Abstract:
Disclosed is a flat signal transmission cable with bundling structure, including at least one flexible circuit. The flexible circuit includes a plurality of clustered flat cable components that are formed by slitting in a direction parallel to extension direction of the flexible circuit to impose free and independent flexibility for bending to each clustered flat cable component. At least one bundling structure is formed on a lateral side edge of a predetermined clustered flat cable component of the cluster section of the flexible circuit. The bundling structure forms a fastening section. When the clustered flat cable components of the cluster section of the flexible circuit are stacked to form a bundled structure, the bundling structure bundles the plurality of clustered flat cable components and is secured by being fastened by the fastening section.
Abstract:
A lightweight radio/CD player for vehicular application and includes a case and frontal interface formed of polymer based material molded to provide details to accept audio devices and radio receivers, as well as the circuit boards required for electrical control and display. The case and frontal interface are of composite structure, including an insert molded electrically conductive wire mesh screen that has been pre-formed to contour with the molding operation. The wire mesh provides shielding and grounding of the circuit boards via exposed wire mesh pads and adjacent ground clips. The PCB architecture integrally forms a resilient beam portion adjacent an edge thereof carrying a grounding pad.
Abstract:
An electronic component mounting board, including: a substrate base made of a flat-plate-like elastic body, the substrate base having a plurality of through-holes in a manner spaced a predetermined distance apart from each other; conductive members, each of which has a main unit portion filled in the through-hole, the main unit portion having a first protrusion portion and a second protrusion portion respectively on a first end and a second end thereof, with the first protrusion portion arranged so as to protrude from a first surface of the substrate base and the second protrusion portion arranged so as to protrude from a second surface of the substrate base; a flexible substrate that is arranged on the first surface of the substrate base and that has first opening portions for penetration of the first protrusion portions; and a plurality of oval electrodes arranged on the substrate, each of which has a second opening portion for penetration of the first protrusion portion, in which the electrodes are arranged in a manner spaced apart from each other, and each of the second opening portions is formed on a first end side of each of the electrodes.
Abstract:
A flexible circuit assembly is provided which includes a flexible circuit, a substrate of a capacitive-sensing device and an electronic component that are coupled to the flexible circuit. The flexible circuit includes a first portion having a first conductive contact pad, a second portion having a second conductive contact pad, and a third portion disposed between the first portion and the second portion. The flexible circuit is configured to fold at the third portion between the first portion and the second portion so that the first conductive contact pad couples to a first conductor disposed along a first edge of the substrate and the second conductive contact pad couples to a second conductor disposed along a second edge of the substrate of the capacitive-sensing device. The first edge of the substrate of the capacitive-sensing device is non-parallel to the second edge of the substrate of the capacitive-sensing device.
Abstract:
A lightweight radio/CD player for vehicular application is virtually “fastenerless” and includes a case and frontal interface formed of polymer based material that is molded to provide details to accept audio devices such as playback mechanisms (if desired) and radio receivers, as well as the circuit boards required for electrical control and display. The case and frontal interface are of composite structure, including an insert molded electrically conductive wire mesh screen that has been pre-formed to contour with the molding operation. The wire mesh provides EMC, RFI, BCI and ESD shielding and grounding of the circuit boards via exposed wire mesh pads and adjacent ground clips. The major components and subassemblies self-interconnect by integral guide and connection features effecting “slide lock” and “snap lock” self-interconnection. The major components and subassemblies self-ground by establishing an interference fit with exposed, resilient, embossed portions of wire mesh.
Abstract:
A plurality of first output terminals is provided along one side of a circuit element, and a plurality of input terminals and a plurality of second output terminals are provided adjacently along the other opposite side thereof. Leads include a first output lead extending from the first output terminal to an output connection electrode, and a second output lead extending from the second output terminal to the output connection electrode. The second output lead is extended from the other side of the circuit element to one side of the circuit element through a surface of a flexible wiring cable opposite the circuit element and further extended in parallel with the first output lead and connected to the output connection electrode.
Abstract:
It is an object of the present invention to provide a substrate for suspension reduced in the generation of cracks in an insulating layer at the boundary region between a region where a metal supporting substrate exists and a region where no metal supporting substrate exist. The present invention solves the above object by providing a substrate for suspension comprising a first structural part including a metal supporting substrate, an insulating layer, a wiring layer, and a cover layer, and a second structural part formed so as to extend continuously from the first structural part and has no metal supporting substrate, wherein a position of an edge of an upper surface of the insulating layer coincides with a position of an edge of the lower surface of the cover layer or the position of the edge of the upper surface of the insulating layer is positioned on a side closer to the wiring layer than to the position of the edge of the lower surface of the cover layer at a boundary region between the first structural part and the second structural part.
Abstract:
A lightweight radio/CD player for vehicular application is virtually “fastenerless” and includes a case and frontal interface formed of polymer based material that is molded to provide details to accept audio devices such as playback mechanisms (if desired) and radio receivers, as well as the circuit boards required for electrical control and display. The case and frontal interface are of composite structure, including an insert molded electrically conductive wire mesh screen that has been pre-formed to contour with the molding operation. The wire mesh provides EMC, RFI, BCI and ESD shielding and grounding of the circuit boards via exposed wire mesh pads and adjacent ground clips. The PCB architecture is bifurcated into a first board carrying common circuit components in a surface mount configuration suitable for high volume production, and a second board carrying application specific circuit components in a wave soldered stick mount configuration. The major components and subassemblies are self-fixturing during the final assembly process, eliminating the need for dedicated tools, fixtures and assembly equipment. The major components and subassemblies self-interconnect by integral guide and connection features effecting “slide lock” and “snap lock” self-interconnection. The radio architecture includes improved push buttons employing 4-bar living hinge linkage and front loaded decorative trim buttons.
Abstract:
To provide a method for manufacturing a plurality of types of illuminating devices having different specifications while reducing cost. A substrate includes a common flexible portion and a plurality of units bendable with respect to the common portion, where the common portion includes a pad that is extended in the horizontal direction in the plane of the drawing and that is arranged for every predefined interval. In the present manufacturing method, a substrate piece is created by cutting the substrate mounted with the light emitting element in a first direction, the common portion in the substrate piece is formed according to the illuminating device to be manufactured, the relative position of the individual portion with respect to the formed common portion is respectively positioned, and the wiring for supplying power to the pad in the substrate piece is formed.
Abstract:
A circuit board comprising a circuit carrier, a cover layer composed of a nonconductive material, comprising an organic substance, arranged on the circuit carrier, a first metallization layer at least partly arranged on the cover layer, wherein the first metallization layer has a flexible region.