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公开(公告)号：US09748611B2
公开(公告)日：2017-08-29
申请号：US14311489
申请日：2014-06-23
Applicant: Infineon Technologies AG
Inventor： Klaus Elian , Jochen Dangelmaier , Manfred Fries , Juergen Hoegerl , Georg Meyer-Berg , Thomas Mueller , Guenther Ruhl , Horst Theuss , Mathias Vaupel
CPC classification number: H01M10/48 , G01R31/3689 , H01M6/505 , H01M10/488
Abstract: An apparatus for determining a state of a rechargeable battery or of a battery has a sensor device and an evaluation device. The sensor device brings about an interaction between an optical signal and a part of the rechargeable battery or of the battery, which part indicates optically acquirable information about a state of the rechargeable battery or of the battery, and detects an optical signal caused by the interaction. The sensor device furthermore provides a detection signal having information about the detected optical signal. The evaluation device determines information about a state of the rechargeable battery or of the battery on the basis of the information of the detection signal. Furthermore, the evaluation device provides a state signal having the information about the determined state.
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公开(公告)号：US20170108583A1
公开(公告)日：2017-04-20
申请号：US15390060
申请日：2016-12-23
Applicant: Infineon Technologies AG
Inventor： Klaus Elian , Horst Theuss
IPC: G01S7/521 , H01L41/053 , H01L41/09
Abstract: Embodiments relate to integrated sonic sensors having a transmitter, a receiver and driver electronics integrated in a single, functional package. In one embodiment, a piezoelectric signal transmitter, a silicon microphone receiver and a controller/amplifier chip are concomitantly integrated in a semiconductor housing. The semiconductor housing, in embodiments, is functional in that at least a portion of the housing can comprise the piezoelectric element of the transmitter, with an inlet aperture opposite the silicon microphone receiver.
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公开(公告)号：US20170101308A1
公开(公告)日：2017-04-13
申请号：US15388557
申请日：2016-12-22
Applicant: Infineon Technologies AG
Inventor： Klaus Elian , Horst Theuss
CPC classification number: H01L21/563 , B81B7/0038 , B81B7/0058 , B81B2201/0264 , B81B2207/012 , B81C1/00285 , B81C2203/0118 , H01L2224/48091 , H01L2924/00014
Abstract: A packaged includes a flip-chip assembly. The flip-chip assembly includes a first semiconductor substrate having at least one integrated semiconductor device, and a second substrate connected to the first substrate. A main surface of the first semiconductor substrate faces and is spaced apart from the second substrate. The packaged semiconductor device further includes a parylene coating covering outer surfaces of the first semiconductor substrate and the second substrate. A first section of the main surface is exposed from the parylene coating.
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公开(公告)号：US09567211B2
公开(公告)日：2017-02-14
申请号：US14687835
申请日：2015-04-15
Applicant: Infineon Technologies AG
Inventor： Franz-Peter Kalz , Horst Theuss , Bernhard Winkler , Khalil Hosseini , Joachim Mahler , Manfred Mengel
CPC classification number: B81B7/02 , B81B3/0021 , B81B3/0072 , B81B2201/0235 , B81B2201/0264 , B81C2203/0154 , G01L1/18 , G01L9/0072 , G01L19/0092 , G01L19/02
Abstract: Micromechanical semiconductor sensing device comprises a micromechanical sensing structure being configured to yield an electrical sensing signal, and a piezoresistive sensing device provided in the micromechanical sensing structure, said piezoresistive sensing device being arranged to sense a mechanical stress disturbing the electrical sensing signal and being configured to yield an electrical disturbance signal based on the sensed mechanical stress disturbing the electrical sensing signal.
Abstract translation: 微机械半导体感测装置包括被配置为产生电感测信号的微机械感测结构和设置在微机械感测结构中的压阻感测装置，所述压阻感测装置被布置成感测扰动电感测信号的机械应力，并被配置为 基于感测到的电感测信号的机械应力产生电干扰信号。
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125.发明授权公开(公告)号：US09561953B1
公开(公告)日：2017-02-07
申请号：US14833871
申请日：2015-08-24
Applicant: Infineon Technologies AG
Inventor： Klaus Elian , Horst Theuss
CPC classification number: H01L21/563 , B81B7/0038 , B81B7/0058 , B81B2201/0264 , B81B2207/012 , B81C1/00285 , B81C2203/0118 , H01L2224/48091 , H01L2924/00014
Abstract: A first semiconductor substrate having at least one integrated semiconductor device is provided. A lift-off layer is formed on a main surface of the first semiconductor substrate. The lift-off layer is patterned so as to form openings in the lift-off layer that are arranged on either side of a first portion of the lift-off layer. The first substrate is connected together with a second substrate by an interconnect structure to form an assembly with the main surface of the first semiconductor substrate being exposed. Exposed surfaces of the assembly are coated with a parylene coating, with a first portion of the parylene coating being supported by the first portion of the lift-off layer. The first portion of the parylene coating is selectively removed using a lift-off technique that removes the first portion of the lift-off layer. The lift-off technique is performed after connecting the first substrate and second substrates together.
Abstract translation: 提供具有至少一个集成半导体器件的第一半导体衬底。 在第一半导体衬底的主表面上形成剥离层。 剥离层被图案化以在剥离层中形成布置在剥离层的第一部分的任一侧上的开口。 第一衬底通过互连结构与第二衬底连接在一起，以形成暴露第一半导体衬底的主表面的组件。 组件的暴露表面涂覆有聚对二甲苯涂层，聚对二甲苯涂层的第一部分由剥离层的第一部分支撑。 使用去除剥离层的第一部分的剥离技术选择性地除去聚对二甲苯涂层的第一部分。 在将第一基板和第二基板连接在一起之后进行剥离技术。
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Patent Agency Ranking
公开(公告)号：US09557417B2
公开(公告)日：2017-01-31
申请号：US14969848
申请日：2015-12-15
Applicant: Infineon Technologies AG
Inventor： Klaus Elian , Horst Theuss
CPC classification number: G01S7/521 , B81B7/0061 , B81B2201/0257 , B81B2207/012 , G01S15/08 , G01S15/10 , G10K11/004 , H01L41/053 , H01L41/0973 , H04R2201/003
Abstract: Embodiments relate to integrated sonic sensors having a transmitter, a receiver and driver electronics integrated in a single, functional package. In one embodiment, a piezoelectric signal transmitter, a silicon microphone receiver and a controller/amplifier chip are concomitantly integrated in a semiconductor housing. The semiconductor housing, in embodiments, is functional in that at least a portion of the housing can comprise the piezoelectric element of the transmitter, with an inlet aperture opposite the silicon microphone receiver.
Abstract translation: 实施例涉及具有集成在单个功能封装中的发射器，接收器和驱动器电子器件的集成声波传感器。 在一个实施例中，压电信号发射器，硅麦克风接收器和控制器/放大器芯片同时集成在半导体外壳中。 在实施例中，半导体外壳的功能在于，壳体的至少一部分可以包括发射器的压电元件，具有与硅麦克风接收器相对的入口孔。
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公开(公告)号：US20170003180A1
公开(公告)日：2017-01-05
申请号：US15268244
申请日：2016-09-16
Applicant: Infineon Technologies AG
Inventor： Franz-Peter Kalz , Horst Theuss , Bernhard Winkler , Khalil Hosseini , Joachim Mahler , Manfred Mengel
CPC classification number: B81B7/02 , B81B3/0021 , B81B3/0072 , B81B2201/0235 , B81B2201/0264 , B81C2203/0154 , G01L1/18 , G01L9/0072 , G01L19/0092 , G01L19/02
Abstract: A micromechanical semiconductor sensing device is disclosed. In an embodiment the sensing device includes a micromechanical sensing structure being configured to yield an electrical sensing signal, and a piezoresistive sensing device provided in the micromechanical sensing structure, the piezoresistive sensing device being arranged to sense a mechanical stress disturbing the electrical sensing signal and being configured to yield an electrical disturbance signal based on the sensed mechanical stress disturbing the electrical sensing signal.
Abstract translation: 公开了一种微机械半导体感测装置。 在一个实施例中，感测装置包括微机械感测结构，其被配置为产生电感测信号，以及设置在微机械感测结构中的压阻感测装置，所述压阻感测装置布置成感测扰动电感测信号的机械应力， 被配置为基于感测到的电感测信号的机械应力产生电干扰信号。
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128.发明授权Surface mountable microphone package, a microphone arrangement, a mobile phone and a method for recording microphone signals 有权表面安装麦克风封装，麦克风布置，移动电话和用于记录麦克风信号的方法公开(公告)号：US09432759B2
公开(公告)日：2016-08-30
申请号：US14065067
申请日：2013-10-28
Applicant: Infineon Technologies AG
Inventor： Klaus Elian , Horst Theuss , Thomas Mueller
CPC classification number: H04R1/083 , B81B7/0061 , B81B2201/0257 , H01L2224/95 , H01L2924/14 , H01L2924/1461 , H01L2924/15 , H01L2924/181 , H01L2924/19106 , H04R1/04 , H04R1/406 , H04R19/005 , H04R2201/003 , H04R2410/05 , H04R2499/11
Abstract: A surface mountable microphone package comprises a first microphone and a second microphone. Furthermore, the surface mountable microphone package comprises a first opening for the first microphone and a second opening for the second microphone. The first opening and the second opening are arranged on opposite sides of the surface mountable microphone package.
Abstract translation: 表面可安装麦克风包包括第一麦克风和第二麦克风。 此外，表面可安装麦克风封装包括用于第一麦克风的第一开口和用于第二麦克风的第二开口。 第一开口和第二开口布置在可表面安装的麦克风封装的相对侧上。
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129.发明申请PRESSURE SENSOR MODULE HAVING A SENSOR CHIP AND PASSIVE DEVICES WITHIN A HOUSING 审中-公开带传感器芯片的压力传感器模块和外壳中的被动设备公开(公告)号：US20160169763A1
公开(公告)日：2016-06-16
申请号：US14945661
申请日：2015-11-19
Applicant: Infineon Technologies AG
Inventor： Mathias Vaupel , Matthias Boehm , Steven Gross , Markus Loehndorf , Stephan Schmitt , Horst Theuss , Helmut Wietschorke
CPC classification number: G01L19/0084 , G01L19/147 , G01L19/148
Abstract: A pressure sensor module including a housing, a pressure sensor chip, and one or more of an integrated passive device (IDP) chip and discrete passive devices are disclosed. The pressure sensor chip and one or more of the IPD chip and the discrete passive devices are arranged within the housing.
Abstract translation: 公开了一种包括壳体，压力传感器芯片以及集成无源器件（IDP）芯片和分立无源器件中的一个或多个的压力传感器模块。 压力传感器芯片和一个或多个IPD芯片和分立无源器件布置在壳体内。
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公开(公告)号：US20150287788A1
公开(公告)日：2015-10-08
申请号：US14745428
申请日：2015-06-20
Applicant: Infineon Technologies AG
Inventor： Klaus Elian , Guenther Ruhl , Horst Theuss , Irmgard Escher-Poeppel
IPC: H01L29/16 , H01L23/00 , H01L23/495 , H01L23/29 , H01L23/31
CPC classification number: H01L29/1606 , G01N27/127 , G01N33/0059 , H01L21/561 , H01L21/568 , H01L23/28 , H01L23/293 , H01L23/3135 , H01L23/315 , H01L23/49562 , H01L24/13 , H01L24/16 , H01L24/24 , H01L24/48 , H01L24/49 , H01L24/94 , H01L24/96 , H01L2224/02379 , H01L2224/0346 , H01L2224/0401 , H01L2224/04042 , H01L2224/05548 , H01L2224/12105 , H01L2224/13022 , H01L2224/13024 , H01L2224/13111 , H01L2224/16225 , H01L2224/16227 , H01L2224/24011 , H01L2224/24105 , H01L2224/24226 , H01L2224/48245 , H01L2224/48247 , H01L2224/48465 , H01L2224/94 , H01L2224/96 , H01L2924/00014 , H01L2924/12042 , H01L2924/181 , H01L2924/1815 , H01L2224/11 , H01L2924/01082 , H01L2924/01047 , H01L2924/01029 , H01L2924/01028 , H01L2924/01079 , H01L2924/01083 , H01L2924/00 , H01L2224/45099 , H01L2924/00012
Abstract: A graphene layer is generated on a substrate. A plastic material is deposited on the graphene layer to at least partially cover the graphene layer. The substrate is separated into at least two substrate pieces.
Abstract translation: 在基板上产生石墨烯层。 在石墨烯层上沉积塑料材料以至少部分地覆盖石墨烯层。 将基板分成至少两个基片。
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