公开(公告)号：US20050067292A1

公开(公告)日：2005-03-31

申请号：US10841006

申请日：2004-05-07

Applicant: Jeffrey Thompson ,  Adam Cohen ,  Michael Lockard ,  Dennis Smalley

Inventor： Jeffrey Thompson ,  Adam Cohen ,  Michael Lockard ,  Dennis Smalley

IPC: B81C1/00 ,  C25D5/02

CPC classification number: C25D1/003 ,  B81C1/00373 ,  B81C2201/0181 ,  B81C2201/019

Abstract: Multilayer structures are electrochemically fabricated on a temporary (e.g. conductive) substrate and are thereafter bonded to a permanent (e.g. dielectric, patterned, multi-material, or otherwise functional) substrate and removed from the temporary substrate. In some embodiments, the structures are formed from top layer to bottom layer, such that the bottom layer of the structure becomes adhered to the permanent substrate, while in other embodiments the structures are formed from bottom layer to top layer and then a double substrate swap occurs. The permanent substrate may be a solid that is bonded (e.g. by an adhesive) to the layered structure or it may start out as a flowable material that is solidified adjacent to or partially surrounding a portion of the structure with bonding occurring during solidification. The multilayer structure may be released from a sacrificial material prior to attaching the permanent substrate or it may be released after attachment.

Abstract translation: 多层结构在临时的（例如导电的）衬底上电化学地制造，然后在永久（例如电介质，图案化，多材料或其他功能）的衬底上结合并从临时衬底去除。 在一些实施例中，结构由顶层到底层形成，使得结构的底层变得粘附到永久性基底上，而在其它实施例中，结构由底层到顶层形成，然后是双层衬底交换 发生。 永久性基材可以是与层状结构结合的固体（例如通过粘合剂），或者可以作为在凝固期间发生结合而邻近或部分地围绕结构的一部分固化的可流动材料开始。 多层结构可以在附着永久性基底之前从牺牲材料上释放，或者在附着后可以释放多层结构。

公开(公告)号：US20040065553A1

公开(公告)日：2004-04-08

申请号：US10677549

申请日：2003-10-01

Applicant: University of Southern California

Inventor： Adam L. Cohen

IPC: C25D005/02

CPC classification number: C25D5/10 ,  B33Y10/00 ,  B33Y70/00 ,  B81C1/00126 ,  B81C2201/0181 ,  B81C2201/0197 ,  B81C2201/032 ,  C25D1/00 ,  C25D1/003 ,  C25D5/022 ,  C25D5/12 ,  C25D5/22 ,  C25D17/06 ,  H01L21/2885 ,  H05K3/241 ,  Y10T428/12486 ,  Y10T428/239

Abstract: An electroplating method that includes: a) contacting a first substrate with a first article, which includes a substrate and a conformable mask disposed in a pattern on the substrate; b) electroplating a first metal from a source of metal ions onto the first substrate in a first pattern, the first pattern corresponding to the complement of the conformable mask pattern; and c) removing the first article from the first substrate, is disclosed. Electroplating articles and electroplating apparatus are also disclosed.

Abstract translation: 一种电镀方法，包括：a）使第一衬底与第一制品接触，所述第一制品包括衬底和以衬底形式设置的贴合掩模; b）以第一图案将来自金属离子源的第一金属电镀到所述第一基板上，所述第一图案对应于所述适形掩模图案的所述补体; 和c）从第一基板上去除第一制品。 还公开了电镀制品和电镀装置。

公开(公告)号：US20040004002A1

公开(公告)日：2004-01-08

申请号：US10434493

申请日：2003-05-07

Applicant: MEMGen Corporation

Inventor： Jeffrey A. Thompson ,  Adam L. Cohen ,  Michael S. Lockard ,  Dennis R. Smalley

IPC: C25D005/02

CPC classification number: B81C1/00126 ,  B33Y10/00 ,  B33Y70/00 ,  B81C2201/0181 ,  B81C2201/0188 ,  B81C2201/019

Abstract: Multilayer structures are electrochemically fabricated on a temporary (e.g. conductive) substrate and are thereafter bonded to a permanent (e.g. dielectric, patterned, multi-material, or otherwise functional) substrate and removed from the temporary substrate. In some embodiments, the structures are formed from top layer to bottom layer, such that the bottom layer of the structure becomes adhered to the permanent substrate, while in other embodiments the structures are form from bottom layer to top layer and then a double substrate swap occurs. The permanent substrate may be a solid that is bonded (e.g. by an adhesive) to the layered structure or it may start out as a flowable material that is solidified adjacent to or partially surrounding a portion of the structure with bonding occurs during solidification. The multilayer structure may be released from a sacrificial material prior to attaching the permanent substrate or it may be released after attachment.

Abstract translation: 多层结构在临时的（例如导电的）衬底上电化学地制造，然后在永久（例如电介质，图案化，多材料或其他功能）的衬底上结合并从临时衬底去除。 在一些实施例中，结构由顶层到底层形成，使得结构的底层变得粘附到永久性基底上，而在其它实施例中，结构是从底层到顶层形成的，然后是双层衬底交换 发生。 永久性基材可以是与层状结构结合的固体（例如通过粘合剂），或者可以作为在凝固期间发生结合而在结构的一部分附近凝固的可流动材料开始。 多层结构可以在附着永久性基底之前从牺牲材料上释放，或者在附着后可以释放多层结构。

公开(公告)号：US20020086101A1

公开(公告)日：2002-07-04

申请号：US10036611

申请日：2001-12-31

Inventor： Simon Joshua Jacobs

IPC: B05D001/02

CPC classification number: B81C1/0096 ,  B05D1/60 ,  B05D5/083 ,  B81B3/0005 ,  B81C2201/0181 ,  B81C2201/112

Abstract: A method and apparatus for delivering a fine mist of a lubricant to a micromechanical device. A mixture 402 of a lubricant and a diluent carrier fluid is held in a supply reservoir 404. The mixture is forced through a nebulizer tip 406 to produce a fine aerosol. A particle selector 408 removes large droplets from the aerosol as the aerosol passes. The aerosol travels a distance through a delivery conduit 410 while the diluent carrier fluid evaporates from the nebulized droplets. The evaporation removes the vast majority of the diluent carrier fluid from the droplets, greatly reducing the size of the lubricant droplets. The evaporated aerosol enters a deposition chamber 412 and is deposited on a micromechanical device 414. The micromechanical devices may be lubricated in wafer form, in which case the lubricant aerosol will lubricate an entire wafer of micromechanical devices at one time. One embodiment produces an aerosol having a mean droplet size of less than 10 microns. Evaporation of the diluent carrier fluid reduces this droplet size to 10-500 nm by the time the lubricant is deposited on the micromechanical devices. The preceding abstract is submitted with the understanding that it only will be used to assist in determining, from a cursory inspection, the nature and gist of the technical disclosure as described in 37 C.F.R. null 1.72(b). In no case should this abstract be used for interpreting the scope of any patent claims.

Abstract translation: 一种用于将微细油雾润滑剂输送到微机械装置的方法和装置。 润滑剂和稀释剂载体流体的混合物402被保持在供应容器404中。混合物被迫通过雾化器尖端406以产生细小的气溶胶。 颗粒选择器408随着气溶胶通过而从气溶胶中去除大​​的液滴。 气雾剂通过输送管道410行进一段距离，同时稀释剂载体流体从喷雾的液滴中蒸发。 蒸发从液滴中除去大部分稀释剂载体流体，大大减小了润滑剂液滴的尺寸。 蒸发的气溶胶进入沉积室412并沉积在微机械装置414上。微机械装置可以以晶片形式润滑，在这种情况下，润滑剂气溶胶将一次润滑整个微机械装置的晶片。 一个实施例产生具有小于10微米的平均液滴尺寸的气溶胶。 润滑剂沉积在微机械装置上时，稀释剂载体流体的蒸发将该液滴尺寸减小到10-500nm。 提交上述摘要的理解是，它只会用于协助从粗略检查中确定37 C.F.R.描述的技术披露的性质和要点。 §1.72（b）。 在任何情况下，本摘要不得用于解释任何专利权利要求的范围。