电路板的方法包括： 可固化油墨以期望的电路图案在基材上，并通过将其暴露于脉冲的U.V. 来源或经受由U.V.制备的电路图案。 含有磁铁矿颗粒的可固化油墨到磁场以将磁铁矿颗粒移动到紫外线的上表面。 可固化油墨。 其他实施例包括根据这些方法制造的电路板和使用U.V. 作为容纳电子设备的外壳的屏蔽组合物的可固化油墨。
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公开(公告)号：US4983804A
公开(公告)日：1991-01-08
申请号：US454331
申请日：1989-12-21
Applicant: Hinghung A. Chan , Michael A. Oien
Inventor： Hinghung A. Chan , Michael A. Oien
CPC classification number: H05K1/0212 , B23K1/002 , H05K13/0465 , H05K3/3436 , H01L2224/11334 , H05K1/0206 , H05K2201/0215 , H05K2201/083 , H05K2201/10234 , H05K2201/10666 , H05K2201/10719 , H05K2201/10734 , H05K2203/101 , H05K2203/104 , H05K3/3431 , H05K3/3447 , H05K3/3494 , H05K3/363 , Y02P70/613
Abstract: Disclosed is a method for selective soldering of components by inductive heating. A ferromagnetic material is provided as part of the components so that an applied electromagnetic field will create sufficient heat to melt the solder. The Curie temperature of the material is chosen to be just above the melting temperature of the solder to regulate the amount of heating.
Abstract translation: 公开了一种通过感应加热选择性地焊接部件的方法。 提供铁磁材料作为部件的一部分，使得施加的电磁场将产生足够的热量来熔化焊料。 材料的居里温度选择为高于焊料的熔化温度以调节加热量。
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公开(公告)号：US4795870A
公开(公告)日：1989-01-03
申请号：US745936
申请日：1985-06-18
Applicant: John F. Krumme , Mark J. Cowell
Inventor： John F. Krumme , Mark J. Cowell
IPC: H01B5/00 , H01B5/02 , H01L23/32 , H01R4/02 , H01R33/76 , H01R43/02 , H02G5/02 , H05K1/02 , H05K1/11 , H05K3/34 , H05B6/44
CPC classification number: H02G5/02 , H01R43/0242 , H05K1/0212 , H01R43/02 , H05K1/0242 , H05K2201/083 , H05K2201/10272 , H05K2201/10325 , H05K2201/10689 , H05K2203/104 , H05K2203/1115 , H05K3/3421 , H05K3/3494
Abstract: A self-heating and self-soldering bus bar for use in many applications. The pins of the bus bar are quickly and directly heated to a predetermined autoregulated temperature without significantly raising the temperature of the body of the bus. Thusly a bus bar may be mounted while maintaining thermal balance and mechanical integrity of all work pieces. The present invention avoids the problems normally associated with excess thermal expansion experienced when a bus bar is heated incidental to the heating of its contact points. A majority of this incidental heating is eliminated by direct quick heating of the mounting pins.
Abstract translation: 一种用于许多应用的自加热和自焊母线。 汇流条的引脚快速且直接加热到预定的自动调节温度，而不会显着提高总线主体的温度。 因此，可以在保持所有工件的热平衡和机械完整性的同时安装母线。 本发明避免了当汇流条被加热而与其接触点的加热偶然时经常发生的过量热膨胀相关的问题。 通过直接快速加热安装销来消除大部分这种偶然的加热。
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公开(公告)号：US4788404A
公开(公告)日：1988-11-29
申请号：US746796
申请日：1985-06-20
Applicant: Harold B. Kent
Inventor： Harold B. Kent
CPC classification number: H05K3/363 , H05K1/0212 , H05K1/0242 , H05K2201/049 , H05K2201/056 , H05K2201/083 , H05K2201/10727 , H05K2203/1115 , H05K2203/1581 , H05K3/28 , H05K3/3494 , H05K3/36
Abstract: A flexible circuit which may be a strap or a board or the like has a plurality of conductors exposed on one surface in a predetermined array and a heater disposed on the opposed surface so as to heat the exposed conductors. The exposed conductors may have solder or the heat activated conductive bonding material applied thereto so that the flexible circuit may be directly connected to a component, a printed circuit board, a connector or the like. If a reusable bonding material, such as solder, is employed the heater may be utilized to both connect and disconnect the flexible circuit.
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Patent Agency Ranking116.发明授权
公开(公告)号：US4778635A
公开(公告)日：1988-10-18
申请号：US98241
申请日：1987-09-18
Applicant: Charles D. Hechtman , Victor J. Velasco
Inventor： Charles D. Hechtman , Victor J. Velasco
CPC classification number: H05K3/4069 , B29C70/62 , B29C70/882 , B29K2995/0005 , H01L2924/0002 , H05K2201/083 , H05K2203/104 , Y10S425/033 , Y10T29/4921 , Y10T29/4922
Abstract: A sheet (10) of anisotropically conductive material may be fabricated by mixing a quantity of electrically conductive, ferromagnetic particles (16), typically spheres, in an uncured polymer (12). The polymer is then cured in a magnetic field which causes the particles to align in chains (14) each parallel to the lines of the field. In accordance with the invention, a spatially varying magnetic field, comprised of first and second substantially uniformly spaced regions (22 and 24) of high and low field strength, respectively, is applied to the polymer (12) during curing. The difference in the strength of the magnetic field in the first and second regions is such as to give rise to a lateral force on the particles which urges them into the first regions of high field strength where the particles align into chains. Since the first regions of high field strength are substantially uniformly spaced, the chains of particles in the polymer will be likewise substantially uniformly spaced.
Abstract translation: 可以通过将一定数量的导电的铁磁颗粒（16）（通常为球体）混合在未固化的聚合物（12）中来制造各向异性导电材料的片材（10）。 聚合物然后在磁场中固化，这导致颗粒在链条（14）中排列，每个平行于场的行。 根据本发明，在固化期间，分别由高和低场强度的第一和第二基本均匀间隔的区域（22和24）组成的空间变化的磁场施加到聚合物（12）上。 第一和第二区域中的磁场的强度的差异是使颗粒上产生横向的力，这些力促使它们进入高场强的第一区域，其中颗粒排列成链。 由于高场强的第一区域基本均匀地间隔开，所以聚合物中的颗粒链同样基本均匀地间隔开。
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公开(公告)号：US20240356462A1
公开(公告)日：2024-10-24
申请号：US18756487
申请日：2024-06-27
Applicant: CenturyLink Intellectual Property LLC
Inventor： Patrick Giagnocavo
CPC classification number: H02N2/04 , H05K1/189 , H10N35/00 , H05K2201/083 , H05K2201/10037 , H05K2201/10106 , H05K2201/10121 , H05K2201/10151
Abstract: Novel tools and techniques are provided for implementing flexible printed circuit board (“PCB”)-based mobile sensor platform. In various embodiments, a flexible PCB-based mobile sensor platform includes a body portion(s) and at least one of a microcontroller, a locomotion system, sensors, a transceiver(s), and/or the like, each disposed on the body portion(s). The locomotion system includes one or more flexible PCB portions and corresponding actuators. Based on instructions from the microcontroller, at least one actuator may cause bending and unbending of a corresponding flexible PCB portion(s) that causes the flexible PCB-based mobile sensor platform to move toward a target location within a first environment. Upon arrival, the sensors may collect sensor data regarding at least one of the target location, an object located at the target location, or a portion of the object, and the microcontroller may send the collected sensor data to an external device via the transceiver.
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公开(公告)号：US12034387B2
公开(公告)日：2024-07-09
申请号：US17882913
申请日：2022-08-08
Applicant: CenturyLink Intellectual Property LLC
Inventor： Patrick Giagnocavo
CPC classification number: H02N2/04 , H05K1/189 , H10N35/00 , H05K2201/083 , H05K2201/10037 , H05K2201/10106 , H05K2201/10121 , H05K2201/10151
Abstract: Novel tools and techniques are provided for implementing flexible printed circuit board (“PCB”)-based mobile sensor platform. In various embodiments, a flexible PCB-based mobile sensor platform includes a body portion(s) and at least one of a microcontroller, a locomotion system, sensors, a transceiver(s), and/or the like, each disposed on the body portion(s). The locomotion system includes one or more flexible PCB portions and corresponding actuators. Based on instructions from the microcontroller, at least one actuator may cause bending and unbending of a corresponding flexible PCB portion(s) that causes the flexible PCB-based mobile sensor platform to move toward a target location within a first environment. Upon arrival, the sensors may collect sensor data regarding at least one of the target location, an object located at the target location, or a portion of the object, and the microcontroller may send the collected sensor data to an external device via the transceiver.
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公开(公告)号：US20230345618A1
公开(公告)日：2023-10-26
申请号：US17660618
申请日：2022-04-25
Applicant: Microsoft Technology Licensing, LLC
Inventor： Jaejin LEE , Edward Charles LEACOCK , Charbel KHAWAND
CPC classification number: H05K1/0218 , H05K1/028 , H05K1/189 , G06F1/1681 , H05K2201/083 , H05K2201/10189
Abstract: An FPC cable assembly is provided that includes a first ground layer, a second ground layer, and at least one signal line sandwiched by the first and second ground layers. The FPC cable assembly further includes an electromagnetic shielding structure including a first magnetic layer at least partially covering and electrically grounded to the first ground layer, a second magnetic layer at least partially covering and electrically grounded to the second ground layer, and a plurality of magnetic rings magnetically engaged with and electrically contacting the first magnetic layer and the second magnetic layer so as to surround the first and second ground layers, the at least one signal line, and the first and second magnetic layers, thereby providing electromagnetic shielding of the at least one signals line.
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公开(公告)号：US20180185945A1
公开(公告)日：2018-07-05
申请号：US15924523
申请日：2018-03-19
Applicant: International Business Machines Corporation
Inventor： Xingquan Dong , Yanlong Hou , LiCen Mu , Ben Wu , WeiFeng Zhang
CPC classification number: B23K1/018 , B23K1/0016 , B23K3/04 , B23K3/08 , B23K31/02 , B23K31/12 , B23K35/02 , B23K35/0222 , B23K35/0244 , B23K35/025 , B23K35/262 , B23K35/3006 , B23K35/302 , B23K35/3033 , B23K35/3053 , B23K35/36 , B23K2101/42 , G05B2219/37215 , G05B2219/45235 , H05K3/225 , H05K3/34 , H05K3/3484 , H05K2201/083 , H05K2203/0445 , H05K2203/104 , H05K2203/163
Abstract: A processor receives solder paste information, where the solder paste information describes a solder paste used in assembly of a printed circuit board. A processor determines a minimum magnetic force required for removing the solder paste from the printed circuit board based on the solder paste information. A processor receives electromagnet information, where the electromagnet information describes an electromagnet used in cleaning of a misprint of the solder paste on the printed circuit board. A processor determines a minimum amount of power to provide the electromagnet to induce the minimum magnetic force in the electromagnet, where the determination of the amount of power is based on the electromagnet information and the minimum magnetic force. A processor adjusts an amount of power applied to the electromagnet to at least the determined minimum amount of power to clean the misprint of the solder paste from the printed circuit board.
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