公开(公告)号：US08915489B2

公开(公告)日：2014-12-23

申请号：US13859171

申请日：2013-04-09

Applicant: Cicor Management AG

Inventor： Ernst Feurer ,  Bruno Holli ,  Alexander Kaiser ,  Karin Ruess

IPC: H01L21/687 ,  H05K3/00

CPC classification number: H05K3/00 ,  H05K3/007 ,  H05K2201/0154 ,  H05K2203/0169 ,  H05K2203/0271 ,  Y10S269/90 ,  Y10S269/903

Abstract: A method is specified for the production of a flexible circuit configuration, which allows the manufacturing of such flexible circuits on a carrier film cost-effectively and with high precision. For this purpose, the carrier film is fastened at the beginning of the method on a rigid frame, which encloses an inner area, and spans the inner area using an inner surface. After finishing of a layer structure and optionally additional method steps, structures for flexible circuit configurations which are created over the inner surface may be cut out easily by cutting the flexible circuit configurations out of the inner surface as a cutout. Through the fastening of the carrier film on the frame, it is ensured during the various method steps of the production of the flexible circuit configuration that the carrier film, which is flexible per se, always forms a level foundation for the various method measures, in particular the photolithographic structuring of layers of a layer structure.

Abstract translation: 规定了用于生产柔性电路配置的方法，其允许以高精度和高精度地在载体膜上制造这种柔性电路。 为此目的，载体膜在方法开始时被紧固在刚性框架上，刚性框架包围内部区域，并且使用内表面跨越内部区域。 在完成层结构和可选地附加的方法步骤之后，可以通过将柔性电路配置从内表面切割为切口来容易地切割在内表面上形成的用于柔性电路配置的结构。 通过将载体膜紧固在框架上，在制造柔性电路结构的各种方法步骤期间确保了柔性本身的载体膜总是形成用于各种方法措施的水平基础 特别是层结构的层的光刻结构。

公开(公告)号：US08853723B2

公开(公告)日：2014-10-07

申请号：US13150556

申请日：2011-06-01

Applicant: Christopher Dennis Simone ,  Thomas Edward Carney

Inventor： Christopher Dennis Simone ,  Thomas Edward Carney

IPC: H01L33/48 ,  H01L33/60

CPC classification number: H05K1/0346 ,  C08G73/1039 ,  C08K3/22 ,  H01L33/505 ,  H01L33/60 ,  H01L33/641 ,  H05K1/0373 ,  H05K3/285 ,  H05K2201/0154 ,  H05K2201/2054 ,  Y10T428/25 ,  Y10T428/256 ,  Y10T428/31721

Abstract: The present disclosure relates generally to a light emitting diode assembly and a thermal control blanket. The light emitting diode assembly and the thermal control blanket have advantageous reflective and thermal properties.

Abstract translation: 本公开一般涉及发光二极管组件和热控制毯。 发光二极管组件和热控制毯具有有利的反射和热性能。

公开(公告)号：US08853559B2

公开(公告)日：2014-10-07

申请号：US13388450

申请日：2010-02-24

Applicant: Hironori Matsumoto ,  Jumpei Kusukawa

Inventor： Hironori Matsumoto ,  Jumpei Kusukawa

IPC: H05K1/11 ,  H01L23/62 ,  H01L25/18 ,  H05K1/02 ,  H01L23/64 ,  H01L23/14 ,  H01L25/07 ,  H05K1/05 ,  H05K1/03 ,  H05K7/00 ,  H05K1/18 ,  H01L23/498

CPC classification number: H05K1/056 ,  H01L23/142 ,  H01L23/49844 ,  H01L23/62 ,  H01L23/647 ,  H01L25/072 ,  H01L25/18 ,  H01L2924/0002 ,  H01L2924/09701 ,  H01L2924/12044 ,  H05K1/0204 ,  H05K1/0256 ,  H05K1/0257 ,  H05K1/0262 ,  H05K1/053 ,  H05K2201/0154 ,  H05K2201/0162 ,  H05K2201/0209 ,  H05K2201/0761 ,  H05K2201/09781 ,  H05K2201/10022 ,  H01L2924/00

Abstract: The invention relates to a high-voltage insulation circuit board which is used in an electric power apparatus such as an electric power converter or the like such as power semiconductor device, inverter module, or the like and provides an insulation circuit board in which electric field concentration at the end sections of a wiring pattern is reduced, partial discharging is suppressed, and a reliability is high. According to the invention, there is provided an insulation circuit board having: a metal base substrate; and wiring patterns which are formed onto at least one of the surfaces of the metal base substrate through an insulation layer, characterized in that between two adjacent wiring patterns in which an electric potential difference exists among the wiring patterns, at least one or more wiring patterns or conductors which are in contact with the insulation layer and have an electric potential in a range of the electric potential difference between the adjacent wiring patterns are arranged. According to the invention, the electric field concentration at the end sections of the wiring pattern to which a high voltage is applied is reduced and partial-discharge-resistant characteristics are improved.

Abstract translation: 本发明涉及一种用于诸如功率半导体器件，逆变器模块等的电力转换器等的电力设备中使用的高压绝缘电路板，​​并且提供了一种绝缘电路板，​​其中电场 在布线图案的端部处的浓度降低，部分放电被抑制，可靠性高。 根据本发明，提供了一种绝缘电路板，​​其具有：金属基底; 以及通过绝缘层形成在金属基底基板的至少一个表面上的布线图案，其特征在于，在布线图案之间存在电位差的两个相邻布线图案之间，至少一个或多个布线图案 或与绝缘层接触并且在相邻布线图案之间的电位差范围内具有电位的导体。 根据本发明，施加高电压的布线图案的端部处的电场浓度降低，并且提高耐局部放电特性。

公开(公告)号：US08796411B2

公开(公告)日：2014-08-05

申请号：US12918312

申请日：2009-01-26

Applicant: Yuichi Kaneya ,  Yumiko Arakawa ,  Keiko Suzuki

Inventor： Yuichi Kaneya ,  Yumiko Arakawa ,  Keiko Suzuki

IPC: C08G73/00

CPC classification number: H05K1/0346 ,  C08G73/1039 ,  C08G73/1042 ,  C08G73/1075 ,  C08J5/18 ,  C08J2379/08 ,  C08L79/08 ,  H05K2201/0154

Abstract: The polyimide precursor composition of the present invention is characterized in comprising a polyimide precursor having a structure formed by reacting a diamine component (A) containing a fluorine-containing aromatic diamine (a1) represented by the following chemical formula (I) (in the formula (I), R1 and R2 are each independently selected from —H, —(CF2)n—CF3, and —O(CF2)n—CF3 (n is an integer of 0 or more and 7 or less), and at least one of R1 and R2 is a fluorine-containing group) and trans-1,4-cyclohexyldiamine (a2) with an acid dianhydride component (B) containing an aliphatic tetracarboxylic dianhydride (b1) and an aromatic tetracarboxylic dianhydride (b2). Use of the composition of the present invention provides a polyimide film and a transparent flexible film having high transparency, low thermal expansion properties, low birefringent properties, and high heat resistance.

Abstract translation: 本发明的聚酰亚胺前体组合物的特征在于，具有通过使含有下述化学式（I）所示的含氟芳香族二胺（a1）的二胺成分（A）（式 （I）中，R 1和R 2各自独立地选自-H， - （CF 2）n -CF 3和-O（CF 2）n -CF 3（n为0以上且7以下的整数），至少 R1和R2之一是含氟基团）和反式-1,4-环己基二胺（a2）与含有脂族四羧酸二酐（b1）和芳族四羧酸二酐（b2）的酸二酐组分（B）。 使用本发明的组合物提供了具有高透明度，低热膨胀性，低双折射性和低耐热性的聚酰亚胺膜和透明柔性膜。

公开(公告)号：US08771496B2

公开(公告)日：2014-07-08

申请号：US12227330

申请日：2006-05-17

Applicant: Eiji Nagata ,  Hiroyuki Ishii

Inventor： Eiji Nagata ,  Hiroyuki Ishii

IPC: C23C28/02 ,  C23C18/31 ,  C25D7/00 ,  B32B15/08 ,  B32B15/20 ,  B32B27/06

CPC classification number: H05K1/036 ,  B32B15/08 ,  B32B27/28 ,  B32B27/34 ,  B32B2274/00 ,  B32B2457/08 ,  C23C18/1653 ,  C23C18/2066 ,  C23C18/31 ,  C23C28/00 ,  C25D7/00 ,  H05K1/0346 ,  H05K1/0393 ,  H05K3/181 ,  H05K2201/0129 ,  H05K2201/0154 ,  Y10T428/264 ,  Y10T428/265 ,  Y10T428/269 ,  Y10T428/31681

Abstract: A metal composite film having an excellent heat resistance and adhesion, suited for flexible printed circuit boards capable of forming fine wirings, as well as a production process thereof, is disclosed. The metal composite film comprises an insulating film; a thermoplastic polyimide layer(s) formed on at least one surface of the insulating film; and metal layers formed on the surface of each of the thermoplastic polyimide layer(s), which metal layers are formed by electroless plating and then by electrolytic plating, respectively. Since this metal composite film has an excellent heat resistance and adhesion, and maintains the excellent adhesion after forming fine wirings, it is suitably used as a high density flexible printed circuit board having fine circuits.

Abstract translation: 公开了一种具有优异的耐热性和粘合性的金属复合膜，适用于能够形成细线的柔性印刷电路板及其制造方法。 金属复合膜包括绝缘膜; 形成在所述绝缘膜的至少一个表面上的热塑性聚酰亚胺层; 以及形成在每个热塑性聚酰亚胺层的表面上的金属层，该金属层分别通过无电镀形成，然后通过电解电镀形成。 由于该金属复合膜具有优异的耐热性和粘附性，并且在形成细线之后保持优异的粘附性，因此适合用作具有精细电路的高密度柔性印刷电路板。

公开(公告)号：US20140178571A1

公开(公告)日：2014-06-26

申请号：US14122797

申请日：2012-05-17

Applicant: Akimitsu Bamba ,  Kazuhisa Tsujimoto ,  Hideyuki Yamada ,  Kouichi Kugimiya

Inventor： Akimitsu Bamba ,  Kazuhisa Tsujimoto ,  Hideyuki Yamada ,  Kouichi Kugimiya

IPC: H05K3/18

CPC classification number: H05K3/182 ,  B05D1/28 ,  B05D5/12 ,  B05D7/52 ,  B41M1/30 ,  C23C18/1608 ,  C23C18/1651 ,  C23C18/2086 ,  C23C18/30 ,  C23C18/36 ,  C23C18/405 ,  H05K2201/0154 ,  H05K2203/0793

Abstract: The purpose of the present invention is to provide a method for using a metal ion solution of low concentration to efficiently form a metal film pattern of excellent accuracy and reliable adhesion on a resin substrate. A resin substrate having a metal film pattern formed thereon is produced by a method that includes the following steps (a) to (e): (a) a step for pattern-printing of a latent image agent (2) onto the surface of a resin substrate (1) ; (b) a step for bringing the area imprinted with the latent image agent (2) into contact with a solution containing metal ions, and forming a metal salt (3); (c) a step for bringing the metal salt (3) into contact with an acidic treatment liquid containing a reducing agent, and reducing the metal salt; (d) a step for forming an electroless nickel plating film (5) on the area imprinted with the latent image agent; and (e) a step for precipitating an electroless copper plating (6) onto the surface of the nickel plating film (5).

Abstract translation: 本发明的目的是提供一种使用低浓度的金属离子溶液来有效地形成在树脂基板上具有优异的精度和可靠的粘附性的金属膜图案的方法。 通过包括以下步骤（a）至（e）的方法制备其上形成有金属膜图案的树脂基板：（a）将潜像剂（2）图案印刷到表面上的步骤 树脂基板（1）; （b）使潜像剂（2）印刷的区域与含有金属离子的溶液接触并形成金属盐（3）的步骤; （c）使金属盐（3）与含有还原剂的酸性处理液接触并还原金属盐的工序; （d）在印有潜像剂的区域上形成化学镀镍膜（5）的步骤; 和（e）将化学镀铜（6）析出到镀镍膜（5）的表面上的步骤。

公开(公告)号：US20140172051A1

公开(公告)日：2014-06-19

申请号：US13794579

申请日：2013-03-11

Applicant: Satinderpall S. Pannu ,  Kedar G. Shah ,  Heeral Sheth ,  Sarah H. Felix ,  Angela C. Tooker

Inventor： Satinderpall S. Pannu ,  Kedar G. Shah ,  Heeral Sheth ,  Sarah H. Felix ,  Angela C. Tooker

IPC: A61N1/05

CPC classification number: A61N1/0551 ,  H05K1/118 ,  H05K3/4682 ,  H05K2201/0154 ,  H05K2203/016

Abstract: A microelectrode array having one or more electrical conduits surrounded and insulated from each other by only a single layer of polymer (e.g. polyimide), and a method of fabricating the same. Multiple layers of an uncured polymer precursor (such as polyamic acid) are separately formed with metal layers sandwiched in between. Formation of the uncured polymer precursor layers includes deposition and heating to remove solvent only but not polymerize the precursor. Upon completing construction, the array is subjected to a high-temperature curing process that converts the uncured polymer precursor layers into the polymer. The different layers of the polymer precursor are thus covalently bonded together during the curing process to create a single continuous layer (e.g. monolithic block) of polymer, with no polymer-polymer interfaces.

Abstract translation: 具有一个或多个电导管的微电极阵列及其制造方法，该微电极阵列仅通过单层聚合物（例如聚酰亚胺）包围和绝缘。 未固化的聚合物前体（例如聚酰胺酸）的多层分别由夹在其间的金属层形成。 未固化的聚合物前体层的形成包括沉积和加热以除去溶剂，但不聚合前体。 在完成构造后，对阵列进行高温固化，将未固化的聚合物前体层转化成聚合物。 因此，聚合物前体的不同层在固化过程中共价键合在一起，以形成聚合物的单一连续层（例如整体嵌段），而没有聚合物 - 聚合物界面。

公开(公告)号：US20140151095A1

公开(公告)日：2014-06-05

申请号：US14097036

申请日：2013-12-04

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Suk Hyeon Cho ,  Tae Hong Min ,  Seung Yeop Kook ,  Jung Han Lee ,  Hye Jin Kim

IPC: H05K1/03 ,  H05K3/42 ,  H05K3/28

CPC classification number: H05K1/0306 ,  H05K1/03 ,  H05K3/108 ,  H05K3/426 ,  H05K2201/0141 ,  H05K2201/0145 ,  H05K2201/0154 ,  H05K2201/0158 ,  H05K2201/0195 ,  H05K2201/0323 ,  H05K2201/09563 ,  Y10T29/49155 ,  Y10T29/49165

Abstract: Disclosed herein is a printed circuit board, including: a composite sheet including an insulating material and a glass plate bonded to the insulating material; and a circuit layer formed on the composite sheet.

Abstract translation: 这里公开了一种印刷电路板，包括：复合片，其包括绝缘材料和与绝缘材料接合的玻璃板; 以及形成在复合片上的电路层。

公开(公告)号：US20140144680A1

公开(公告)日：2014-05-29

申请号：US14086445

申请日：2013-11-21

Applicant: NITTO DENKO CORPORATION

Inventor： Tomoaki OKUNO ,  Saori KANEZAKI ,  Tsuyoshi OGURO ,  Takeshi KAWAKAMI

IPC: H05K3/44 ,  H05K1/05 ,  H05K1/02

CPC classification number: H05K1/0271 ,  G11B5/484 ,  G11B5/486 ,  H05K1/0281 ,  H05K1/05 ,  H05K1/056 ,  H05K1/09 ,  H05K1/117 ,  H05K2201/0154 ,  H05K2201/0394 ,  Y10T29/49155

Abstract: A method of producing a wired circuit board includes a first step of preparing a metal supporting layer, a second step of forming, on one side of the metal supporting layer in a thickness direction thereof, an insulating layer having a first opening, and a plurality of terminal formation portions, a third step of forming, on one side of the insulating layer in the thickness direction, a conductive layer having a plurality of terminal portions each corresponding to the plurality of terminal formation portions, a fourth step of partially removing the metal supporting layer to form a second opening and at least one reinforcing metal supporting portion placed between the plurality of terminal formation portions, and a fifth step of removing the plurality of terminal formation portions exposed from the second opening to expose both side surfaces of the plurality of terminal portions in the thickness direction.

Abstract translation: 制造布线电路基板的方法包括：制备金属支撑层的第一步骤，在金属支撑层的厚度方向的一侧上形成具有第一开口的绝缘层和多个第一开口的第二步骤 的第三步骤，在所述绝缘层的厚度方向的一侧形成具有多个端子部分的导电层，所述多个端子部分对应于所述多个端子形成部分，第四步骤，部分地去除所述金属 支撑层以形成第二开口和设置在所述多个端子形成部之间的至少一个加强金属支撑部，以及第五步骤，去除从所述第二开口露出的所述多个端子形成部，以暴露所述多个端子形成部的两个侧表面 端子部分在厚度方向上。

公开(公告)号：US20140048314A1

公开(公告)日：2014-02-20

申请号：US14113773

申请日：2012-04-26

Applicant: Masayoshi Kido ,  Yoshihide Sekito

Inventor： Masayoshi Kido ,  Yoshihide Sekito

IPC: H05K1/02

CPC classification number: H05K1/02 ,  C09J9/00 ,  H05K1/0281 ,  H05K1/189 ,  H05K3/0064 ,  H05K2201/0154 ,  H05K2201/0209 ,  H05K2201/2009

Abstract: A stiffener-integrated flexible printed circuit board includes: (A) a stiffener; (B) a thermosetting adhesive on the stiffener (A); (C) an insulator film on the thermosetting adhesive (B); and (D) a wiring-pattern-equipped film on the insulator film (C), the insulator film (C) containing at least (a) a binder polymer and (b) spherical organic beads. This provides a stiffener-integrated FPC which is excellent in adhesion between a thermosetting adhesive of a stiffener and an insulator film and which is small in warpage.

Abstract translation: 一种加强件集成的柔性印刷电路板包括：（A）加强件; （B）加强件（A）上的热固性粘合剂; （C）热固性粘合剂（B）上的绝缘膜; 和（D）绝缘体膜（C）上的布线图案膜，绝缘膜（C）至少含有（a）粘合剂聚合物和（b）球形有机珠粒。 这提供了一种加强件一体化的FPC，其在加强件的热固性粘合剂和绝缘膜之间的粘合性优异并且翘曲小。