Abstract:
This scintillator plate 1 is a scintillator plate which is a member of a flat plate shape to emit scintillation light according to incidence of radiation transmitted by an object A and which is used in an image acquisition device to condense and image the scintillation light, the scintillator plate comprising: a partition plate 2 of a planar shape which transmits radiation; a scintillator 3 of a flat plate shape which is arranged on one surface 2a of the partition plate 2 and which converts the radiation into scintillation light; and a scintillator 4 of a flat plate shape which is arranged on the other surface 2b of the partition plate 2 and which converts the radiation into scintillation light.
Abstract:
This scintillator plate 1 is a scintillator plate which is a member of a flat plate shape to emit scintillation light according to incidence of radiation transmitted by an object A and which is used in an image acquisition device to condense and image the scintillation light, the scintillator plate comprising: a partition plate 2 of a planar shape which transmits radiation; a scintillator 3 of a flat plate shape which is arranged on one surface 2a of the partition plate 2 and which converts the radiation into scintillation light; and a scintillator 4 of a flat plate shape which is arranged on the other surface 2b of the partition plate 2 and which converts the radiation into scintillation light.
Abstract:
A method is disclosed for in-situ monitoring of an EUV mirror to determine a degree of optical degradation. The method may comprise the steps/acts of irradiating at least a portion of the mirror with light having a wavelength outside the EUV spectrum, measuring at least a portion of the light after the light has reflected from the mirror, and using the measurement and a pre-determined relationship between mirror degradation and light reflectivity to estimate a degree of multi-layer mirror degradation. Also disclosed is a method for preparing a near-normal incidence, EUV mirror which may comprise the steps/acts of providing a metallic substrate, diamond turning a surface of the substrate, depositing at least one intermediate material overlying the surface using a physical vapor deposition technique, and depositing a multi-layer mirror coating overlying the intermediate material.
Abstract:
A deflection mirror (1, 501, etc.) for a microlithography projection exposure apparatus for illuminating an object field in an object plane of the projection exposure apparatus (1067) using the deflection mirror with grazing incidence. This deflection mirror has a substrate (3, 503, etc.) and at least one layer system (5, 505, etc.), and during operation light impinges on said mirror at a multiplicity of angles of incidence, wherein the layer system is designed such that, for light having a wavelength of less than 30 nm, for an angle of incidence of between 55° and 70°, the variation of the reflectivity is less than 20%, in particular less than 12%.
Abstract:
A projection lens of an EUV-lithographic projection exposure system with at least two reflective optical elements each comprising a body and a reflective surface for projecting an object field on a reticle onto an image field on a substrate if the projection lens is exposed with an exposure power of EUV light, wherein the bodies of at least two reflective optical elements comprise a material with a temperature dependent coefficient of thermal expansion which is zero at respective zero cross temperatures, and wherein the absolute value of the difference between the zero cross temperatures is more than 6K.
Abstract:
An optical arrangement, e.g. a projection exposure apparatus (1) for EUV lithography, includes: a housing (2) enclosing an interior space (15); at least one, preferably reflective optical element (4-10, 12, 14.1-14.6) arranged in the housing (2); at least one vacuum generating unit (3) for the interior space (15) of the housing (2); and at least one vacuum housing (18, 18.1-18.10) arranged in the interior space (15) and enclosing at least the optical surface (17, 17.1, 17.2) of the optical element (4-10, 12, 14.1-14.5). A contamination reduction unit is associated with the vacuum housing (18.1-18.10) and reduces the partial pressure of contaminating substances, in particular of water and/or hydrocarbons, at least in close proximity to the optical surface (17, 17.1, 17.2) in relation to the partial pressure of the contaminating substances in the interior space (15).
Abstract:
The present disclosure relates to an apparatus for alignment of multilayer film mirrors for a monochromatic X-ray generator and an X-ray image detecting method using the same. The apparatus for alignment of multilayer film mirrors for a monochromatic X-ray generator includes a collimator disposed between an X-ray generating unit and a detector and aligning them and limiting the radiation direction of X-ray to provide an optimum incident angle to multilayer film mirrors generating the monochromatic X-ray from the X-ray.
Abstract:
Provided is an X-ray mirror, a method of producing the X-rat mirror, and an X-ray apparatus. The X-ray mirror comprises: a substrate; and an X-ray reflecting structure formed of multiple regions present on the substrate, in which the X-ray reflecting structure comprises a mesostructured film that has the multiple regions having different structural periods in a normal direction of the substrate. Thus, there can be reduced the absorption loss of an X-ray of the mirror that reflects X-rays having different energies.
Abstract:
A multilayer mirror constructed to reflect radiation having a wavelength in the range of 6.4 nm to 7.2 nm. The multilayer mirror has alternating layers, including a first layer and a second layer. The first and second layers are selected from the group consisting of: U, or a compound or nitride thereof, and B4C layers; Th, or a compound or nitride thereof, and B4C layers; La, or a compound or nitride thereof, and B9C layers; La, or a compound or nitride thereof, and B4C layers; U, or a compound or nitride thereof, and B9C layers; Th, or a compound or nitride thereof, and B9C layers; La, or a compound or nitride thereof, and B layers; U, or a compound or nitride thereof, and B layers; C, or a compound or nitride thereof, and B layers; Th, or a compound or nitride thereof, and B layers.
Abstract:
An apparatus for measuring an image of a pattern to be formed on a semiconductor by scanning the pattern using a scanner, the apparatus including an EUV mask including the pattern, a zoneplate lens on a first side of the EUV mask and adapted to focus EUV light on a portion of the EUV mask at a same angle as an angle at which the scanner will be disposed with respect to a normal line of the EUV mask, and a detector arranged on another side of the EUV mask and adapted to sense energy of the EUV light from the EUV mask, wherein NAzoneplate=NAscanner/n and NAdetector=NAscanner/n*σ, where NAzoneplate denotes a NA of the zoneplate lens, NAdetector denotes a NA of the detector, and NAscanner denotes a NA of the scanner, σ denotes an off-axis degree of the scanner, and n denotes a reduction magnification of the scanner.