公开(公告)号：US09254992B2

公开(公告)日：2016-02-09

申请号：US13863269

申请日：2013-04-15

Applicant: Tao Ju

Inventor： Tao Ju

IPC: B81C3/00 ,  B81B3/00 ,  G01C19/56 ,  H01L29/82 ,  G01P15/105

CPC classification number: B81B3/0032 ,  B81B2201/0235 ,  B81B2201/0242 ,  G01C19/56 ,  G01C19/5755 ,  G01C19/5769 ,  G01P15/105 ,  H01L29/82 ,  H01L2924/1461

Abstract: A MEMS gyro is provided, having a movable portion, a non-movable portion, and a magnetic sensing structure that comprises a magnetic source disposed at the movable portion, a magnetic sensing element positioned at the non-movable portion. The movable portion is capable of moving in response to external angular velocity or an external accelerator such that the magnetic field sensed by the magnetic sensing element is in relation to the movement of the movable portion, therefore, the angular velocity or the accelerator. A method of making the MEMS gyro device is disclosed herein.

Abstract translation: 提供了一种MEMS陀螺仪，其具有可移动部分，不可移动部分和包括设置在可动部分处的磁源的磁感测结构，位于不可移动部分的磁感应元件。 可移动部分能够响应于外部角速度或外部加速器移动，使得由磁感测元件感测的磁场相对于可移动部分的运动，因此角速度或加速器。 本文公开了制造MEMS陀螺仪装置的方法。

公开(公告)号：US09246018B2

公开(公告)日：2016-01-26

申请号：US13821842

申请日：2011-09-18

Applicant: Cenk Acar

Inventor： Cenk Acar

IPC: G01P21/02 ,  H01L29/84 ,  G01C19/5755 ,  G01P15/125 ,  G01P15/18 ,  G01P15/08

CPC classification number: H01L29/84 ,  B81B7/04 ,  B81B2201/0235 ,  B81B2201/0242 ,  B81B2203/051 ,  B81B2203/053 ,  B81B2203/055 ,  B81B2203/056 ,  B81B2203/058 ,  B81B2207/094 ,  G01C19/5755 ,  G01P15/125 ,  G01P15/18 ,  G01P2015/0848

Abstract: This document discusses, among other things, a cap wafer and a via wafer configured to encapsulate a single proof-mass 3-axis gyroscope formed in an x-y plane of a device layer. The single proof-mass 3-axis gyroscope can include a main proof-mass section suspended about a single, central anchor, the main proof-mass section including a radial portion extending outward towards an edge of the 3-axis gyroscope sensor, a central suspension system configured to suspend the 3-axis gyroscope from the single, central anchor, and a drive electrode including a moving portion and a stationary portion, the moving portion coupled to the radial portion, wherein the drive electrode and the central suspension system are configured to oscillate the 3-axis gyroscope about a z-axis normal to the x-y plane at a drive frequency.

Abstract translation: 本文件尤其讨论了盖晶片和通孔晶片，其被配置为封装形成在器件层的x-y平面中的单个校准质量3轴陀螺仪。 单个质量3轴陀螺仪可以包括悬挂在单个中心锚杆上的主要质量部分，主要质量部分包括朝向3轴陀螺仪传感器的边缘向外延伸的径向部分，中心 悬架系统，其构造成将三轴陀螺仪从单个中心锚固件悬挂起来;以及驱动电极，其包括移动部分和固定部分，所述移动部分联接到所述径向部分，其中所述驱动电极和所述中央悬挂系统被配置 以驱动频率使三轴陀螺仪围绕垂直于xy平面的z轴摆动。

公开(公告)号：US09227837B2

公开(公告)日：2016-01-05

申请号：US14609737

申请日：2015-01-30

Applicant: Robert Bosch GmbH

Inventor： Jochen Reinmuth

IPC: H01L29/84 ,  B81B7/00 ,  B81C1/00 ,  B81B5/00 ,  B81B3/00

CPC classification number: B81B7/0048 ,  B81B3/0048 ,  B81B3/0054 ,  B81B5/00 ,  B81B7/0006 ,  B81B7/0016 ,  B81B2201/0235 ,  B81B2201/0242 ,  B81C1/0015 ,  B81C1/0019 ,  B81C1/00198 ,  B81C1/00325 ,  B81C1/00666

Abstract: A sensor includes: a substrate, a microelectromechanical structure, and a decoupling structure. The decoupling structure is anchored on the substrate, and the microelectromechanical structure is anchored on the decoupling structure. The microelectromechanical structure and the decoupling structure are movable in relation to the substrate. The decoupling structure is situated between the microelectromechanical structure and the substrate.

Abstract translation: 传感器包括：基板，微机电结构和解耦结构。 解耦结构锚定在基板上，微机电结构锚定在去耦结构上。 微机电结构和去耦结构可以相对于衬底移动。 解耦结构位于微机电结构和基片之间。

公开(公告)号：US20150355220A1

公开(公告)日：2015-12-10

申请号：US14690839

申请日：2015-04-20

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Pil Joong KANG ,  Jung Won LEE ,  Hyun Kee LEE ,  Jong Hyeong SONG

IPC: G01P15/12 ,  G01P15/093 ,  G01P15/125 ,  G01P15/02

CPC classification number: G01P15/123 ,  B81B2201/0235 ,  B81B2201/0242 ,  B81C1/00269 ,  B81C2203/0109 ,  B81C2203/035 ,  G01C19/56 ,  G01P15/09 ,  G01P15/093 ,  G01P15/125 ,  G01P15/18 ,  G01P2015/0842

Abstract: There are provided an inertial sensor module having a hermetic seal formed of metal and a multi-axis sensor employing the same. The inertial sensor module includes: a sensor main body including a plurality of wirings connected to any one of a driving electrode of a sensor and a sensing electrode of the sensor and formed on a substrate for a lower cap by a wafer level package (WLP) scheme to detect an inertial force; a substrate for an upper cap bonded on the sensor main body to protect the sensor main body; and a hermetic seal formed of metal isolated from the wiring and interposed into the sensor main body and the substrate for the upper cap by performing the bonding by metal bonding.

Abstract translation: 提供了一种惯性传感器模块，其具有由金属形成的气密密封件和使用其的多轴传感器。 惯性传感器模块包括：传感器主体，包括连接到传感器的驱动电极和传感器的感测电极中的任何一个的多个布线，并且通过晶片级封装（WLP）形成在用于下盖的基板上， 检测惯性力的方案; 用于上盖的基板，其接合在所述传感器主体上以保护所述传感器主体; 以及通过金属接合进行接合而由与配线隔离并插入到传感器主体和上盖的基板中的金属形成的气密密封。

公开(公告)号：US20150316582A1

公开(公告)日：2015-11-05

申请号：US14696709

申请日：2015-04-27

Applicant: Seiko Epson Corporation

Inventor： Satoru TANAKA

IPC: G01P15/125

CPC classification number: B81B3/0051 ,  B81B2201/0235 ,  B81B2203/0181 ,  G01C19/5656 ,  G01P15/125 ,  G01P2015/0814

Abstract: An acceleration sensor includes a substrate, a support beam, a weight body a stationary section and an engaging section. The weight body is divided into a first weight section and a second weight section based on the support beam as a boundary line, and the first weight section and the second weight section have different weights from each other. The first weight section and the second weight section include a facing section which faces a side of the engaging section opposite to a side facing the support beam. In an X axis direction intersecting the Y axis direction, if a distance between a corner section of the engaging section in the vicinity of one end portion and the support beam is L1 and a distance between the engaging section and the facing section is L2, a relational expression, L1>L2 is satisfied.

Abstract translation: 加速度传感器包括基板，支撑梁，重量体，固定部和接合部。 基于作为边界线的支撑梁将配重体分为第一重物部分和第二重量部分，第一重量部分和第二重量部分具有彼此不同的重量。 第一重物部分和第二重量部分包括面对部分，其面向接合部分与面向支撑梁的一侧相对的一侧。 在与Y轴方向交叉的X轴方向上，如果一端部附近的接合部的角部与支撑梁之间的距离为L1，并且接合部与面对部之间的距离为L2，则 关系式L1> L2满足。

公开(公告)号：US09176157B2

公开(公告)日：2015-11-03

申请号：US13705680

申请日：2012-12-05

Applicant: Maxim Integrated Products, Inc.

Inventor： Barbara Simoni ,  Luca Coronato ,  Gabriele Cazzaniga

IPC: G01P15/125 ,  G01P1/00 ,  B81B7/00 ,  G01P15/08

CPC classification number: G01P1/00 ,  B81B7/0048 ,  B81B2201/0235 ,  B81B2203/058 ,  G01P1/006 ,  G01P15/125 ,  G01P2015/0831

Abstract: The invention relates to a microelectromechanical structure, and more particularly, to systems, devices and methods of compensating the effect of the thermo-mechanical stress by incorporating and adjusting elastic elements that are used to couple a moveable proof mass to anchors. The proof mass responds to acceleration by displacing and tilting with respect to a moveable mass rotational axis. The thermo-mechanical stress is accumulated in the structure during the courses of manufacturing, packaging and assembly or over the structure's lifetime. The stress causes a displacement on the proof mass. A plurality of elastic elements is coupled to support the proof mass. Geometry and configuration of these elastic elements are adjusted to reduce the displacement caused by the thermo-mechanical stress.

Abstract translation: 本发明涉及一种微机电结构，更具体地说，涉及通过结合和调节弹性元件来补偿热机械应力的影响的系统，装置和方法，所述弹性元件用于将可移动的检验质量物料联接到锚定件。 证明质量通过相对于可移动的质量旋转轴的移位和倾斜来响应于加速度。 在制造，包装和组装过程中或结构的使用寿命期间，热机械应力累积在结构中。 应力会导致检测质量发生位移。 多个弹性元件被联接以支撑证明物质。 调整这些弹性元件的几何形状和结构，以减少由热机械应力引起的位移。

公开(公告)号：US20150298966A1

公开(公告)日：2015-10-22

申请号：US14257553

申请日：2014-04-21

Applicant: PHILIP H. BOWLES ,  STEPHEN R. HOOPER

Inventor： PHILIP H. BOWLES ,  STEPHEN R. HOOPER

IPC: B81B7/02 ,  B81C1/00

CPC classification number: B81B7/02 ,  B81B2201/0235 ,  B81B2201/0242 ,  B81B2201/0292 ,  B81B2207/07 ,  B81C1/0023 ,  B81C2203/0154 ,  B81C2203/0792 ,  H01L2224/05554 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00012

Abstract: A small area semiconductor device package containing two or more MEMS sensor device die and a controller die for the sensor devices is provided. The controller die is mounted on top of the largest MEMS sensor device die (e.g., a gyroscope) and over a second MEMS sensor device die (e.g., an accelerometer). In one embodiment, the controller die is also mounted on the top of the second MEMS sensor device die. In another embodiment, the controller die overhangs the second MEMS sensor device die, which is of a lesser thickness than the first MEMS sensor device die.

Abstract translation: 提供了一种包含两个或更多个MEMS传感器器件管芯和用于传感器器件的控制器管芯的小面积半导体器件封装。 控制器管芯安装在最大的MEMS传感器器件管芯（例如，陀螺仪）的顶部上，并且安装在第二MEMS传感器器件管芯（例如，加速度计）上。 在一个实施例中，控制器管芯也安装在第二MEMS传感器器件管芯的顶部上。 在另一个实施例中，控制器模具突出第二MEMS传感器器件管芯，该第二MEMS传感器器件管芯的厚度小于第一MEMS传感器器件管芯的厚度。

公开(公告)号：US20150274512A1

公开(公告)日：2015-10-01

申请号：US14641657

申请日：2015-03-09

Applicant: Semiconductor Manufacturing International (Shanghai) Corporation

Inventor： WEI XU ,  GUOAN LIU

IPC: B81B7/00 ,  B81C1/00

CPC classification number: B81B7/0074 ,  B81B2201/0235 ,  B81B2201/0264 ,  B81C1/00182 ,  B81C1/00214

Abstract: The present disclosure provides MEMS devices and their fabrication methods. A first dielectric layer is formed on a first substrate including integrated circuits therein. One or more first metal connections and second metal connections are formed in the first dielectric layer and are electrically connected to the integrated circuits. A second dielectric layer is formed on the first dielectric layer. An acceleration sensor is formed in the second dielectric layer to electrically connect to the one or more first metal connections. A second substrate is bonded to the second dielectric layer. One or more first metal vias are formed in the second substrate and in the second dielectric layer to electrically connect to the second metal connections. A pressure sensor is formed on the second substrate to electrically connect to the first metal vias.

Abstract translation: 本公开提供了MEMS器件及其制造方法。 在其上包括集成电路的第一基板上形成第一电介质层。 一个或多个第一金属连接和第二金属连接形成在第一电介质层中并且电连接到集成电路。 在第一电介质层上形成第二电介质层。 加速度传感器形成在第二电介质层中以电连接到一个或多个第一金属连接。 第二基板结合到第二介电层。 一个或多个第一金属通孔形成在第二基板和第二电介质层中以电连接到第二金属连接。 压力传感器形成在第二基板上以电连接到第一金属通孔。

公开(公告)号：US20150274504A1

公开(公告)日：2015-10-01

申请号：US14736327

申请日：2015-06-11

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Masahiro KITAI ,  Masayuki ICHIMARU

IPC: B81B3/00 ,  G01P15/08 ,  G01P15/12

CPC classification number: B81B3/0051 ,  B81B3/0021 ,  B81B2201/0235 ,  G01P15/0888 ,  G01P15/123 ,  H01L29/84

Abstract: An angular acceleration sensor includes a planar surface extending along an X-Y plane, a fixed portion, a weight, a beam, and piezoresistors. The weight is supported by the fixed portion. The beam extends along a Y-axis and is connected to the fixed portion and the weight. A width of the beam in an X-axis direction is larger than a width of the connection portion at which the beam is connected to the fixed portion.

Abstract translation: 角加速度传感器包括沿X-Y平面延伸的平面，固定部分，重量，梁和压电电阻。 重量由固定部分支撑。 梁沿着Y轴延伸并连接到固定部分和重物上。 光束在X轴方向上的宽度大于连接部分的光束与固定部分的连接部分的宽度。

公开(公告)号：US20150260517A1

公开(公告)日：2015-09-17

申请号：US14553595

申请日：2014-11-25

Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE

Inventor： Chung-Yuan SU ,  Chun-Yin TSAI ,  Chao-Ta HUANG

IPC: G01C19/06 ,  B81B3/00

CPC classification number: G01C19/5762 ,  B81B3/0045 ,  B81B2201/0235 ,  B81B2201/0242 ,  B81B2203/0163 ,  Y10T74/12

Abstract: A micro-electromechanical apparatus includes a rotary element, at least one restraint and at least two folded springs. The rotary element is capable of rotating with respect to an axis. The folded springs are symmetrically disposed about the axis. Each folded spring has a moving end and a fixed end, the moving end is connected to the rotary element, and the fixed end is connected to the at least one restraint. The moving end is not located on the axis, and the fixed end is not located on the axis. A moving distance is defined as a distance between the moving end and the axis, a fixed distance is defined as a distance between the fixed end and the axis. A spring length is defined as a distance between the moving end and the fixed end. The spring length is varied according to the rotation of the rotary element.

Abstract translation: 微机电装置包括旋转元件，至少一个约束件和至少两个折叠弹簧。 旋转元件能够相对于轴线旋转。 折叠弹簧围绕轴对称设置。 每个折叠弹簧具有移动端和固定端，移动端连接到旋转元件，并且固定端连接到至少一个约束。 移动端不在轴上，固定端不在轴上。 移动距离被定义为移动端和轴之间的距离，固定距离被定义为固定端与轴之间的距离。 弹簧长度被定义为移动端与固定端之间的距离。 弹簧长度根据旋转元件的旋转而变化。