公开(公告)号：US20160264813A1

公开(公告)日：2016-09-15

申请号：US14405541

申请日：2014-03-07

Applicant: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.

Inventor： Tomoaki SAWADA ,  Takatoshi ABE ,  Shingo YOSHIOKA

IPC: C09D163/00

CPC classification number: H05K1/0271 ,  B32B3/12 ,  B32B3/266 ,  B32B5/02 ,  B32B15/08 ,  B32B15/092 ,  B32B2260/021 ,  B32B2260/046 ,  B32B2262/103 ,  B32B2262/106 ,  B32B2262/14 ,  B32B2307/202 ,  B32B2307/412 ,  B32B2307/50 ,  B32B2363/00 ,  C08J5/18 ,  C08J7/047 ,  C08J2300/21 ,  C08J2367/02 ,  C08J2400/21 ,  C08J2463/00 ,  C08K7/02 ,  C08L101/00 ,  C09D105/16 ,  C09D163/00 ,  G06F3/041 ,  H01B1/02 ,  H01B1/24 ,  H01L31/022466 ,  H01L31/022491 ,  H05K1/0213 ,  H05K1/0274 ,  H05K1/028 ,  H05K1/0296 ,  H05K1/0326 ,  H05K1/0333 ,  H05K1/0366 ,  H05K2201/0108 ,  H05K2201/012 ,  H05K2201/0323 ,  H05K2201/0326 ,  Y10T428/24331 ,  Y10T428/24917 ,  C08L63/00

Abstract: The present invention is a resin composition characterized by being able to undergo elastic deformation, having little residual strain rate and exhibiting stress relaxation properties. More specifically, the present invention relates to a resin composition wherein the stress relaxation rate (R) and the residual strain rate α, as measured in a prescribed extension-restoration test, are as follows: 20%≦R≦95% and 0%≦α≦3%.

Abstract translation: 本发明是一种树脂组合物，其特征在于能够进行弹性变形，几乎没有残余应变率和显示应力松弛性能。 更具体地说，本发明涉及一种树脂组合物，其中在规定的延伸恢复试验中测量的应力松弛率（R）和残余应变率α如下：20％≤R≤95％和0％ ≤α≤3％。

公开(公告)号：US20160244602A1

公开(公告)日：2016-08-25

申请号：US15027374

申请日：2014-06-10

Applicant: Shengyi Technology Co., Ltd.

Inventor： Jiang YOU

IPC: C08L63/00 ,  H05K1/03 ,  C08G59/50 ,  C08L79/02 ,  C08J5/24

CPC classification number: C08L63/00 ,  B32B27/38 ,  B32B27/42 ,  B32B2260/021 ,  B32B2260/023 ,  B32B2260/046 ,  B32B2262/101 ,  B32B2264/102 ,  B32B2264/104 ,  B32B2307/204 ,  B32B2307/306 ,  B32B2307/3065 ,  B32B2307/714 ,  B32B2307/726 ,  B32B2307/7265 ,  B32B2307/734 ,  B32B2457/08 ,  C08G14/06 ,  C08G59/3218 ,  C08G59/5073 ,  C08G59/621 ,  C08G59/686 ,  C08J5/24 ,  C08J2363/00 ,  C08J2379/02 ,  C08J2379/04 ,  C08J2461/06 ,  C08J2463/00 ,  C08J2479/02 ,  C08J2479/04 ,  C08K3/22 ,  C08K3/34 ,  C08K3/40 ,  C08K5/0066 ,  C08K5/49 ,  C08L61/04 ,  C08L61/06 ,  C08L61/34 ,  C08L63/04 ,  C08L79/02 ,  C08L79/04 ,  C08L79/06 ,  C08L2201/02 ,  C08L2201/22 ,  C08L2203/20 ,  C08L2205/03 ,  H05K1/0373 ,  H05K2201/012 ,  H05K2201/015

Abstract: The technology discloses a halogen-free resin composition and a prepreg and a laminate used for a printed circuit. The resin composition comprises: alkyl phenol epoxy resin; benzoxazine resin, alkyl phenol novolac curing agent, and phosphorus-containing flame retardant. The alkyl phenol epoxy resin has many alkyl branched chains in its molecular structure, making the composition have excellent dielectric properties, a higher glass transition temperature, low water absorption, and good heat resistance. Mixing benzoxazine resin into the composition can further reduce dielectric constant, dielectric loss value and water absorption of the cured product. With an alkyl phenol novolac curing agent, the molecular structure will have many alkyls, excellent dielectric properties and low water absorption. A prepreg and a laminate used for printed circuit prepared using the resin composition have low dielectric constants, dielectric loss factors, and water absorption, high dimensional stability, high thermal resistance and good flame retardancy, processability and chemical resistance.

Abstract translation: 该技术公开了一种无卤树脂组合物和用于印刷电路的预浸料和层压材料。 树脂组合物包括：烷基酚环氧树脂; 苯并恶嗪树脂，烷基苯酚酚醛清漆固化剂和含磷阻燃剂。 烷基酚环氧树脂在其分子结构中具有许多烷基支链，使得组合物具有优异的介电性能，较高的玻璃化转变温度，低吸水率和良好的耐热性。 将苯并恶嗪树脂混合到组合物中可以进一步降低固化产物的介电常数，介电损耗值和吸水率。 使用烷基苯酚酚醛清漆固化剂，分子结构将具有许多烷基，介电性能优异和吸水率低。 用于使用该树脂组合物制备的印刷电路板的预浸料和层压材料具有低介电常数，介电损耗因子和吸水率，高尺寸稳定性，高耐热性，良好的阻燃性，加工性和耐化学性。

公开(公告)号：US20160237353A1

公开(公告)日：2016-08-18

申请号：US15142153

申请日：2016-04-29

Applicant: International Business Machines Corporation

Inventor： Dylan J. Boday ,  Joseph Kuczynski ,  Timothy C. Mauldin

IPC: C09K21/14 ,  H05K1/03 ,  H01R13/527 ,  C08G79/04

CPC classification number: C09K21/14 ,  C08G79/04 ,  C08G81/00 ,  C08K3/00 ,  C08K5/00 ,  C08K7/00 ,  H01R13/527 ,  H05K1/0373 ,  H05K2201/012

Abstract: A flame retardant block copolymer is prepared from renewable content. In an exemplary synthetic method, a bio-derived flame retardant block copolymer is prepared by a ring opening polymerization of a biobased cyclic ester and a phosphorus-containing polymer. In some embodiments, the biobased cyclic ester is lactide. In some embodiments, the phosphorus-containing polymer is a hydroxyl-telechelic flame retardant biopolymer prepared by a polycondensation reaction of a biobased diol (e.g., isosorbide) and a phosphorus-containing monomer (e.g., phenylphosphonic dichloride). In other embodiments, the phosphorus-containing polymer is synthesized from a dioxaphospholane monomer.

公开(公告)号：US20160234934A1

公开(公告)日：2016-08-11

申请号：US15130943

申请日：2016-04-16

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： TOSHIYUKI HIGASHIDA ,  HIDETSUGU MOTOBE ,  DAISUKE NII

IPC: H05K1/03 ,  H05K1/02 ,  C08J5/24 ,  B32B15/092 ,  C08L63/08 ,  C08G59/42

CPC classification number: H05K1/0353 ,  B32B5/02 ,  B32B15/082 ,  B32B15/092 ,  B32B15/14 ,  B32B15/20 ,  B32B27/18 ,  B32B27/20 ,  B32B27/302 ,  B32B2260/021 ,  B32B2260/046 ,  B32B2262/101 ,  B32B2264/102 ,  B32B2270/00 ,  B32B2307/20 ,  B32B2307/206 ,  B32B2307/30 ,  B32B2307/306 ,  B32B2307/3065 ,  B32B2307/50 ,  B32B2457/08 ,  C08G59/40 ,  C08G59/4261 ,  C08G59/4284 ,  C08J5/24 ,  C08J2363/08 ,  C08J2363/10 ,  C08J2435/06 ,  C08K5/09 ,  C08L25/08 ,  C08L63/00 ,  C08L63/08 ,  C08L2203/206 ,  H05K1/0296 ,  H05K1/03 ,  H05K1/0366 ,  H05K1/0373 ,  H05K3/022 ,  H05K2201/012

Abstract: Resin composition of the present disclosure includes: an epoxy resin; and a hardener, in which the hardener contains a styrene-maleic anhydride copolymer (SMA) and an anhydride having only one anhydride group in a molecule. An acid value of the SMA is in a range from 300 to 550, inclusive. A ratio of an anhydride equivalent number of the anhydride with respect to an epoxy group equivalent number of the epoxy resin is in a range from 0.05 to 0.5, inclusive. A ratio of the total number of the equivalent numbers of the anhydride groups of the anhydride and the SMA with respect to the epoxy group equivalent number is a range from 0.5 to 1.2, inclusive.

Abstract translation: 本公开的树脂组合物包括：环氧树脂; 和硬化剂，其中固化剂含有苯乙​​烯 - 马来酸酐共聚物（SMA）和在分子中仅具有一个酸酐基团的酸酐。 SMA的酸值在300〜550的范围内。 酐的酸酐当量数相对于环氧基当量数的环氧树脂的比例在0.05〜0.5的范围内。 酸酐和SMA的酸酐基的当量数相对于环氧基当量数的比例为0.5〜1.2的范围。

公开(公告)号：US20160234933A1

公开(公告)日：2016-08-11

申请号：US15023506

申请日：2014-11-24

Applicant: LG CHEM, LTD.

Inventor： Shin Hee JUN ,  Chee-Sung PARK ,  Jae Hyun KIM ,  Sang Yun JUNG ,  Cheol-Hee PARK ,  Han Nah JEONG

IPC: H05K1/03 ,  H05K3/00 ,  H01B1/22 ,  H05K3/10

CPC classification number: H05K1/0326 ,  C08K3/22 ,  C08K3/24 ,  C08K5/521 ,  C09D5/24 ,  C09D201/00 ,  H01B1/22 ,  H05K1/0373 ,  H05K3/0055 ,  H05K3/10 ,  H05K2201/012 ,  H05K2201/0129 ,  H05K2201/0145 ,  H05K2201/0158 ,  C08L69/00

Abstract: The present invention relates to a composition for forming a conductive pattern which is capable of forming a fine conductive pattern on a variety of polymeric resin products or resin layers by a simplified process, while imparting excellent flame retardancy to the resin products or resin layers, and a resin structure having the conductive pattern obtained using the composition. The composition for forming a conductive pattern includes: a polymer resin; a non-conductive metal compound including a first metal element and a second metal element, having a R3m or P63/mmc space group in crystal structure; and a flame retardant, wherein a metal nucleus including the first metal element, the second metal element or an ion thereof is formed from the non-conductive metal compound by the electromagnetic irradiation.

Abstract translation: 本发明涉及一种用于形成导电图案的组合物，其能够通过简化的工艺在各种聚合树脂产品或树脂层上形成精细的导电图案，同时赋予树脂产品或树脂层优异的阻燃性，以及 具有使用该组合物得到的导电图案的树脂结构体。 用于形成导电图案的组合物包括：聚合物树脂; 包括晶体结构中具有R3m或P63 / mmc空间群的第一金属元素和第二金属元素的非导电金属化合物; 和阻燃剂，其中通过电磁辐射由非导电金属化合物形成包括第一金属元素，第二金属元素或其离子的金属核。

公开(公告)号：US20160223167A1

公开(公告)日：2016-08-04

申请号：US14612885

申请日：2015-02-03

Applicant: CREE, INC.

Inventor： Kurt Wilcox ,  Mark Dixon ,  Jason Taylor

IPC: F21V15/015 ,  F21K99/00 ,  F21V23/00

CPC classification number: F21K9/90 ,  F21V25/12 ,  F21Y2115/10 ,  H05K3/28 ,  H05K2201/012 ,  H05K2201/10106

Abstract: An LED apparatus which includes (a) an electrical circuit board having an electrically-insulated substrate with conductive zones laminated thereon, (b) a selectively-applied dielectric layer, such as a solder-mask layer, deposited or otherwise adhered to portions of the circuit board, the dielectric layer having a thickness and material composition sufficient such that the fire and electrical enclosure requirements of UL8750, UL746E and UL746C are met, and (c) one or more LEDs connected to the circuit board at designated connection sites thereon.

Abstract translation: 一种LED装置，其包括：（a）具有层叠有导电区域的电绝缘基板的电路板，（b）选择性地施加的电介质层，例如焊接掩模层，其沉积或以其他方式粘附到 电介质层具有足够的厚度和材料组成，使得满足UL8750，UL746E和UL746C的防火和电气外壳要求，以及（c）在其上指定的连接位置处连接到电路板的一个或多个LED。

公开(公告)号：US20160160008A1

公开(公告)日：2016-06-09

申请号：US14731008

申请日：2015-06-04

Applicant: Elite Electronic Material (KunShan) Co., Ltd.

Inventor： Rongtao WANG ,  Chen-Yu HSIEH ,  Wenfeng LV ,  Wenjun TIAN ,  Yu GAO ,  Ningning JIA ,  Ziqian MA

IPC: C08K5/5397 ,  C08J5/24 ,  C08K5/14 ,  C08J5/18

CPC classification number: C08K5/5397 ,  C08J5/18 ,  C08J5/24 ,  C08J2325/08 ,  C08K5/14 ,  H05K1/0326 ,  H05K2201/012

Abstract: A low dissipation factor resin composition comprises the following components: (A) an aromatic tetrafunctional vinylbenzyl monomer, its prepolymer or a combination thereof, the aromatic tetrafunctional vinylbenzyl monomer having a structure shown below; (B) flame retardant; and (C) peroxide.

Abstract translation: 低耗散因子树脂组合物包含以下组分：（A）芳族四官能乙烯基苄基单体，其预聚物或其组合，具有如下结构的芳族四官能乙烯基苄基单体; （B）阻燃剂; 和（C）过氧化物。

公开(公告)号：US09303047B2

公开(公告)日：2016-04-05

申请号：US14512491

申请日：2014-10-13

Applicant: International Business Machines Corporation

Inventor： Dylan J. Boday ,  Joseph Kuczynski ,  Robert E. Meyer, III

IPC: C07F7/10 ,  C07F7/12 ,  H05K1/03 ,  C07F7/18 ,  C07F7/08 ,  C08K5/5419 ,  C08K5/5465 ,  C08K3/00

CPC classification number: C07F7/0878 ,  C07F7/081 ,  C07F7/0889 ,  C07F7/0896 ,  C07F7/10 ,  C07F7/1804 ,  C08K3/016 ,  C08K5/5419 ,  C08K5/5465 ,  C08K9/06 ,  H05K1/0373 ,  H05K2201/012 ,  H05K2201/0209

Abstract: A flame retardant filler having brominated silica particles, for example, imparts flame retardancy to manufactured articles such as printed circuit boards (PCBs), connectors, and other articles of manufacture that employ thermosetting plastics or thermoplastics. In this example, brominated silica particles serve both as a filler for rheology control (viscosity, flow, etc.) and a flame retardant. In an exemplary application, a PCB laminate stack-up includes conductive planes separated from each other by a dielectric material that includes a flame retardant filler comprised of brominated silica particles. In an exemplary method of synthesizing the brominated silica particles, a monomer having a brominated aromatic functional group is reacted with functionalized silica particles (e.g., isocyanate, vinyl, amine, or epoxy functionalized silica particles). Alternatively, a monomer having a brominated aromatic functional group may be reacted with a silane to produce a brominated alkoxysilane monomer, which is then reacted with the surface of silica particles.

Abstract translation: 具有溴化二氧化硅颗粒的阻燃填料例如赋予制造品例如印刷电路板（PCB），连接器以及使用热塑性塑料或热塑性塑料的其它制品的阻燃性。 在该实施例中，溴化二氧化硅颗粒既用作流变控制（粘度，流动等）和阻燃剂的填料。 在示例性应用中，PCB叠层叠层包括通过包含由溴化二氧化硅颗粒构成的阻燃填料的介电材料彼此分离的导电平面。 在合成溴化二氧化硅颗粒的示例性方法中，具有溴化芳族官能团的单体与官能化二氧化硅颗粒（例如异氰酸酯，乙烯基，胺或环氧官能化二氧化硅颗粒）反应。 或者，具有溴化芳族官能团的单体可以与硅烷反应生成溴化烷氧基硅烷单体，然后与二氧化硅颗粒的表面反应。

公开(公告)号：US09288904B2

公开(公告)日：2016-03-15

申请号：US13739666

申请日：2013-01-11

Applicant: ELITE ELECTRONIC MATERIAL (KUNSHAN) CO., LTD.

Inventor： Rong-Tao Wang ,  Li-Ming Chou ,  Li-Chih Yu ,  Yu-Te Lin

IPC: B32B27/38 ,  H05K1/03 ,  C08L63/00 ,  C08G59/50 ,  C08J5/24

CPC classification number: H05K1/0353 ,  C08G59/5033 ,  C08J5/24 ,  C08J2363/00 ,  C08L63/00 ,  H05K2201/012 ,  Y10T428/24917 ,  Y10T428/31529

Abstract: A halogen-free resin composition includes (A) 100 parts by weight of epoxy resin; (B) 10 to 100 parts by weight of benzoxazine resin; (C) 5 to 50 parts by weight of diallylbisphenol A resin; and (D) 0.05 to 20 parts by weight of an amine curing agent. The halogen-free resin composition includes specific ingredients and proportions thereof to attain low dielectric constant (Dk), low dissipation factor (Df), high heat resistance, and high flame retardation. The halogen-free resin composition is suitable for producing a prepreg or a resin film and thus applicable to copper clad laminates and printed circuit boards.

Abstract translation: 无卤树脂组合物包含（A）100重量份环氧树脂; （B）10〜100重量份苯并恶嗪树脂; （C）5〜50重量份的二烯丙基双酚A树脂; 和（D）0.05〜20重量份的胺固化剂。 无卤树脂组合物包括具有低介电常数（Dk），低耗散因数（Df），高耐热性和高阻燃性的特定成分和比例。 无卤素树脂组合物适用于制备预浸料或树脂膜，因此适用于覆铜层压板和印刷电路板。

公开(公告)号：US20160021740A1

公开(公告)日：2016-01-21

申请号：US14793639

申请日：2015-07-07

Applicant: Elite Electronic Material (Zhong Shan) Co., Ltd.

Inventor： Changyuan LI ,  Chen-Yu HSIEH ,  Hao CHEN ,  Lianhui CAI ,  Xiangnan LI

IPC: H05K1/03 ,  H05K1/05 ,  C08K5/54 ,  C08K5/5397 ,  C08K5/5313

CPC classification number: H05K1/0373 ,  B32B5/00 ,  B32B5/02 ,  B32B15/00 ,  B32B15/08 ,  B32B15/14 ,  B32B15/20 ,  B32B27/00 ,  B32B27/12 ,  B32B27/20 ,  B32B27/302 ,  B32B27/32 ,  B32B2255/06 ,  B32B2255/26 ,  B32B2260/021 ,  B32B2260/046 ,  B32B2264/10 ,  B32B2274/00 ,  B32B2307/204 ,  B32B2307/30 ,  B32B2307/3065 ,  B32B2457/08 ,  C08K5/5313 ,  C08K5/5397 ,  C08K5/5406 ,  C08L1/00 ,  H05K1/024 ,  H05K1/0326 ,  H05K3/4688 ,  H05K2201/012 ,  H05K2201/0195

Abstract: The invention belongs to the technical field of low dielectric resin compositions, and discloses a low dielectric resin composition with phosphorus-containing flame retardant and a prepreg, resin film, laminate and printed circuit board prepared therefrom. The composition comprises the following components: (A) phosphorus-containing flame retardant; (B) vinyl compound. The phosphorus-containing flame retardant has a structure as shown in formula (I). In the present invention, diphenylphosphine oxide is derivatized, and prepared a phosphorus-containing flame retardant, which has no reactive functional groups, has better dielectric properties, and has high melting point, and upon combining with a vinyl compound, a resin composition is obtained, and a laminate having low thermal expansion ratio, high heat resistance, high glass transition temperature, and low dielectric constant and dissipation factor, can be made from the resin composition, and can effectively achieve the flame resistance effect of UL94 V-0 without using halogen-containing flame retardant, and can be used in the preparation of prepregs, resin films, resin coated coppers, flexible resin coated coppers, laminates and printed circuit boards.

Abstract translation: 本发明属于低介电树脂组合物的技术领域，并公开了一种由含磷阻燃剂制成的低介电树脂组合物和由其制备的预浸料，树脂膜，层压板和印刷电路板。 该组合物包含以下组分：（A）含磷阻燃剂; （B）乙烯基化合物。 含磷阻燃剂具有式（I）所示的结构。 在本发明中，二苯基氧化膦被衍生化，制备不含反应性官能团的含磷阻燃剂具有更好的介电性能，并且具有高熔点，与乙烯基化合物组合时，得到树脂组合物 ，并且可以从树脂组合物制造具有低热膨胀率，高耐热性，高玻璃化转变温度和低介电常数和耗散因子的层压体，并且可以有效地实现UL94 V-0的阻燃效果，而不使用 含卤素阻燃剂，可用于制备预浸料，树脂膜，树脂涂布铜，柔性树脂涂布铜板，层压板和印刷电路板。